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    DEVICE HOUSING PACKAGE
    141.
    发明申请
    DEVICE HOUSING PACKAGE 有权
    设备外壳包装

    公开(公告)号：US20150016074A1

    公开(公告)日：2015-01-15

    申请号：US14382801

    申请日：2013-03-05

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

    IPC: H05K1/18 ,  H05K1/16

    CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

    Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

    Wiring board and production method thereof, and semiconductor apparatus
    147.
    发明授权
    Wiring board and production method thereof, and semiconductor apparatus 失效
    接线板及其制造方法以及半导体装置

    公开(公告)号：US06495769B1

    公开(公告)日：2002-12-17

    申请号：US09536645

    申请日：2000-03-28

    Applicant: Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

    Inventor： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

    IPC: H05K103

    CPC classification number: H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

    Abstract: Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

    Abstract translation: 本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

    Electroless plating process for the manufacture of printed circuit boards
    149.
    发明授权
    Electroless plating process for the manufacture of printed circuit boards 失效
    用于制造印刷电路板的无电镀工艺

    公开(公告)号：US5648125A

    公开(公告)日：1997-07-15

    申请号：US558900

    申请日：1995-11-16

    Applicant: Frank N. Cane

    Inventor： Frank N. Cane

    IPC: C23C18/16 ,  C23C18/28 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  C23C14/02

    CPC classification number: C23C18/1889 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/1851 ,  C23C18/1855 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2006 ,  C23C18/208 ,  C23C18/30 ,  C23C18/34 ,  H05K3/422 ,  H05K3/427 ,  C23C18/1617 ,  H05K2201/0344 ,  H05K2203/0716 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/122 ,  H05K3/0055 ,  H05K3/383

    Abstract: There is disclosed a process for electroless plating of a conductive metal layer onto the surface of a non-conductive substrate, in which the substrate surface is prepared for receiving a coating of activator using conventional methods, and the coating of activator is applied by contacting the substrate surface with a stabilized sensitizing solution comprising ions of at least one Group VIII and IB transition metal, preferably palladium chloride, stannous ions in a molar concentration in excess of that of the transition metal ions, an acid, and a buffering salt; followed by contacting the sensitized substrate surface with a noble metal activating solution to catalyze the substrate surface for subsequent electroless plating. The sensitized and activated substrate is then contacted with an aqueous dry film photoresist, which is then imaged and developed to form a predetermined electrical circuit pattern, using conventional methods. The cleaned and imaged substrate is then immersed in an acidic electroless nickel metal depositing solution, for a time, at a concentration, and at a temperature sufficient to prepare the substrate for subsequent pattern electroplating, said acidic electroless metal depositing solution comprising ions of nickel, a complexing agent, a reducing agent capable of reducing said metal ions to a metallic state in an acidic medium, provided that said reducing agent does not include formaldehyde or a formaldehyde generating composition, one or more stabilizers, and water.

    Abstract translation: 公开了一种用于将导电金属层无电镀在非导电基底的表面上的方法，其中使用常规方法制备用于接收活化剂涂层的基底表面，并且通过使 底物表面具有稳定的敏化溶液，其包含摩尔浓度超过过渡金属离子的摩尔浓度的至少一种VIII族和IB族过渡金属离子，优选氯化钯，亚锡离子，酸和缓冲盐; 然后使敏化的基材表面与贵金属活化溶液接触以催化基材表面用于随后的无电镀。 然后使敏化和活化的底物与水性干膜光致抗蚀剂接触，然后使用常规方法将其成像和显影以形成预定的电路图案。 然后将清洁和成像的衬底浸入酸性无电镍金属沉积溶液中一段时间​​，浓度和足以制备用于后续图案电镀的衬底的温度，所述酸性无电金属沉积溶液包含镍离子， 络合剂，能够在酸性介质中将金属离子还原为金属状态的还原剂，条件是所述还原剂不包括甲醛或甲醛产生组合物，一种或多种稳定剂和水。

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