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    METHODS FOR ELECTRICALLY CONNECTING TEXTILE INTEGRATED CONDUCTIVE YARNS
    151.
    发明申请
    METHODS FOR ELECTRICALLY CONNECTING TEXTILE INTEGRATED CONDUCTIVE YARNS 审中-公开
    电纺连接导电纱的方法

    公开(公告)号：WO2014207102A1

    公开(公告)日：2014-12-31

    申请号：PCT/EP2014/063512

    申请日：2014-06-26

    Applicant: IMEC ,  UNIVERSITEIT GENT

    Inventor： VAN KEYMEULEN, Bjorn ,  BOSSUYT, Frederick ,  VERVUST, Thomas ,  DE BAETS, Johan

    IPC: A41D1/00 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H01R4/58 ,  D03D1/00 ,  H01R4/04 ,  H01R4/01

    CPC classification number: D03D1/0088 ,  D10B2401/16 ,  D10B2401/18 ,  H01L23/4985 ,  H01L2924/0002 ,  H01R4/01 ,  H01R4/04 ,  H01R4/58 ,  H05K1/0283 ,  H05K1/0289 ,  H05K1/038 ,  H05K3/103 ,  H05K2201/0281 ,  H05K2203/173 ,  H01L2924/00

    Abstract: The present disclosure provides a textile fabric containing a first electrically conductive thread (10) and a second electrically conductive thread (20), the first electrically conductive thread (10) and the second electrically conductive thread (20) crossing at a first crossover point (1), wherein the textile fabric further contains an electrical connector (50) establishing an electrical connection between the first electrically conductive thread (10) and the second electrically conductive thread (20). The electrical connector (50) contains a first contact pad (11) in electrical contact with the first electrically conductive thread (10), a second contact pad (21) in electrical contact with the second electrically conductive thread (20), and a first stretchable electrical interconnection (51) connecting the first contact pad (11) with the second contact pad (21). The first contact pad (11) and the second contact pad (21) are provided at a location different from the location of the first crossover point (1). The present disclosure further provides methods for electrically interconnecting crossing electrically conductive threads of textile fabrics.

    Abstract translation: 本公开提供了一种包含第一导电线（10）和第二导电线（20）的纺织织物，所述第一导电线（10）和所述第二导电线（20）在第一交叉点 1），其中所述纺织织物还包含在所述第一导电线（10）和所述第二导电线（20）之间建立电连接的电连接器（50）。 电连接器（50）包括与第一导电线（10）电接触的第一接触焊盘（11），与第二导电线（20）电接触的第二接触焊盘（21） 将所述第一接触焊盘（11）与所述第二接触焊盘（21）连接的可拉伸电互连（51）。 第一接触焊盘（11）和第二接触焊盘（21）设置在与第一交叉点（1）的位置不同的位置处。 本公开还提供了用于电互连纺织织物的交叉导电线的方法。

    ELECTRONIC TEXTILE AND METHOD OF MANUFACTURING AN ELECTRONIC TEXTILE
    153.
    发明申请
    ELECTRONIC TEXTILE AND METHOD OF MANUFACTURING AN ELECTRONIC TEXTILE 审中-公开
    电子纺织品和制造电子纺织品的方法

    公开(公告)号：WO2012038849A1

    公开(公告)日：2012-03-29

    申请号：PCT/IB2011/053890

    申请日：2011-09-06

    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  ZHOU, Guofu ,  RADEMAKERS, Johannes, Adrianus, Maria ,  SNOEIJEN, Petrus, Antonius, Henricus ,  BAX, Josephus, Henricus, Gerardus ,  VAN ABEELEN, Frank, Anton ,  VAN PIETERSON, Liesbeth

    Inventor： ZHOU, Guofu ,  RADEMAKERS, Johannes, Adrianus, Maria ,  SNOEIJEN, Petrus, Antonius, Henricus ,  BAX, Josephus, Henricus, Gerardus ,  VAN ABEELEN, Frank, Anton ,  VAN PIETERSON, Liesbeth

    IPC: H05K1/18 ,  H05K1/03

    CPC classification number: H05K1/0283 ,  F21K9/20 ,  F21V21/00 ,  H05K1/0277 ,  H05K1/038 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2203/0152 ,  Y10T29/4913

    Abstract: A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines (6a-b); releasably attaching (101) the textile carrier (2) to a rigid support plate (20); providing (102) a conductive substance on the textile carrier (2) in a pattern forming a plurality of sets of connection pads (5a-b) on the textile carrier (2), each set of connection pads defining a component placement position for placement of an electronic component (3), and each set of connection pads (5a-b) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (L cp ) in a direction parallel to the conductor line and a connection pad width (W cp ) in a direction perpendicular to the conductor line, wherein the connection pad width (W cp ) is at least one percent of an extension (W tc ) of the textile carrier (2) in the direction perpendicular to the conductor line; automatically placing (103) electronic components (3) at the component placement positions; curing (104) the conductive substance to attach the electronic components (3) to the textile carrier (2), thereby forming the electronic textile (1) and removing (105) the electronic textile from the rigid support plate.

