Abstract:
A method for building an interlayer connection structure where wiring layers (22) or metallic layers (27) formed on both sides of an insulating layer (26) are interlayer-connected through an interlayer connection projection (B), comprising the steps of stacking at least a sheet member (2) deformable concavely, a metallic layer forming member, and a thermally-adhesive insulating layer forming member in this order of mention between a press surface (1) and a body to be laminated and having the interlayer connection projection, conducting hot press of the stack using the press surface to produce a laminate having a projection in a position corresponding to the interlayer connection projection and having a metallic layer on its surface, removing the projection of the laminate to expose the interlayer connection projection, and electrically connecting the exposed interlayer connection projection and the metallic layer disposed near the interlayer connection projection with the insulating layer interposed therebetween, whereby the thickness of the insulating layer between layers can be uniformed, and the planarization of the surface and thickness control of the insulating layer can be effected even if the insulating layer contains reinforcing fibers. An interlayer connection structure built by the method and a multilayer wiring board are also disclosed.
Abstract:
The invention relates to a method for producing micro-openings in semi-finished products (300) for printed boards using prefabricated elements (200) consisting of several layers of electrically conductive materials (21, 22) and dielectrics (20). According to said method micro-openings are embossed in dielectrics and/or electrically conductive materials and the embossed micro-openings are cleaned using plasma or by means of wet-chemical methods.
Abstract:
The present invention comprises a printed circuit (30) having a three-dimensional surface capable of conforming to a contoured surface of a vehicle trim panel. Printed circuit (30) comprises a plurality of electrical conductors (34) and connectors (36) secured to a polymeric substrate (32). A convoluted region (58) of the printed circuit permits formation of the three-dimensional surface (60) in the printed circuit (30). The present invention further comprises a method of producing three-dimensional surface (60) and the printed circuit (30) by either thermoforming the printed circuit (30) or mechanically stretching the printed circuit (30) to produce the three-dimensional surface (60).
Abstract:
A method for making electrical connections between conductive contact pads separated by a dielectric separation layer (12) is disclosed. In the method of the present invention, a structural separation layer is provided that separates at least two aligned conductive contact pads (14a, 14b). The electrical connection between the contact pads (14a, 14b) is made by using a tool (20) to apply pressure, heat, mechanical vibration, or a combination thereof to one of the contact pads (14a). In this manner, a contact pad is deformed and pressed through the separation layer (12), thereby displacing the separation layer material between the contact pads (14a, 14b). In this manner, no prefabricated hole is required in the separation layer (12).
Abstract:
Method and apparatus (10) for forming power distribution systems or parts thereof during punching operations. A planar member (16) of conductive material is located proximate to a substrate (14) upon which the power distribution system or part thereof is to be formed. A punch (18) is used to form the conductors (12) from the planar member (16) and deposit the conductors (12) on the substrate (14). The action of the punch (18) causes mechanical interference between the conductor (12) and the substrate (14) thereby securing the conductor to the substrate. The power distribution system or part thereof may comprise a terminal assembly, an electric switch, a heat sink of an electronic module, or an electrical circuit board.
Abstract:
본 발명은 인쇄회로기판에 관한 것으로, 제1 영역, 상기 제1 영역으로부터 연장된 제2 영역, 상기 제1 영역과 상기 제2 영역의 사이에 형성되는 절곡부를 포함하는 기판; 상기 제1 영역 상의 발광 소자; 상기 절곡부에 형성된 적어도 하나 이상의 돌출부; 및 상기 돌출부 상에 형성된 배선;을 포함한다.
Abstract:
Leiterplatte 100, 100'; 200, 200' zur Aufnahme zumindest einer Leuchtdiode, umfassend: zumindest an einer Seite der Leiterplatte einen Isolationsbereich, der eine Luft- und Kriechstrecke 140, 140'; 240, 240' zwischen den auf der Leiterplatte 100, 100'; 200, 200' angeordneten Leiterbahnen 120, 120'; 220, 220' und dem Außenumfang der Leiterplatte 100, 100'; 200, 200' bereitstellt, wobei zumindest ein Isolationsbereich ein Feder-Nut-Mittel 150, 160, 150', 160'; 250, 260 aufweist, das mit einem korrespondierenden Feder-Nut-Mittel 150, 160, 150', 160'; 250, 260 einer weiteren Leiterplatte 100, 100'; 200, 200' derart in Eingriff bringbar ist, dass sich die jeweiligen Luft- und Kriechstrecken 140, 140'; 240, 240' zumindest teilweise überlappen.
Abstract:
A structure for use with data network management systems uses a plurality of cables interconnecting patch panels, network devices and end-user devices and further utilizes integrated circuits to monitor the status of these end-user devices. The structure includes respective primary (36) and secondary (45) circuit boards. A plurality of connective jacks (31) are mounted on the primary circuit board and these jacks are interconnected to switches and other patch panels within the network. Wires from the jacks extend to and connect with end-user devices and a secondary circuit board is spaced apart from the primary circuit board so as to define a hollow nest (42) within the patch panel assembly that houses and protects integrated circuits (45, 52) and the like.