公开(公告)号：US5496613A

公开(公告)日：1996-03-05

申请号：US157038

申请日：1993-12-02

Applicant: Erik Middelman ,  Pieter H. Zuuring

Inventor： Erik Middelman ,  Pieter H. Zuuring

IPC: B32B5/12 ,  B32B7/12 ,  H05K1/03 ,  H05K3/00 ,  B32B9/00

CPC classification number: H05K1/0366 ,  B32B5/12 ,  H05K1/036 ,  H05K2201/0236 ,  H05K2201/0287 ,  Y10T428/24058 ,  Y10T428/24124 ,  Y10T428/24917 ,  Y10T442/656

Abstract: A laminate, adapted to be used as a supporting board for a printed circuit, is disclosed which comprises layers of an electrically non-conductive matrix material reinforced with unidirectionally (UD) oriented fibers with the layers comprising individual matrix material having different directions of orientation. The layers are stacked to form a laminate of crossing layers, and the laminate has a core plane relative to which the crossing layers are in mirror image relationship so that the laminate has orthotropic properties. The laminate comprises layers of adhesive material present at least between any pair of layers of UD-reinforced matrix material having different directions of orientation.

Abstract translation: PCT No.PCT / EP92 / 01132 Sec。 371日期1993年12月2日第 102（e）日期1993年12月2日PCT提交1992年5月19日PCT公布。 WO92 / 22191 PCT出版物 公开了一种适于用作印刷电路的支撑板的层压板，其包括用单向（UD）定向纤维增强的非导电基体材料层，其中所述层包括单独的基体 材料具有不同的取向方向。 层叠以形成交叉层的层压体，并且层压体具有相对于其交叉层呈镜像关系的芯平面，使得层压体具有正交各向异性。 层压体包括至少存在于具有不同取向方向的任何一对UD增强基体材料层之间的粘合剂材料层。

公开(公告)号：US5110633A

公开(公告)日：1992-05-05

申请号：US570499

申请日：1990-08-21

Applicant: Robert Cassat ,  Jean-Pierre Logel

Inventor： Robert Cassat ,  Jean-Pierre Logel

IPC: C23C18/30 ,  C23C18/16 ,  C23C18/20 ,  C23C18/42 ,  C25D5/56 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18

CPC classification number: C23C18/206 ,  C23C18/2013 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/42 ,  H05K1/0373 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/105 ,  H05K3/181

Abstract: A process for coating a plastics article with a thin layer of noble metal, wherein said plastics article contains a finely particulate, homogenized filler selected from the group consisting of MnO, NiO, Cu.sub.2 O, SnO and Bi.sub.2 O.sub.3, and said plastics article is coated with an acid aqueous solution of a noble metal salt.

Abstract translation: 一种用贵金属薄层涂覆塑料制品的方法，其中所述塑料制品含有选自由MnO，NiO，Cu2O，SnO和Bi2O3组成的组的精细颗粒的均化填料，并且所述塑料制品涂覆有 酸性贵金属盐水溶液。

公开(公告)号：US3629185A

公开(公告)日：1971-12-21

申请号：US3629185D

申请日：1969-10-17

Applicant: KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD JOHN ,  MCCORMACK JOHN FRANCIS

IPC: B01J31/08 ,  B01J31/30 ,  B01J47/00 ,  C08K3/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42 ,  C08G51/04

CPC classification number: B01J31/30 ,  B01J31/08 ,  B01J47/016 ,  C08K3/013 ,  C23C18/1608 ,  H05K1/0373 ,  H05K3/28 ,  H05K3/422 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/09436 ,  C08L67/06

Abstract: THERE ARE PROVIDED MOLDING COMPOSITIONS COMPRISING PARTICLES OF RESIN HAVING INCORPORATED THEREWITH FILLERS CATALYTIC TO THE DEPOSITION OF ELECTROLESS METALS. THE CATALYTIC FILLERS ARE MADE BY REPLACING THE CATIONS IN PARTICULATE BASE EXCHANGEABLE MATERIALS WITH A CATION OF A METAL SELECTED FROM GROUPS 1 B AND 8 OF THE PERIODIC TABLE OF ELEMENTS. ARTICLES MOLDED FROM THE COMPOSITIONS AND THE WALLS OF HOLES DRILLED IN THEM ARE METALLIZED ON BEING IMMERSED IN ELECTROLESS METAL DEPOSITION BATHS.

