公开(公告)号：US20090059470A1

公开(公告)日：2009-03-05

申请号：US12280692

申请日：2007-03-13

Applicant: Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

Inventor： Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

IPC: H01G4/224

CPC classification number: H01G2/06 ,  H01G2/106 ,  H01G2/12 ,  H01G9/008 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10962 ,  H05K2203/1361

Abstract: According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.

Abstract translation: 根据在电容器连接引脚沿垂直方向焊接到电路基板之后，在电路基板的两面上形成防潮剂的结构和制造方法，并且将电容器电连接到与 在电路基板的上部空间处的电容器连接针的长度方向，与电容器连接的防潮剂的可能性被消除，由于可以容易地在电路基板的两个表面上形成防潮剂，因此提高了生产率 并且由于电容器相对于电路基板在上部空间中沿水平方向安装，所以实现了小型化和低高度配置的电容器单元。

公开(公告)号：US20080291653A1

公开(公告)日：2008-11-27

申请号：US11805603

申请日：2007-05-24

Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

IPC: H05K7/02

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Abstract translation: 一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。 载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。 脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。 用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。

公开(公告)号：US07355874B2

公开(公告)日：2008-04-08

申请号：US11461265

申请日：2006-07-31

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C5/00 ,  G11C16/04 ,  H01L23/02

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US20070274057A1

公开(公告)日：2007-11-29

申请号：US11751227

申请日：2007-05-21

Applicant: Yasuyuki Fukumoto

Inventor： Yasuyuki Fukumoto

IPC: H05K7/04

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

Abstract translation: 电子部件保持器包括保持器主体和电线保持部。 保持器本体包括形成在保持器主体的顶面中的多个第一槽和形成在保持器主体的后表面中的多个第二槽。 第一凹槽和第二凹槽构造成接收电子部件的引线。 引线被配置为弯曲以设置在第二槽中的一个中。 背面与顶面相交。 电线保持部设置在保持体上。 电线保持部分构造成接合引线以将导线保持在第二凹槽中。

公开(公告)号：US20040178876A1

公开(公告)日：2004-09-16

申请号：US10768066

申请日：2004-02-02

Applicant: FUJITSU HITACHI PLASMA DISPLAY LIMITED

Inventor： Haruo Koizumi ,  Makoto Onozawa

IPC: H01F005/00

CPC classification number: H05K1/18 ,  H01F5/003 ,  H01F17/0033 ,  H01F27/22 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/165 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board assembly has a flat coil element mounted on a circuit board so that an electric power loss is not generated even when the flat coil element is mounted to the circuit board together with a circuit part having a large heat sink. A module mounted on the circuit board has an electronic circuit device and a heat radiator attached to the electronic circuit device. The heat radiator has an extending part protruding from the electronic circuit device and extending parallel to a surface of the circuit board. A coil mounting area provided with no pattern wire is formed in a part of the circuit board facing the extending part. The flat coil element is mounted parallel to the circuit board in a state where a coil part of the flat coil element faces the coil mounting area.

Abstract translation: 电路板组件具有安装在电路板上的扁平线圈元件，使得即使当扁平线圈元件与具有大散热器的电路部件一起安装到电路板时也不会产生电力损失。 安装在电路板上的模块具有电子电路装置和附接到电子电路装置的散热器。 散热器具有从电子电路装置突出并且平行于电路板的表面延伸的延伸部分。 在面向延伸部的电路板的一部分上形成没有图形线的线圈安装区域。 扁平线圈元件在扁平线圈元件的线圈部分面向线圈安装区域的状态下平行于电路板安装。

公开(公告)号：US6163070A

公开(公告)日：2000-12-19

申请号：US977669

申请日：1997-11-24

Applicant: Ryuichiro Mori

Inventor： Ryuichiro Mori

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H05K3/36 ,  H05K13/04 ,  H01L23/02

CPC classification number: H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K3/363 ,  H05K13/046 ,  H05K2201/055 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor package having a plurality of electrodes arranged along one side of a rectangular semiconductor element; a plurality of wirings, one end of the wiring to be electrically connected with the electrode being arranged adjacent to the electrode and the other end of the wiring being exposed from an opening for external connection; a conductive member provided on the opening for external connection; a flexible wiring substrate on which the semiconductor element is mounted, and the wiring and the conductive member are arranged; and a sealing resin for sealing, except for the conductive member, the semiconductor element and a periphery of the semiconductor element. The semiconductor package can be connected in a horizontal or inclined condition with respect to the substrate for packaging by folding the flexible wiring substrate.

