公开(公告)号：EP2948074B1

公开(公告)日：2018-09-19

申请号：EP14706985.0

申请日：2014-01-24

Applicant: Medtronic Xomed, Inc.

Inventor： JACOBSEN, Brad ,  BURG, Bruce M. ,  BLOCK, Orey G. ,  BZOSTEK, Andrew ,  DOERR, Vince J. ,  JAIN, Abhishek ,  MERKL, Brandon ,  CILKE, Joseph Thomas

IPC: A61B17/24 ,  A61B34/20 ,  H05K1/03

CPC classification number: H05K3/34 ,  A61B17/24 ,  A61B34/20 ,  A61B2017/00862 ,  A61B2017/00946 ,  A61B2034/2051 ,  H05K1/0245 ,  H05K1/118 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/097 ,  H05K2201/10287

Abstract: A surgical instrument (100) is disclosed having an elongated body portion (126) having a proximal end and a distal end. The body portion is formed from a plastically deformable material such that the body portion can be bent between the proximal and distal ends from a first configuration to a second bent configuration and maintains the bent configuration. A flexible circuit sheet (232) having at least a pair of lead wires (236) disposed around the body portion. The pair of lead wires are configured to conform to the bent configuration of the body portion such that they do not break during bending of the body portion. A tracking device (84) adapted to cooperate with a navigation system (10) to track the distal end of the instrument (100) is coupled to the flexible circuit.

公开(公告)号：EP2608643A1

公开(公告)日：2013-06-26

申请号：EP11250939.3

申请日：2011-12-23

Applicant: British Telecommunications public limited company

Inventor： The designation of the inventor has not yet been filed

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/02 ,  H01B7/08 ,  H01P3/04

CPC classification number: H01B7/0846 ,  H05K1/0242 ,  H05K1/0245 ,  H05K3/103 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/097 ,  H05K2203/1545

Abstract: The present invention discloses a new and inventive cable structure and a method for manufacturing such a cable. The cable (100) has a planar form and comprises one or more pairs of carbon nanotube wires (120). The cable has an adhesive surface such that it can be readily installed (and subsequently repositioned) within a domestic, or commercial, premises. Such a cable would enable in premises transmission of very high bit-rate data without the disadvantages associated with structured cables and wiring.

Abstract translation: 本发明公开了一种新的和本发明的电缆结构及其制造方法。 电缆（100）具有平面形式并且包括一对或多对碳纳米管线（120）。 电缆具有粘合剂表面，使得其可以容易地安装（并随后重新定位）在家庭或商业场所内。 这样的电缆将能够实现非常高比特率数据的处理传输，而没有与结构化电缆和布线相关联的缺点。

公开(公告)号：EP2566307A2

公开(公告)日：2013-03-06

申请号：EP12005825.0

申请日：2012-08-10

Applicant: Eppendorf AG

Inventor： Reichmuth, Burkardt

IPC: H05K1/02 ,  B01L3/02 ,  G01F11/02 ,  H05K1/03

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument (200) with a cable holding space (185) in which a printed circuit board cable device (100) is arranged, more particularly to a dispenser or a pipette. The printed circuit board cable device has at least one printed circuit board (102), which has a first and a second side of the board, and, arranged in succession, at least one first printed circuit board section (A), at least one second printed circuit board section (B) and at least one third printed circuit board section (C), with the printed circuit board having a number of conductor tracks (121,122) which, at least in sections, are arranged parallel with respect to one another on the printed circuit board and extend from a first track section, which is arranged in the first printed circuit board section, via the second printed circuit board section to the third printed circuit board section, in which a second track section is arranged, wherein, in the second printed circuit board section, at least one conductor track (121a, 122a) is arranged on the first side of the board and at least one conductor track (121b, 122b) is arranged on the second side of the board.

