公开(公告)号：EP1278821A4

公开(公告)日：2005-11-09

申请号：EP01935016

申请日：2001-05-02

Applicant: GAU JEN JR

Inventor： GAU JEN JR

IPC: G01N33/483 ,  B01L3/00 ,  B81C1/00 ,  C12Q1/68 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14 ,  G01N27/327 ,  G01N27/333 ,  G01N27/403 ,  G01N27/416 ,  G01N27/48 ,  G01N27/49 ,  G01N33/487 ,  G01N37/00 ,  C12M1/34 ,  C12N11/00 ,  G01N27/00 ,  G01N31/00 ,  G01N33/00 ,  G01N33/48 ,  G01N33/53 ,  G01N33/543

CPC classification number: B01L3/5088 ,  B01J2219/00317 ,  B01J2219/00497 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01J2219/00702 ,  B01J2219/00722 ,  B01J2219/00725 ,  B81C2201/0133 ,  B82Y30/00 ,  C12Q1/68 ,  C12Q1/6876 ,  C12Q2600/156 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14 ,  G01N27/3277

Abstract: A microelectromechanical system (MEMS) and integrated circuit based biosensor (210) capable of sensing or detecting various ionic molecules and macromolecules (DNA, RNA or protein). The MEMS based biosensor (210) may utilize a hybridization and enzyme amplification scheme and an electrochemical detection scheme for sensitivity improvement and system miniaturization. The biosensor or biosensors (210) are incorporated on a single substrate (200). Preferably, the biosensor system comprises at least two electrodes. The electrodes may comprise a working electrode (220), a reference electrode (240), and a counter (auxiliary) electrode (230). The biosensor or biosensors (210) also provide an apparatus and method for confinement of reagent and/or solution in the biosensor or biosensors (210) using surface tension at small scale. The confinement system provides controlled contacts between the reagent(s) and/or solution(s) with the components (i.e., electrodes) of the biosensor or biosensors (210) using controllable surface properties and surface tension forces. The confinement system allows for incorporation of the biosensor or biosensors (210) into a portable or handheld device and is immune to shaking and/or flipping. The invention also provides for a biosensor (210) and/or sensors that are integrated with integrated circuit (IC) technologies. Preferably, the entire sensor system or systems are fabricated on a single IC substrate (200) or chip and no external component and/or instrument is required for a complete detection system or systems. Preferably, the sensor system or systems are fabricated using the IC process on a silicon substrate (200).

公开(公告)号：EP1198695B1

公开(公告)日：2005-03-16

申请号：EP00951413.4

申请日：2000-07-20

Applicant: LITEF GmbH

Inventor： WIEMER, Maik ,  HILLER, Karla ,  BILLEP, Detlef ,  BRENG, Uwe ,  RYRKO, Bruno ,  HANDRICH, Eberhard

IPC: G01C19/56 ,  G01P15/08

CPC classification number: B81B3/0051 ,  B81B2201/0242 ,  B81C2201/0133 ,  G01C19/56 ,  G01P15/0888

Abstract: The invention relates to a method for the production of a silicon torsion spring, whereby, for instance, the rotational speed in a microstructured torsion spring-mass system can be read. The invention aims at providing low torsional stiffness in comparison with a relatively high transversal stiffness in lateral and vertical direction. According to the invention, a wafer or wafer composite is used to produce a spring having a V-shaped cross section after masking by means of anisotropic wet-chemical etching, said spring extending preferably over the entire thickness of the wafer and being defined laterally by the [111] surfaces only. Two wafers or wafer composites thus prestructured are rotated by 180 DEG and bonded to one another by aligning them in a mirror-inverted manner in such a way that the desired X-shaped cross section is obtained. One advantage provided by the invention is that the technology used in the production of the laterally and vertically rigid rotational spring is comparatively simple.

公开(公告)号：EP1510864A2

公开(公告)日：2005-03-02

申请号：EP04026039.0

申请日：2000-07-13

Applicant: Input/Output, Inc.

Inventor： Yu, Lianzhong ,  Ried, Robert P. ,  Goldberg, Howard D. ,  Yu, Duli

IPC: G03F7/00

CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

公开(公告)号：EP1196788B1

公开(公告)日：2004-12-22

申请号：EP00945370.5

申请日：2000-07-13

Applicant: Input/Output, Inc.

