公开(公告)号：EP1056319A2

公开(公告)日：2000-11-29

申请号：EP00109876.3

申请日：2000-05-10

Applicant: SEW-EURODRIVE GMBH & CO.

Inventor： Rusnak, Reinhold

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2203/0455

Abstract: Tochterplatine zum Einsetzen in eine Mutterplatine, wobei mindestens eine Lötverbindung zwischen Tochterplatine und Mutterplatine besteht, wobei die Tochterplatine mindestens zwei Zungen aufweist, die in Bohrlöcher der Mutterplatine einsetzbar sind.

Abstract translation: 主板（1）具有设置在金属化垫（6）中间的多个钻孔（5）。 子板（具有与孔相同间距的突出凸耳制成，表面有金属轨道（3），插入时，表面焊接在一起。

公开(公告)号：EP0697804B1

公开(公告)日：2000-02-09

申请号：EP95108378.1

申请日：1995-06-01

Applicant: KRONE Aktiengesellschaft

Inventor： Kerndlmaier, Walter, Dr.

IPC: H05K1/02 ,  H01R24/00

CPC classification number: H05K1/0228 ,  H01R4/2429 ,  H01R12/721 ,  H01R13/6466 ,  H01R13/6469 ,  H01R2201/16 ,  H04Q1/142 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09172 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10189

公开(公告)号：EP0651598B1

公开(公告)日：1999-06-30

申请号：EP94203095.8

申请日：1994-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Frisch, Wilhelm ,  Kaiser, Werner, Dipl.-Ing. (TU) ,  Ott, Gerhard, Dipl.-Ing. (FH) ,  Kettschau, Hans-Jürgen, Dipl.-Ing. ,  Ludwig, Uwe, Dipl.-Ing. (FH) ,  Ziegler, Bernhard, Dipl.-Ing. (FH)

IPC: H05K1/14 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0278 ,  H05K1/05 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2203/1572 ,  H05K2203/302

公开(公告)号：EP0710432A1

公开(公告)日：1996-05-08

申请号：EP94914305.0

申请日：1994-05-18

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H01L21 ,  H01L23 ,  H05K3 ,  H05K1

CPC classification number: H05K3/403 ,  H01L21/4857 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0041 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/363 ,  H05K3/427 ,  H05K3/428 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09172 ,  H05K2203/0554 ,  H05K2203/0557 ,  Y10T29/49121 ,  Y10T29/49171 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A process is disclosed for manufacturing printed circuit boards, printed circuit foils and semifinished products for printed circuit boards and printed circuit foils from blanks with electroconductive layers (7, 8) that may be structured into conductive patterns and substrates (4) that may be structured for forming connecting means (V), profiles (K) and conductive patterns (L). The connecting means (V), profiles (K) and conductive patterns (L) are structured at the same time or in the same process steps on the blanks. The connecting means (V) and the profiles (K) are part of the structured substrate (4) of the blanks. The electric or mechanical connecting means (V) are placed in a position in which they may be connected and the finished conductive patterns (L) may be detached around the profiles (K).

公开(公告)号：EP0651598A1

公开(公告)日：1995-05-03

申请号：EP94203095.8

申请日：1994-10-25

Applicant: Philips Patentverwaltung GmbH ,  PHILIPS ELECTRONICS N.V.

Inventor： Frisch, Wilhelm ,  Kaiser, Werner, Dipl.-Ing. (TU) ,  Ott, Gerhard, Dipl.-Ing. (FH) ,  Kettschau, Hans-Jürgen, Dipl.-Ing. ,  Ludwig, Uwe, Dipl.-Ing. (FH) ,  Ziegler, Bernhard, Dipl.-Ing. (FH)

IPC: H05K1/14 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0278 ,  H05K1/05 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2203/1572 ,  H05K2203/302

Abstract: Die Erfindung bezieht sich auf ein elektronisches Schaltungsmodul mit einer Leiterplatte (1) mit einer elektrisch isolierende Schicht (2), die eine erste Metallschicht zur Bildung von Leiterbahnen und zum Tragen von oberflächenmontierbaren Bauelementen aufweist.
Um den Platzbedarf des elektronischen Schaltungsmoduls zu verringern wird vorgeschlagen, daß die Leiterplatte (1) mindestens eine Biegekante aufweist, an der die elektrisch isolierende Schicht eine Vertiefung aufweist und um die ein Abschnitt der Leiterplatte umgebogen ist.

Abstract translation: 本发明涉及具有电绝缘层（2）的印刷电路板（1）的电子电路模块，其具有第一金属层以形成导体轨道，并且为了支撑表面安装的部件（表面安装 设备，SMD）。 为了减少电子电路模块的空间要求，提出了印刷电路板（1）具有至少一个弯曲边缘，电绝缘层在其上具有凹陷，并且印刷电路板的一部分 弯曲。

公开(公告)号：EP0578737A1

公开(公告)日：1994-01-19

申请号：EP92909587.0

申请日：1992-04-03

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： PLÖHN, Günter ,  TRAPP, Burkhard

IPC: H01R12 ,  H01R4 ,  H01R33 ,  H05K1 ,  H05K7 ,  H05K3

CPC classification number: H01R12/714 ,  H01R12/62 ,  H01R12/79 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K7/1061 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/10189

Abstract: Système d'interface pour la fixation sur carte comprenant une feuille polymère souple munie d'au moins un conducteur adapté pour se raccorder au conducteur d'une carte à circuits imprimés ainsi qu'à un élément de contact associé à un composant électrique sur ladite carte.