Abstract translation: 本发明涉及具有电缆保持空间（185）的实验室样品仪器（200），其中布置有印刷电路板电缆装置（100），更具体地涉及一种分配器或移液器。 所述印刷电路板电缆装置具有至少一个印刷电路板（102），所述印刷电路板具有所述板的第一和第二侧，并且依次配置有至少一个第一印刷电路板部分（A），至少一个 第二印刷电路板部分（B）和至少一个第三印刷电路板部分（C），其中印刷电路板具有多个导体轨道（121,122），其至少部分地相对于彼此平行布置 在印刷电路板上并且经由第二印刷电路板部分从布置在第一印刷电路板部分中的第一轨道部分延伸到布置有第二轨道部分的第三印刷电路板部分， 在第二印刷电路板部分中，至少一个导体轨道（121a，122a）布置在板的第一侧上，并且至少一个导体轨道（121b，122b）布置在板的第二侧上。

公开(公告)号：EP2259312A1

公开(公告)日：2010-12-08

申请号：EP09164685.1

申请日：2009-07-06

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01R13/2442 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2201/10424 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module (10), and at least a spring strip set (20). The IC module contains a substrate (11), at least an IC chip and a molding body, in which the substrate has an inner surface (111) and an outer surface (112), at least an external contact pad (113) is provided on one end of the outer surface, and at least a switch contact pad (114) is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set (20) has at least a non-flat structure (21). The external contact pad (113) of an IC module is electrically connected with the switch contact pad (114) of another IC module via the electrical contact of the non-flat structure (21) so that the IC modules are integrated to form an inversely alternate stacked structure.

Abstract translation: 集成电路（IC）模块的反交替层叠结构包括至少一个IC模块（10）和至少一个弹簧条组（20）。 IC模块包含至少一个IC芯片和成型体的基片（11），其中基片具有内表面（111）和外表面（112），至少提供一个外部接触垫（113） 在外表面的一端上，并且在外表面的另一端上设置至少一个开关接触垫（114），外部接触垫和开关接触垫以相反对称的方式设置。 弹簧带组20至少具有非平面结构21。 IC模块的外部接触焊盘（113）经由非平面结构（21）的电接触与另一个IC模块的开关接触焊盘（114）电连接，使得IC模块被集成以形成反向 交替堆叠结构。

公开(公告)号：EP1865757A1

公开(公告)日：2007-12-12

申请号：EP06290932.0

申请日：2006-06-06

Applicant: Alcatel Lucent

Inventor： Fossion, Marc Jean Joseph ,  Fossion, Stéphanie Cécile Marie

IPC: H05K1/02

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/097

Abstract: A Printed Circuit Board PCB provided with several pairs (P1; P2) of parallel wires (1a, 1b; 2a, 2b) carrying differential signals and following a same path from a start area (A) to an end area (B) on the PCB. The wires (1a, 1b) of at least one (P1) of the differential pairs are constituted by several consecutive sections (S1 to S5) and between each consecutive sections, the two wires of the pair are twisted on the PCB. In a first implementation of the invention, the two wires of the differential pair are located on a same layer (L1) of the PCB. In that case, a first (1a) of the two wires crosses the second wire (1b) by means of a bypass or via (V1 - V4) on a second layer (L2) of the PCB, alternatively between each consecutive sections (S1 - S5). In a variant or second implementation of the invention, the first wire (1a) and the second wire (1b) of a same pair (P1) are located on distinct layers (L1, L2) of said PCB. in that case, each wire changes of layer at each consecutive section intersection.

