公开(公告)号：US3625730A

公开(公告)日：1971-12-07

申请号：US3625730D

申请日：1968-05-06

Applicant: HOOKER CHEMICAL CORP

Inventor： LEE SUNG KI

IPC: C01B25/06 ,  C23C18/16 ,  D06Q1/04 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  B44D1/18 ,  H05K1/00

CPC classification number: H05K3/38 ,  C01B25/06 ,  C23C18/1605 ,  C23C18/2086 ,  D06Q1/04 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K3/188 ,  H05K2201/0344 ,  H05K2201/0347 ,  Y10S428/901 ,  Y10T428/31692

Abstract: PRINTED CIRCUITS, INTEGRATED CIRCUITS, RESISTORS, THERMOCOUPLES, CONDENSERS, SUPERCONDUCTORS, ELECTROFORMED MATERIALS, AND THE LIKE ARE PRODUCED BY PROVIDING A PLASTIC OR SUBSTANTIALLY NON-METALLIC SUBSTRATE WITH A METAL PHOSPHIDE; APPLYING A RESIST; REMOVING THE UNPROTECTED METAL PHOSPHIDE; DISSOLVING THE RESIST; AND SUBJECTING THE SUBSTRATE TO ELECTROLESS OR ELECTROLYTIC TREATMENT.

公开(公告)号：US3514538A

公开(公告)日：1970-05-26

申请号：US3514538D

申请日：1968-11-01

Applicant: INTERN ELECTRONICS RESEARCH CO

Inventor： CHADWICK DONALD H ,  APODACA RUBEN T

IPC: C23C18/16 ,  H05K1/05 ,  H05K1/09 ,  H05K3/06 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K1/02

CPC classification number: C23C18/1653 ,  C23C18/1605 ,  H05K1/056 ,  H05K1/09 ,  H05K3/062 ,  H05K3/181 ,  H05K3/381 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/0209 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2203/025 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10S205/92

公开(公告)号：US3502449A

公开(公告)日：1970-03-24

申请号：US3502449D

申请日：1967-07-20

Applicant: GEN DYNAMICS CORP

Inventor： PHILLIPS EUGENE

IPC: C25D5/56 ,  H01B1/00 ,  H01P11/00 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B32B15/08

CPC classification number: H05K3/384 ,  C25D5/56 ,  H01B1/00 ,  H01P11/00 ,  H05K1/032 ,  H05K3/181 ,  H05K2201/0158 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10S205/927 ,  Y10S428/934 ,  Y10S428/935 ,  Y10S428/936 ,  Y10S428/941 ,  Y10T428/12486 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12778 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12986 ,  Y10T428/31692

公开(公告)号：US3207127A

公开(公告)日：1965-09-21

申请号：US19919362

申请日：1962-05-31

Applicant: XEROX CORP

Inventor： SMITH FREDERICK HENRY JR

IPC: C23C18/16 ,  H01B1/00 ,  H01L49/02 ,  H05K1/16 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18

CPC classification number: H05K3/187 ,  C23C18/1632 ,  H01B1/00 ,  H01L49/02 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0085 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0326 ,  H05K2201/0344 ,  H05K2203/0165 ,  H05K2203/0315 ,  H05K2203/1105 ,  H05K2203/121 ,  H05K2203/1536

公开(公告)号：EP2120520A3

公开(公告)日：2010-06-02

申请号：EP09000433.4

申请日：2009-01-14

Applicant: LG Electronics Inc.

Inventor： Yum, Jungsup ,  Ko, Dongki

IPC: H05K3/18 ,  H05K3/42 ,  H05K1/14 ,  H05K1/00

CPC classification number: H05K3/181 ,  H05K1/0393 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/09827 ,  Y10T428/12375 ,  Y10T428/12396 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12847 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944

Abstract: A flexible film (100) and a display device including the same are disclosed. The flexible film includes an insulating film (110) including at least one hole (120). The insulating film further includes a first surface (111a) corresponding to an inner circumferential surface of the hole, a second surface (111b) corresponding to an upper surface of the insulating film, and a third surface (111c) corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer (131) and a second metal layer (132) that is positioned on the first surface and at least one of the second and third surfaces. A thickness (T1) of the first metal layer is smaller than a thickness (T2) of the second metal layer.