公开(公告)号：EP0575806A2

公开(公告)日：1993-12-29

申请号：EP93109124.3

申请日：1993-06-07

Applicant: International Business Machines Corporation

Inventor： Cipolla, Thomas Mario ,  Coteus, Paul William ,  Damianakis, Ioannis ,  Johnson, Glen Walden ,  Matthew, Linda Carolyn ,  Mok, Lawrence Shungwei ,  Ledermann, Peter Gerard

IPC: H01L25/065

CPC classification number: H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H01L2924/00

Abstract: This invention relates to three dimensional packaging of integrated circuit chips (306) into stacks to form cube structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate (300) having a plurality of conductors (316) one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures (318) can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contains solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate (302) surface or the pin-like structures can be adapted for insertion into apertures (320) in a second substrate. The second substrate provides a means for electrically interconnecting a plurality of these cubes. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cube.

Abstract translation: 本发明涉及集成电路芯片三维封装成堆叠以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在该侧面延伸的至少一个侧面上具有电导体的第一基板的突起形成。 或者，销状结构可以由导体形成，该导体从第一衬底的边缘的两侧悬臂相对，两侧的导体对准并间隔开第一衬底厚度。 这些空间包含焊料并形成焊料加载的针状结构。 针状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些立方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与立方体的相对侧紧密接触。

公开(公告)号：EP0574715A1

公开(公告)日：1993-12-22

申请号：EP93107999.0

申请日：1993-05-17

Applicant: International Business Machines Corporation

Inventor： Busacco, Raymond Archie ,  Chapin, Fletcher William ,  Dranchak, David William ,  Molla, Jaynal Abedin ,  Saxenmeyer Jr.,George John ,  Topa, Robert David

IPC: H01R13/24 ,  H01R4/58 ,  H01R4/26 ,  H01R9/07 ,  H01R43/16

CPC classification number: H01R13/2435 ,  H01R4/26 ,  H01R12/714 ,  H01R13/03 ,  H01R43/16 ,  H05K1/118 ,  H05K3/365 ,  H05K3/403 ,  H05K2201/0373 ,  H05K2201/09172 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: A method of forming conductive end portions on a flexible circuit member (15) having a dielectric layer (19) (e.g., polyimide) with at least one conductive element (41, 43, 45) (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.

Abstract translation: 具有介电层（19）的柔性电路构件（15）上形成导电端部与至少一个导电元件（41，43，45），（例如，铜）在其上的方法，（例如，聚酰亚胺）。 该方法包括通过两个电介质和传导元件上开口形成（例如，冲压），提供电的（例如，添加剂电镀）进行所述开口的内表面上层，提供（例如，电镀）树突元件上的多个步骤 该导电层的表面上，随后去除（例如，冲压）求DASS的电介质和导电元件的一部分管芯FORMED树突元件（例如，钯）从柔性电路的导电端部的项目。

公开(公告)号：EP0511474A1

公开(公告)日：1992-11-04

申请号：EP92103856.8

申请日：1992-03-06

Applicant: WILO GmbH

Inventor： Lütkenhaus, Norbert ,  Kech, Hansjürgen ,  Tolksdorf, Frank

IPC: H02K5/22 ,  H01R23/66

CPC classification number: H01R12/777 ,  H02K5/225 ,  H02K2211/03 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/052 ,  H05K2201/09172 ,  H05K2201/09709 ,  H05K2201/1009

Abstract: Es handelt sich um eine Elektrische Verbindung zwischen einem Elektromotor und einem Anschlußteil wie einem Anschlußkasten (2) oder einer Steckeraufnahme (6), wobei sie eine Leiterfolie (8) mit mehreren zueinander parallelen Leiterbahnen aufweist.

Abstract translation: 本发明涉及一种电动马达与连接盒（2）或插头保持架（6）之间的连接部分之间的电连接，所述连接件具有导电膜（8），导电膜（8）具有多个平行于一个 另一个。

公开(公告)号：EP0284151A3

公开(公告)日：1990-02-07

申请号：EP88200504.4

申请日：1988-03-18

Applicant: CROUZET S.p.A.

Inventor： Thepault, Claude

IPC: H01R9/07 ,  H05K3/36

CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/09172 ,  H05K2201/10189 ,  H05K2201/10295

Abstract: Electrical interface device for washing and drying machines and the like, composed of at least one rigid plane element, to which there are firmly applied one or more flexible printed circuits, electric­ally connected to one another and to the electromechanical and/or electronic programming component of the machine; the edges of said rigid plane element and of said flexible printed circuits being shaped with alternating slots and teeth, to the last-named of which there are brought the terminals of the electrical paths of the cir­cuits, forming in this manner zones adapted for the insertion of electrical connectors of low and high power.