層間接続構造及びその形成方法
    131.
    发明申请
    層間接続構造及びその形成方法 审中-公开
    中间层连接结构及其建筑方法

    公开(公告)号:WO2003098984A1

    公开(公告)日:2003-11-27

    申请号:PCT/JP2002/013049

    申请日:2002-12-13

    Abstract: A method for building an interlayer connection structure where wiring layers (22) or metallic layers (27) formed on both sides of an insulating layer (26) are interlayer-connected through an interlayer connection projection (B), comprising the steps of stacking at least a sheet member (2) deformable concavely, a metallic layer forming member, and a thermally-adhesive insulating layer forming member in this order of mention between a press surface (1) and a body to be laminated and having the interlayer connection projection, conducting hot press of the stack using the press surface to produce a laminate having a projection in a position corresponding to the interlayer connection projection and having a metallic layer on its surface, removing the projection of the laminate to expose the interlayer connection projection, and electrically connecting the exposed interlayer connection projection and the metallic layer disposed near the interlayer connection projection with the insulating layer interposed therebetween, whereby the thickness of the insulating layer between layers can be uniformed, and the planarization of the surface and thickness control of the insulating layer can be effected even if the insulating layer contains reinforcing fibers. An interlayer connection structure built by the method and a multilayer wiring board are also disclosed.

    Abstract translation: 一种用于构建层间连接结构的方法,其中形成在绝缘层(26)两侧的布线层(22)或金属层(27)通过层间连接突起(B)层间连接,包括以下步骤: 按压表面(1)和待层压体之间具有层间连接突起的至少一个片状构件(2)可成形为可变形的金属层形成构件和热粘合绝缘层形成构件, 使用压制表面进行堆叠的热压,以产生具有在与层间连接突起相对应的位置的突起并且在其表面上具有金属层的层压体,去除层压体的突起以露出层间连接突起,并且电 将露出的层间连接突起和设置在层间连接突起附近的金属层与绝缘层1a连接 从而能够使层间的绝缘层的厚度均匀化,即使绝缘层含有增强纤维,也能够进行表面的平坦化和绝缘层的厚度控制。 还公开了通过该方法构建的层间连接结构和多层布线板。

    METHOD FOR PRODUCING MICRO-OPENINGS
    132.
    发明申请
    METHOD FOR PRODUCING MICRO-OPENINGS 审中-公开
    方法的微孔生产

    公开(公告)号:WO00013062A1

    公开(公告)日:2000-03-09

    申请号:PCT/CH1999/000016

    申请日:1999-01-14

    Abstract: The invention relates to a method for producing micro-openings in semi-finished products (300) for printed boards using prefabricated elements (200) consisting of several layers of electrically conductive materials (21, 22) and dielectrics (20). According to said method micro-openings are embossed in dielectrics and/or electrically conductive materials and the embossed micro-openings are cleaned using plasma or by means of wet-chemical methods.

    Abstract translation: 本发明涉及一种用于生产在半成品(300),用于印刷电路板的微孔的方法,使用Vorfabrikaten(200),其由导电材料制成的多个层(21,22)和电介质(20),所述微孔在电介质和/或在 导电材料被压花和压花微孔是由等离子体的手段或通过湿化学方法来清洗。

    A FLAT FLEXIBLE PRINTED CIRCUIT CONFORMABLE TO A CONTOURED SURFACE
    133.
    发明申请
    A FLAT FLEXIBLE PRINTED CIRCUIT CONFORMABLE TO A CONTOURED SURFACE 审中-公开
    平面柔性印刷电路与表面相适应

    公开(公告)号:WO99066770A1

    公开(公告)日:1999-12-23

    申请号:PCT/US1999/013501

    申请日:1999-06-15

    Abstract: The present invention comprises a printed circuit (30) having a three-dimensional surface capable of conforming to a contoured surface of a vehicle trim panel. Printed circuit (30) comprises a plurality of electrical conductors (34) and connectors (36) secured to a polymeric substrate (32). A convoluted region (58) of the printed circuit permits formation of the three-dimensional surface (60) in the printed circuit (30). The present invention further comprises a method of producing three-dimensional surface (60) and the printed circuit (30) by either thermoforming the printed circuit (30) or mechanically stretching the printed circuit (30) to produce the three-dimensional surface (60).

    Abstract translation: 本发明包括具有能够符合车辆装饰板的轮廓表面的三维表面的印刷电路(30)。 印刷电路(30)包括多个电导体(34)和固定到聚合物基底(32)上的连接器(36)。 印刷电路的卷积区域(58)允许在印刷电路(30)中形成三维表面(60)。 本发明还包括通过热成型印刷电路(30)或机械拉伸印刷电路(30)以产生三维表面(60)的三维表面(60)和印刷电路(30)的制造方法 )。

    LEITERPLATTE MIT SPEZIELLEN KUPPLUNGSBEREICHEN
    138.
    发明申请
    LEITERPLATTE MIT SPEZIELLEN KUPPLUNGSBEREICHEN 审中-公开
    与专用离合器地区电路板

    公开(公告)号:WO2015121325A1

    公开(公告)日:2015-08-20

    申请号:PCT/EP2015/052910

    申请日:2015-02-12

    Abstract: Leiterplatte 100, 100'; 200, 200' zur Aufnahme zumindest einer Leuchtdiode, umfassend: zumindest an einer Seite der Leiterplatte einen Isolationsbereich, der eine Luft- und Kriechstrecke 140, 140'; 240, 240' zwischen den auf der Leiterplatte 100, 100'; 200, 200' angeordneten Leiterbahnen 120, 120'; 220, 220' und dem Außenumfang der Leiterplatte 100, 100'; 200, 200' bereitstellt, wobei zumindest ein Isolationsbereich ein Feder-Nut-Mittel 150, 160, 150', 160'; 250, 260 aufweist, das mit einem korrespondierenden Feder-Nut-Mittel 150, 160, 150', 160'; 250, 260 einer weiteren Leiterplatte 100, 100'; 200, 200' derart in Eingriff bringbar ist, dass sich die jeweiligen Luft- und Kriechstrecken 140, 140'; 240, 240' zumindest teilweise überlappen.

    Abstract translation: 电路板100,100“; 200,200“用于接收至少一个发光二极管,包括:所述电路板的至少一侧的隔离区域,一个间隙和爬电距离140,140”; '之间的在电路板100,100' 240,240; 200,200 '设置的带状导体120,120'; 220,220“和电路板100,100的外周”; 200,200 '提供,其中至少一个隔离区,舌槽装置150,160,150',160“; 250,260提供了与相应的榫舌和凹槽装置150,160,150”,160' ; 250,另外的印刷电路板100,100“的260; 200,200“可以以这样的方式使各间隙和爬电距离140,140相接合”; 240,240“至少部分地重叠。

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