公开(公告)号：EP2007931A4

公开(公告)日：2010-03-10

申请号：EP06848028

申请日：2006-12-21

Applicant: MACDERMID INC

Inventor： WOJTASZEK MARK ,  WATKOWSKI JAMES ,  LARSON GARY B ,  KUKANSKIS PETER

IPC: C25D5/10 ,  H05H1/00

CPC classification number: H05K3/181 ,  C08J7/12 ,  C08J7/123 ,  C08J2379/08 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  H05K1/0346 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/097

Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

公开(公告)号：EP2146561A1

公开(公告)日：2010-01-20

申请号：EP09000585.1

申请日：2009-01-16

Applicant: LG Electronics Inc.

Inventor： Yum, Jungsup ,  Ko, Dongki

IPC: H05K3/42 ,  H05K3/00

CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/0032 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2201/09827 ,  Y10T428/24331

Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film and first and second metal layers on the insulating film. The insulating film including at least one hole, a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The first metal layer and the second metal layer are positioned on the first surface and at least one of the second and third surfaces. An angle between the first surface and the second surface is equal to or greater than an angle between the first surface and the third surface.

Abstract translation: 公开了一种柔性膜和包括该柔性膜的显示装置。 柔性膜包括绝缘膜以及绝缘膜上的第一和第二金属层。 绝缘膜包括至少一个孔，与孔的内周表面对应的第一表面，与绝缘膜的上表面对应的第二表面以及与绝缘膜的下表面对应的第三表面。 第一金属层和第二金属层位于第一表面和第二和第三表面中的至少一个上。 第一表面与第二表面之间的角度等于或大于第一表面与第三表面之间的角度。

公开(公告)号：EP2129199A1

公开(公告)日：2009-12-02

申请号：EP09000582.8

申请日：2009-01-16

Applicant: LG Electronics Inc.

Inventor： Yum, Jungsup ,  Ko, Dongki

IPC: H05K3/42

CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/422 ,  H05K2201/0344 ,  H05K2201/09827

Abstract: A method of manufacturing a flexible film is disclosed. The method includes (a) forming at least one hole on an insulating film, (b) after the step (a), forming a first metal layer on a first surface corresponding to an inner circumferential surface of the hole, and at least one of a second surface corresponding to an upper surface of the insulating film and a third surface corresponding to a lower surface of the insulating film, and (c) forming a second metal layer on the first metal layer. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract translation: 公开了制造柔性膜的方法。 该方法包括：（a）在绝缘膜上形成至少一个孔，（b）在步骤（a）之后，在对应于该孔的内周表面的第一表面上形成第一金属层，以及至少一个 对应于绝缘膜的上表面的第二表面和与绝缘膜的下表面对应的第三表面，以及（c）在第一金属层上形成第二金属层。 第一金属层的厚度小于第二金属层的厚度。

公开(公告)号：EP1923488A3

公开(公告)日：2009-05-27

申请号：EP08152453.0

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A process for manufacturing a multilayer printed circuit board comprises a step for providing openings in an interlayer insulating layer (4002), and a step for filling up the openings with a plating metal to construct via holes (4007) and, at the same time, build up an upper-layer conductor layer (4005). The electroplating is performed using an aqueous solution containing a metal ion and 0.1 to 1.5 mmol/L of at least one additive selected from the group consisting of thioureas, cyanides and polyalkylene oxides as a plating solution.

Abstract translation: 用于制造多层印刷电路板的工艺包括在层间绝缘层（4002）中提供开口的步骤以及用电镀金属填充开口以构建通孔（4007）的步骤，并且同时， 建立上层导体层（4005）。 电镀使用含有金属离子和0.1至1.5mmol / L的至少一种选自硫脲，氰化物和聚亚烷基氧化物的添加剂的水溶液作为电镀液来进行。

公开(公告)号：EP2007931A1

公开(公告)日：2008-12-31

申请号：EP06848028.4

申请日：2006-12-21

Applicant: MacDermid, Incorporated

Inventor： WOJTASZEK, Mark ,  WATKOWSKI, James ,  LARSON, Gary, B. ,  KUKANSKIS, Peter

IPC: C25D5/10 ,  H05H1/00

CPC classification number: H05K3/181 ,  C08J7/12 ,  C08J7/123 ,  C08J2379/08 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  H05K1/0346 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/097

Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.