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    Printed circuit
    143.
    发明授权
    Printed circuit 失效
    印刷电路

    公开(公告)号：US4656314A

    公开(公告)日：1987-04-07

    申请号：US789713

    申请日：1985-10-21

    Applicant: David Durand

    Inventor： David Durand

    IPC: H05K3/00 ,  H05K3/14 ,  H05K3/38

    CPC classification number: H05K3/386 ,  H05K3/146 ,  H05K2201/0108 ,  H05K2201/0166 ,  H05K2203/0522 ,  H05K2203/1572 ,  H05K3/0082 ,  H05K3/143

    Abstract: An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.

    Abstract translation: 将紫外线反应性油墨施加到所需电路图像中的半透明基板上，并用紫外线辐射部分固化至发粘状态。 然后将抗蚀剂材料施加到负电路图像中的基板上，并通过真空沉积将金属颗粒沉积在墨上。 然后将墨水进一步固化至硬化状态，并从基材上方和下方施加紫外线辐射，以抵消金属反射仅从基材上方施加的辐射的趋势。 最后，将抗蚀剂材料从衬底上除去，留下完全形成的电路板，其中包括基片，完全固化的墨水回路图象与其上的金属导电层。

    Method for photographically improving the resolution of screen printed photopolymer images
    144.
    发明授权
    Method for photographically improving the resolution of screen printed photopolymer images 失效
    用于照相提高丝网印刷光聚合物图像分辨率的方法

    公开(公告)号：US4610941A

    公开(公告)日：1986-09-09

    申请号：US713550

    申请日：1985-03-19

    Applicant: Donald F. Sullivan

    Inventor： Donald F. Sullivan

    IPC: G03F7/20 ,  H05K3/00 ,  H05K3/12 ,  H05K3/28 ,  G03C5/00

    CPC classification number: H05K3/0082 ,  G03F7/2022 ,  H05K3/28 ,  H05K2201/0166 ,  H05K2203/0508 ,  H05K2203/056 ,  H05K2203/0759 ,  H05K2203/1476 ,  H05K3/1216

    Abstract: A process is described for improving the quality of images which have been formed by screen printing a liquid photo curable photopolymer. Images formed by screen printing, especially heavy coatings such as solder masks on printed wiring boards, inherently have indistinct boundaries, and may have feathered edges and photopolymer smears. These indistinct boundaries are removed and the resolution improved by a process which utilizes the oxygen inhibition effect characteristic of selected photopolymers. Thus, a screen printed image can be 0.001 inches thick at the center of a line, tapering off to 0.0001 inch thick smears, and these smears may be eliminated by irradiating the entire image with a moderate amount light energy, which cures the thick image portion and leaves a liquid boundary layer on the order of 0.0001 inch thick due to the oxygen effect. When washed with a mild solvent the liquid layer is removed, including the smears, leaving the thick image portion undisturbed. In a preferred embodiment a phototransparency is interposed over and out of contact with the images and then irradiated with non-collimated UV light so as to harden the thicker image sections while indistinct boundary areas are shielded by opaque phototransparency areas. Light undercutting due to the use of non-collimated light does not polymerize the smears because of the oxygen-inhibition effect and the thinness of the smears, and thus only the undersirable smears will be inhibited and left in the liquid state for removal to improve the resolution.

    Abstract translation: 描述了一种用于提高通过丝网印刷液体光固化光聚合物形成的图像质量的方法。 通过丝网印刷形成的图像，特别是印刷线路板上的重涂层，例如焊接掩模，固有地具有不清楚的边界，并且可能具有羽化边缘和光聚合物涂片。 除去这些不清楚的边界，并且通过利用选择的光聚合物的氧抑制作用特征的方法改进分辨率。 因此，丝网印刷图像在线的中心可以为0.001英寸厚，逐渐变细到0.0001英寸厚的涂片，并且可以通过用适度的光能照射整个图像来消除这些涂片，这固化了厚图像部分 并且由于氧气效应而留下厚度为0.0001英寸的液体边界层。 当用温和的溶剂洗涤时，除去液体层，包括涂片，使厚的图像部分不受干扰。 在一个优选实施例中，将光透明度置于图像上并与图像接触之后，然后用非准直的UV光照射，以便使不透明的边界区域被不透明的透光区域屏蔽，从而使较厚的图像部分变硬。 由于使用非平行光而引起的光底切不会由于阻氧效果和涂片的薄度而聚合涂片，因此只有不合需要的污迹将被抑制并留在液态以除去以改善 解析度。

    Process for the production of a circuit board
    145.
    发明授权
    Process for the production of a circuit board 失效
    生产电路板的过程

    公开(公告)号：US3675318A

    公开(公告)日：1972-07-11

    申请号：US3675318D

    申请日：1970-05-11

    Applicant: SIEMENS AG

    Inventor： MERKENSCHLAGER HANS-HERMANN

    IPC: H05K3/00 ,  H01R12/51 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H01B13/00

    CPC classification number: H05K3/428 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/09436 ,  H05K2203/054 ,  H05K2203/1383 ,  Y10T29/49165

    Abstract: Production of multi-layered electrical circuit boards which have closely spaced circuit elements is accomplished by applying a solder-resistant lacquer coating to the outside surfaces of a plurality of conductor plates affixed together in juxtaposed relationship, producing bores through the plurality of circuit boards in a predetermined relationship to their circuitry placed thereon, depositing a first copper layer by currentless means upon the bore wall and the solder-resistant lacquer coated surface, applying a galvanic-proof coating to the copper metal layer in predetermined areas leaving soldering eyes free of the galvanic-proof coating, galvanically coating the bores inclusive of the soldering eyes with a second copper reinforcing layer, applying an etch-proof metal layer on the surface of said copper reinforcing layer, removing the galvanic-proof lacquer layer and the first copper layer by etching on the places not covered by the etch-proof metal layer.

    Abstract translation: 具有紧密间隔的电路元件的多层电路板的制造是通过将焊料防腐涂层施加到并置在一起的多个导体板的外表面并置的关系来实现的，该多个导电板以并列关系固定在多个电路板上， 与其放置在其上的电路的预定关系，通过无电流装置将第一铜层沉积在孔壁和耐焊漆漆涂层表面上，在预定区域中的铜金属层上施加防电镀涂层，留下没有电镀的焊接眼 通过第二铜加强层对包含焊接眼的孔电镀涂层，在所述铜加强层的表面上施加防蚀金属层，通过蚀刻去除电镀防腐漆层和第一铜层 在不被防蚀金属层覆盖的地方。

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