Abstract translation: 印刷电路板PCB，其具有承载差分信号的数个对（P1; P2）的并行线（P1; P2），并沿着与起始区域（A）到端部区域（B）相同的路径 PCB。 差分对的至少一个（P1）的导线（1a，1b）由几个连续的部分（S1至S5）构成，并且在每个连续的部分之间，该对的两条线在PCB上扭曲。 在本发明的第一实施方案中，差分对的两条导线位于PCB的同一层（L1）上。 在这种情况下，两条线中的第一（1a）通过PCB上第二层（L2）上的旁路或通路（V1-V4）交替穿过第二线（1b），或者在每个连续的部分（S1 - S5）。 在本发明的变型或第二实施方案中，同一对（P1）的第一线（1a）和第二线（1b）位于所述PCB的不同层（L1，L2）上。 在这种情况下，每条线在每个连续的部分交点处改变层。

公开(公告)号：EP1619757A4

公开(公告)日：2006-07-26

申请号：EP04700110

申请日：2004-01-05

Applicant: HUAWEI TECH CO LTD

Inventor： LI ZHENYA ,  WEI KONGGANG ,  LI WENJIAN ,  WU GUZHENG ,  WANG CHENGLONG ,  YANG ZHIGUO ,  JIN JUNWEN

IPC: H01R9/28 ,  H01R31/06 ,  H05K1/18

CPC classification number: H01R12/52 ,  H01R31/06 ,  H05K1/18 ,  H05K2201/044 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: This invention discloses s a double sided insert board, on which one side is provided with at least one front board connectors according to the notch width, the other side is provided with at least one back board connectors according to the notch width. The front board connectors and the back board connectors are located at the same level on the double sided insert board as well as are staggerd about. The front board connectors and the back board connectors are the uniform board connectors of same standard and with same pins. The double sided insert board according to the invention satisfy the common usage of the front board and the back board. The invention also has no special demands to the design, production, and manufacture of the boards, which reduces the production cost and difficulties in project. As the same time, the front board and the back board are same, which reduces the cost for design.

公开(公告)号：EP0855854B1

公开(公告)日：2004-09-08

申请号：EP97122347.4

申请日：1997-12-18

Applicant: MOLEX INCORPORATED

Inventor： Atsuhito, Noda ,  Masato, Okano

IPC: H05K1/00 ,  H05K1/02 ,  H01B7/08

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K1/118 ,  H05K2201/09263 ,  H05K2201/097 ,  Y10S439/941

公开(公告)号：EP1286464B1

公开(公告)日：2004-05-19

申请号：EP02018186.3

申请日：2002-08-19

Applicant: Alps Electric Co., Ltd.

Inventor： Osada, Shigeru

IPC: H03H7/09 ,  H01F27/00

CPC classification number: H05K1/165 ,  H01F5/003 ,  H01F17/0033 ,  H05K3/222 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/097 ,  H05K2201/10636 ,  H05K2203/171 ,  Y02P70/611

公开(公告)号：EP1384320A1

公开(公告)日：2004-01-28

申请号：EP02731648.8

申请日：2002-05-02

Applicant: Thomson Licensing S.A.

Inventor： CROMARTY, Brian, Jonathan ,  COAN, Lawrence, Charles ,  HALL, Edward, Allen

IPC: H03H1/00

CPC classification number: H05K9/0066 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/0233 ,  H05K2201/097 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10371

Abstract: A method for reducing electromagnetic radiation (EMR) between devices in electrical communication, including processing (220) signals within a first device in a manner tending to reduce EMR, and electromagnetically isolating (230) the processed signald prior to communicating the signals to a subsequent device.

公开(公告)号：EP1197130A1

公开(公告)日：2002-04-17

申请号：EP00948103.7

申请日：2000-07-13

Applicant: International Business Machines Corporation ,  IBM United Kingdom Limited

Inventor： LAUFFER, John ,  RUSSELL, David

IPC: H05K1/16 ,  H05K3/46 ,  H01F41/04

CPC classification number: H01F41/041 ,  H01F17/0033 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/086 ,  H05K2201/09563 ,  H05K2201/097 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

Abstract: Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated into electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substrates for high density placement of active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material (20). The dielectric (20) is photoimaged and etched to provide one or more recesses or openings (26) for the passive devices, and photovias interconnecting the inputs and outputs of the integrated circuit board. The electronic structure comprising at least one of the passive devices integrated into a photoimaged dielectric (20) is described as well as the method of manufacturing the same.