公开(公告)号：US3600330A

公开(公告)日：1971-08-17

申请号：US3600330D

申请日：1967-01-03

Applicant: PHOTOCIRCUITS DIVISION OF KOLI

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD J ,  POLICHETTE JOSEPH

IPC: B01J37/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  D06Q1/04 ,  H01B3/30 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  C23C3/00

CPC classification number: H05K3/427 ,  B01J37/00 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40 ,  D06Q1/04 ,  H01B3/30 ,  H05K1/0373 ,  H05K3/108 ,  H05K3/181 ,  H05K3/422 ,  H05K3/428 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/122

Abstract: THERE ARE PROVIDED COMPOSITIONS TO RENDER INSULTING SUBSTRATES CATALYTIC TO ELECTROLESS METAL DEPOSITION COMPRISING MATERIALS, E.G., SOLID AGENTS, HAVING DEPOSITED THEREON A CATIONIC WETTING AGENT IN COMBINATION WITH AN ELEMENTAL FORM OF A METAL FROM GROUPS I-B AND VIII OF THE PERIODIC TABLE OF ELEMENTS, INCLUDING MIXTURES OF SUCH METALS.

公开(公告)号：US3347724A

公开(公告)日：1967-10-17

申请号：US39062364

申请日：1964-08-19

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE JR FREDERICK W ,  JOSEPH POLICHETTE ,  LEECH EDWARD J

IPC: C23C18/16 ,  H05K1/00 ,  H05K1/03 ,  H05K3/18

CPC classification number: H05K3/184 ,  C23C18/1605 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0236 ,  Y10T428/2944 ,  Y10T442/3407

公开(公告)号：US3322881A

公开(公告)日：1967-05-30

申请号：US39064664

申请日：1964-08-19

Applicant: SCHNEBLE JR FREDERICK W ,  JOSEPH POLICHETTE ,  LEECH EDWARD J

Inventor： SCHNEBLE JR FREDERICK W ,  JOSEPH POLICHETTE ,  LEECH EDWARD J

IPC: H05K3/18 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H05K3/182 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0236 ,  H05K2201/092 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K2203/1476

公开(公告)号：US09944768B2

公开(公告)日：2018-04-17

申请号：US14227271

申请日：2014-03-27

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan Cheng ,  Xiaofeng Yu ,  Yuxian An

IPC: H01B3/42 ,  H01B3/30 ,  H01B3/47 ,  C08K3/22 ,  C08K3/04 ,  C08K3/34 ,  C08K3/40 ,  C08L69/00 ,  H05K1/03 ,  H05K3/18 ,  C08K3/32 ,  C08K7/14 ,  C08K3/24

CPC classification number: C08K3/22 ,  C08K3/04 ,  C08K3/24 ,  C08K3/32 ,  C08K3/34 ,  C08K7/14 ,  C08K2003/2251 ,  C08K2003/328 ,  C08L69/00 ,  H01B3/305 ,  H01B3/426 ,  H01B3/47 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08L83/10

Abstract: The present disclosure relates to a polymer composition. The disclosed composition comprises a polycarbonate polymer, a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei, reinforcing filler, and a laser direct structuring synergist. Also disclosed is a method for making the disclosed polymer composition and an article of manufacture comprising the disclosed polymer composition.

公开(公告)号：US09859193B2

公开(公告)日：2018-01-02

申请号：US15600793

申请日：2017-05-22

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/495 ,  H01L23/60

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/053 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

公开(公告)号：US09801282B2

公开(公告)日：2017-10-24

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

公开(公告)号：US20170236614A1

公开(公告)日：2017-08-17

申请号：US15504268

申请日：2015-09-17

Applicant: LG CHEM, LTD.

Inventor： Shin Hee JUN ,  Dae Ki LEE ,  Se Hui SOHN ,  Han Nah JEONG ,  Cheol-Hee PARK ,  Chee-Sung PARK ,  Jae Hyun KIM ,  Ha Na LEE

IPC: H01B5/14 ,  H05K3/10 ,  H05K1/03 ,  C23C18/40 ,  C08L69/00 ,  C08J7/12 ,  C23C18/16 ,  C23C18/20 ,  H01B1/22 ,  C08K3/32

CPC classification number: H01B5/14 ,  C08J7/123 ,  C08J2369/00 ,  C08J2483/04 ,  C08K3/32 ,  C08K2003/328 ,  C08L69/00 ,  C08L2203/20 ,  C08L2205/06 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/405 ,  H01B1/026 ,  H01B1/22 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.