Inventor： YU, Lianzhong ,  RIED, Robert, P. ,  GOLDBERG, Howard, D. ,  YU, Duli

IPC: G01P9/04 ,  G01P15/135 ,  G02B26/00 ,  C23F1/00 ,  G03F7/26 ,  G03F7/00

CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

Abstract: The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

Abstract translation: 本发明提供了用于一般地制造微机械装置和特别是用于光学扫描装置的镜面组件的合并掩模工艺。 一种制造三维结构的方法，包括：提供衬底，将第一掩蔽材料层施加到所述衬底上，将第二掩蔽材料层施加到所述第一掩模材料的所述层上，将所述第二掩模材料的所述层 掩模材料，将第三掩模材料层施加到未被第二掩模材料的图案化层覆盖的部分上，第三掩模材料的层至少与第一和第二掩模材料的层的组合厚度一样厚 掩模材料，图案化第一和第三掩模材料的层，蚀刻衬底的暴露部分，蚀刻第一和第三掩模材料的层的暴露部分并蚀刻衬底的暴露部分。

公开(公告)号：EP1419396A1

公开(公告)日：2004-05-19

申请号：EP02753497.3

申请日：2002-08-20

Applicant: Honeywell International Inc.

Inventor： ESKRIDGE, Mark

IPC: G01P15/08 ,  B81B3/00

CPC classification number: G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C2201/0133 ,  G01P15/08 ,  G01P15/097 ,  G01P2015/0828 ,  G01P2015/0831

Abstract: An apparatus and method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure. Two half-circular flexures may be arranged to form a circular shape or may be interconnected in their middle region to form a single x-shaped suspension member.

公开(公告)号：EP1364396A2

公开(公告)日：2003-11-26

申请号：EP02718901.8

申请日：2002-02-05

Applicant: Becton, Dickinson and Company

Inventor： EVANS, John, D. ,  KELLER, Chris

IPC: H01L21/302 ,  B44C1/22

CPC classification number: A61M37/0015 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150984 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/0133

Abstract: A microprotrusion array is formed from a silicon wafer by a plurality of sequential plasma and wet isotropic and anisotropic etching steps. The resulting microprotrusions (14) have sharpened tips (18) or cutting edges formed by wet isotropic etching, wherein each microprotrusion has a substantially pyramid shape with each side (16) having a concave surface. The tip of each microprotrusion has a substantially flat top surface (20) extending parallel to base (12).

公开(公告)号：EP1278821A1

公开(公告)日：2003-01-29

申请号：EP01935016.4

申请日：2001-05-02

Applicant: Jen, Jr., Gau

Inventor： Jen, Jr., Gau

IPC: C12M1/34 ,  C12N11/00 ,  G01N27/00 ,  G01N31/00 ,  G01N33/00 ,  G01N33/48 ,  G01N33/53 ,  G01N33/543

CPC classification number: B01L3/5088 ,  B01J2219/00317 ,  B01J2219/00497 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01J2219/00702 ,  B01J2219/00722 ,  B01J2219/00725 ,  B81C2201/0133 ,  B82Y30/00 ,  C12Q1/68 ,  C12Q1/6876 ,  C12Q2600/156 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14 ,  G01N27/3277

Abstract: A microelectromechanical system (MEMS) and integrated circuit based biosensor (210) capable of sensing or detecting various ionic molecules and macromolecules (DNA, RNA or protein). The MEMS based biosensor (210) may utilize a hybridization and enzyme amplification scheme and an electrochemical detection scheme for sensitivity improvement and system miniaturization. The biosensor or biosensors (210) are incorporated on a single substrate (200). Preferably, the biosensor system comprises at least two electrodes. The electrodes may comprise a working electrode (220), a reference electrode (240), and a counter (auxiliary) electrode (230). The biosensor or biosensors (210) also provide an apparatus and method for confinement of reagent and/or solution in the biosensor or biosensors (210) using surface tension at small scale. The confinement system provides controlled contacts between the reagent(s) and/or solution(s) with the components (i.e., electrodes) of the biosensor or biosensors (210) using controllable surface properties and surface tension forces. The confinement system allows for incorporation of the biosensor or biosensors (210) into a portable or handheld device and is immune to shaking and/or flipping. The invention also provides for a biosensor (210) and/or sensors that are integrated with integrated circuit (IC) technologies. Preferably, the entire sensor system or systems are fabricated on a single IC substrate (200) or chip and no external component and/or instrument is required for a complete detection system or systems. Preferably, the sensor system or systems are fabricated using the IC process on a silicon substrate (200).