    Abstract translation: 一种制造电子织物的方法，包括以下步骤：提供包括多根导体线（6a-b）的织物载体（2）; 将所述织物载体（2）可释放地连接（101）到刚性支撑板（20）上; 在织物载体（2）上以形成多组连接垫（5a-b）的图案在纺织品载体（2）上提供（102）导电物质，每组连接垫限定用于放置的部件放置位置 和每组连接焊盘（5a-b），其包括与导线之一重叠的连接焊盘，所述连接焊盘在与导线平行的方向上具有连接焊盘长度（Lcp），并且 在垂直于导体线的方向上的连接焊盘宽度（Wcp），其中连接焊盘宽度（Wcp）在纺织品载体（2）的垂直于导体线的方向上的延伸部分（Wtc）的至少百分之一 ; 自动将电子部件（103）放置在部件放置位置; 固化（104）导电物质以将电子部件（3）附接到纺织品载体（2），从而形成电子织物（1）并从电子织物移除​​（105）电子织物。

    ELECTRONIC NETWORK AND ELECTRONIC TEXTILE COMPRISING THE ELECTRONIC NETWORK
    154.
    发明申请
    ELECTRONIC NETWORK AND ELECTRONIC TEXTILE COMPRISING THE ELECTRONIC NETWORK 审中-公开
    电子网络和包含电子网络的电子纺织品

    公开(公告)号：WO2011092620A1

    公开(公告)日：2011-08-04

    申请号：PCT/IB2011/050295

    申请日：2011-01-24

    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  ZHOU, Guofu ,  HOEVENAARS, Albericus, Antonius, Maria ,  VAN ABEELEN, Frank, Anton ,  VAN PIETERSON, Liesbeth ,  HORNIX, Eefje, Janet

    Inventor： ZHOU, Guofu ,  HOEVENAARS, Albericus, Antonius, Maria ,  VAN ABEELEN, Frank, Anton ,  VAN PIETERSON, Liesbeth ,  HORNIX, Eefje, Janet

    IPC: H05K1/03 ,  H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/18 ,  A41D27/085 ,  H05K1/0287 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0784 ,  H05K2201/09236 ,  H05K2201/10106

    Abstract: The invention relates to an electronic network comprising a row of two or more electronic components (121, 122, 123) each having an input terminal (131, 141) and an output terminal (132, 142). All input terminals are interconnected with a conductive input line (151), and all output terminals are interconnected with a conductive output line (152), the input and output lines having a uniform and substantially the same electrical resistance per unit length. The input line is arranged to allow electric charge to flow to each electronic component via the input terminal (131) of the first electronic component (121), and the output line is arranged to allow electric charge to flow away from each electronic component via the output terminal (142) of the last electronic component (123). The electronic network enables a uniform performance of the electronic components, particularly when the input and output lines have a relatively high electrical resistance. The electronic network is therefore particularly suitable for use in an electronic textile (100), wherein the input and output lines are electrically conductive yarns that are interwoven in a textile carrier (110) on which the electronic components are mounted.

    Abstract translation: 本发明涉及一种电子网络，包括一排两个或多个电子部件（121,122,123），每个电子部件具有输入端子（131,141）和输出端子（132,142）。 所有输入端子与导电输入线路151互连，所有输出端子与导电输出线路（152）互连，输入和输出线路每单位长度具有均匀且基本相同的电阻。 输入线被布置成允许电荷经由第一电子部件（121）的输入端子（131）流动到每个电子部件，并且输出线被布置成允许电荷经由所述电子部件从每个电子部件流出 输出终端（142）。 电子网络能够实现电子部件的均匀性能，特别是当输入和输出线路具有相对较高的电阻时。 因此，电子网络特别适用于电子纺织品（100），其中输入和输出线是交织在其上安装有电子部件的纺织品载体（110）中的导电纱线。

    ELECTRONIC TEXTILE WITH POWER DISTRIBUTING STRUCTURE
    157.
    发明申请
    ELECTRONIC TEXTILE WITH POWER DISTRIBUTING STRUCTURE 审中-公开
    电力纺织与功率分布结构