Abstract translation: 一种半导体封装，具有沿矩形半导体元件的一侧布置的多个电极; 多个布线，与电极电连接的布线的一端布置成与电极相邻，并且布线的另一端从用于外部连接的开口露出; 设置在所述开口上用于外部连接的导电构件; 布置有半导体元件的柔性布线基板，布线和导电部件布置; 以及用于密封除了导电构件，半导体元件和半导体元件的周边之外的密封树脂。 半导体封装可以通过折叠柔性布线基板而相对于用于封装的基板以水平或倾斜状态连接。

公开(公告)号：US6031318A

公开(公告)日：2000-02-29

申请号：US47854

申请日：1998-03-25

Applicant: Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

Inventor： Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/19 ,  H05K3/30 ,  H01L41/04

CPC classification number: H03H9/0504 ,  H05K3/303 ,  H05K2201/09781 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K3/301 ,  Y02P70/613

Abstract: A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.

Abstract translation: 一种晶体振荡装置包括具有纵向轴线的外壳体，腔体，沿着纵向轴线延伸的一对第一表面，沿着大致横向于纵向轴线的方向延伸的一对第二表面， 用于提供进入空腔的第一表面，在第二表面之一中的第二开口部分和另一个第二表面中的凹槽。 晶体振荡器设置在外壳的空腔中，并且具有延伸穿过外壳的第二开口部分的引线端子，用于将晶体振荡器电连接到电路板。 接合材料设置在外壳的空腔中，用于将晶体振荡器接合到外壳。 连接构件设置在外壳的槽中，用于将外壳连接到电路板。

公开(公告)号：US6011741A

公开(公告)日：2000-01-04

申请号：US121348

申请日：1998-07-23

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US5867417A

公开(公告)日：1999-02-02

申请号：US907111

申请日：1997-08-06

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US5635760A

公开(公告)日：1997-06-03

申请号：US697604

申请日：1996-08-27

Applicant: Toru Ishikawa

Inventor： Toru Ishikawa

IPC: H01L23/50 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/28

CPC classification number: H01L23/3107 ,  H01L23/49555 ,  H01L25/105 ,  H05K1/181 ,  H05K3/303 ,  H01L2224/48247 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H05K2201/09954 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K3/3421 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor device of the present invention includes a plurality of lead terminals extending from only one side surface of a package main body having major surfaces and side surfaces, the lead terminal extending parallel to the major surface by a predetermined size and being substantially perpendicularly bent to project from the major surface by a predetermined size in a vertical mount type semiconductor device, or being substantially perpendicularly bent to project from the major surface by a predetermined size and bent again at a distal end portion in parallel to the major surface in a horizontal mount type semiconductor device, and a supporting means projecting from the package main body by substantially the same size as the projecting size of the lead terminals. A method of manufacturing the semiconductor device of the present invention includes the steps of lead frame formation, chip mounting and bonding, mold sealing, and lead terminal formation.

Abstract translation: 本发明的半导体器件包括从仅具有主表面和侧表面的封装主体的仅一个侧表面延伸的多个引线端子，引线端子平行于主表面延伸预定尺寸并基本上垂直弯曲成 在垂直安装型半导体器件中从主表面突出预定尺寸，或者基本上垂直弯曲以从主表面突出预定尺寸，并且在水平安装件中平行于主表面的远端部分再次弯曲 以及从封装主体以与引线端子的突出尺寸大致相同的尺寸突出的支撑装置。 本发明的半导体器件的制造方法包括引线框架形成，芯片安装和接合，模具密封和引线端子形成的步骤。