公开(公告)号：WO2019063404A1

公开(公告)日：2019-04-04

申请号：PCT/EP2018/075444

申请日：2018-09-20

Applicant: CIS FORSCHUNGSINSTITUT FÜR MIKROSENSORIK GMBH

Inventor： POBERING, Sebastian ,  TÄSCHNER, Robert ,  KLEIN, Thomas ,  LULEICH, Matthias

IPC: G01L9/00 ,  B81B3/00 ,  B81C1/00 ,  G01L19/06

CPC classification number: G01L9/0048 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00182 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/032 ,  B81C2203/036 ,  G01L19/0618

Abstract: Die Erfindung betrifft ein Verfahren zur Herstellung eines Drucksensorchips (11). Es erfolgt zuerst das Bereitstellen eines ersten Wafers als Sensorplatte(01), in welcher eine Druckkammer (15) des Drucksensorchips ausgebildet werden soll. Es wird eine gewünschte Dicke einer Membran (07) festgelegt, die auf einer Membranseite (02) der Sensorplatte (01) über der Druckkammer (15) erzeugt werden soll. Sodann werden mindestens die folgenden Strukturierungsschritte von einer der Membranseite gegenüberliegenden Öffnungsseite (03) aus ausgeführt, zur Ausbildung der Druckkammer (15): ein erster Strukturierungsschritt, durch welchen im ersten Wafer Strukturen mit Seitenwänden mit einem Flankenwinkel im Bereich 90° ±20° erzeugbar sind, anisotropes nasschemisches Ätzen, sowie nachfolgen isotropes Ätzen. Schließlich wird ein zweiter Wafer als Verstärkungsplatte (12) bereitgestellt und eine Durchgangsöffnung (14) in diese eingebracht. Abschließend wird die Sensorplatte (01) auf der Öffnungsseite (03) mit der Verstärkungsplatte (12) verbunden, wobei die Durchgangsöffnung (14) in die Druckkammer (15) mündet. Die Erfindung betrifft außerdem einen Drucksensorchip (11).

公开(公告)号：WO2017012746A1

公开(公告)日：2017-01-26

申请号：PCT/EP2016/061706

申请日：2016-05-24

Applicant: ROBERT BOSCH GMBH

Inventor： STRAUB, Rainer ,  PINTER, Stefan ,  MUCHOW, Joerg

IPC: B81C1/00

CPC classification number: B81C1/00103 ,  B81B7/0058 ,  B81B2201/042 ,  B81B2203/0384 ,  B81C1/00317 ,  B81C2201/0133 ,  B81C2201/0143 ,  B81C2201/0154 ,  B81C2203/0136 ,  G02B1/14 ,  G02B26/0833

Abstract: Die Erfindung betrifft ein Herstellungsverfahren für eine mikromechanische Fensterstruktur mit den Schritten: Bereitstellen eines Substrats (1), wobei das Substrat (1) eine Vorderseite (4) und eine Rückseite (5) aufweist; Bilden einer ersten Ausnehmung (6) an der Vorderseite (4); Ausbilden einer Beschichtung (8; 8', 8") auf der Vorderseite (4) und auf der ersten Ausnehmung (6); und Bilden einer zweiten Ausnehmung (7) an der Rückseite (5), so dass die Beschichtung (8) zumindest bereichsweise freigelegt wird, wodurch ein Fenster (F) durch den freigelegten Bereich der Beschichtungen gebildet wird.

Abstract translation: 本发明涉及的制造方法用于微机械窗结构，包括以下步骤：提供衬底（1），其中所述衬底（1）具有前侧（4）和一个背部（5）; 在前侧上形成的第一凹部（6）（4）; 形成涂层;在所述前面（8“，8“）（4）和在所述第一凹部（6），以及形成第二凹部（7）在背部（5），从而使所述涂层（8）的至少 由此，由涂层的暴露区域上形成一个窗口（F）的一部分露出。

公开(公告)号：WO2015059437A1

公开(公告)日：2015-04-30

申请号：PCT/GB2014/000415

申请日：2014-10-15

Applicant: SWANSEA UNIVERSITY

Inventor： LUI, Yufei ,  GUY, Owen

IPC: A61M37/00 ,  B81C1/00

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/0159 ,  B81C2201/0176 ,  B81C2201/0181 ,  C23C16/402

Abstract: A method of forming microneedles (28) where through a series of coating and etching processes microneedles are formed from a surface as an array. The microneedles have a bevelled end and bore which are formed as part of the process with no need use a post manufacturing process to finish the microneedle.

Abstract translation: 一种形成微针（28）的方法，其中通过一系列涂层和蚀刻处理微针从表面形成为阵列。 微针具有倾斜的端部和孔，其形成为该过程的一部分，而不需要使用后制造工艺来完成微针。