    公开(公告)号：WO2010026511A1

    公开(公告)日：2010-03-11

    申请号：PCT/IB2009/053744

    申请日：2009-08-27

    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  BHATTACHARYA, Rabin ,  VAN PIETERSON, Liesbeth

    Inventor： BHATTACHARYA, Rabin ,  VAN PIETERSON, Liesbeth

    IPC: H05K1/00

    CPC classification number: H05K1/038 ,  D03D1/0088 ,  D10B2401/16 ,  H05K1/0263 ,  H05K1/0289 ,  H05K1/189 ,  H05K3/12 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106

    Abstract: An electronic textile (300;400) comprising a textile substrate (102) having at least a first set of textile substrate conductors (202a-f,203a-e;403) each being arranged to enable electrical connection of an electronic device (209;401) thereto. The electronic textile further includes a first power distributing structure (301;405) arranged in electrical contact with each of the textile substrate conductors in the first set (202a-f,203a-e;403), and connectable to an external power source (210). The power distributing structure (301;405) has a substantially lower resistivity than each of the textile substrate conductors (202a-f,203a-e;403) to allow for an even distribution among the textile substrate conductors of power from the external power source (210).

    Abstract translation: 电子纺织品（300; 400）包括具有至少第一组织物基底导体（202a-f，203a-e; 403）的织物基底（102），每个织物基底导体被布置成使电子装置（209; 401）。 电子纺织品还包括与第一组（202a-f，203a-e; 403）中的每个织物基底导体电接触的第一配电结构（301; 405），并且可连接到外部电源 210）。 功率分配结构（301; 405）具有比每个织物基底导体（202a-f，203a-e; 403）显着更低的电阻率，以允许来自外部电源的电力的纺织物基底导体之间的均匀分布 （210）。

    MANUFACTURING PROCESS: HOW TO CONSTRUCT CONSTRAINING CORE MATERIAL INTO PRINTED WIRING BOARD
    158.
    发明申请
    MANUFACTURING PROCESS: HOW TO CONSTRUCT CONSTRAINING CORE MATERIAL INTO PRINTED WIRING BOARD 审中-公开
    制造工艺：如何将约束核心材料构建成印刷线路板

    公开(公告)号：WO2006099554A3

    公开(公告)日：2009-04-16

    申请号：PCT/US2006009597

    申请日：2006-03-15

    Applicant: CORE TECHNOLOGIES INC C ,  VASOYA KALU K

    Inventor： VASOYA KALU K

    IPC: H05K3/30

    CPC classification number: H05K3/4641 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2203/056 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T156/1062

    Abstract: Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring 'boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.

    Abstract translation: 公开了用于制造包括导电约束芯的印刷线路板的工艺。 几个过程使得工具使用的工具孔能够精确地对准用于对用于形成成品印刷线路板的各种面板和子组件进行处理。 还讨论了对Gerber文件的修改，可以提高制造成本并提供检测印刷线路板的面板阵列中的有缺陷的印刷线路板的能力。 本发明的一个实施例包括使用至少一对参考物并使导电材料面板中的工具孔对准编织的导电材料编织板相对于工具表面的织物。

    BUILD-UP PRINTED WIRING BOARD SUBSTRATE HAVING A CORE LAYER THAT IS PART OF A CIRCUIT
    160.
    发明申请
    BUILD-UP PRINTED WIRING BOARD SUBSTRATE HAVING A CORE LAYER THAT IS PART OF A CIRCUIT 审中-公开
    具有作为电路部分的芯层的建筑印刷布线基板

    公开(公告)号：WO2008008552A3

    公开(公告)日：2009-01-08

    申请号：PCT/US2007016210

    申请日：2007-07-16

    Applicant: STABLCOR INC ,  VASOYA KALU K

    Inventor： VASOYA KALU K

    IPC: H01R12/04 ,  H05K1/11 ,  H05K3/36

    CPC classification number: H05K3/4608 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/11 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2224/0401

    Abstract: Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates (200) having a core layer (10) that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole (25) drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer (36) including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole (45).

    Abstract translation: 描述了用于制造集成电路的集成电路和工艺，其使用具有作为印刷线路板的电路的一部分的芯层（10）的印刷线路板基板（200）。 在多个实施例中，芯层由碳复合材料构成。 在几个实施例中，描述了在要求高密度间隙孔（25）钻孔的设计中增加芯层的完整性的技术。 本发明的一个实施例包括芯层，其包括导电材料和形成在芯层的外表面上的至少一个堆积布线部分。 此外，积聚部分包括至少一个微布线层（36），其包括电路，该电路通过电镀通孔（45）电连接到芯层中的导电材料。

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