公开(公告)号：WO2004107832A1

公开(公告)日：2004-12-09

申请号：PCT/US2004/015799

申请日：2004-05-20

Applicant: RF MICRO DEVICES, INC.

Inventor： WALKER, Jeffrey, Scott ,  BULLIS, Joseph, Byron

IPC: H05K3/32

CPC classification number: H05K3/321 ,  H01L24/29 ,  H01L24/32 ,  H01L2924/01029 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present invention relates to electrically attaching a surface mount device (10) to a mounting structure (12) via their respective contact pads (14, 16) using an attach material (28), such as solder or conductive epoxy, which includes a filler material (30). In general, the filler material is relatively solid and granular shaped, wherein the diameter of the filler material controls a mounting distance (d) between the surface mount device and the mounting structure. The filler allows a desired distance to be maintained during initial placement of the surface mount device and any subsequent reheating.

Abstract translation: 本发明涉及通过使用诸如焊料或导电环氧树脂的附着材料（28），通过它们各自的接触焊盘（14,16）将表面安装装置（10）电连接到安装结构（12），其包括填料 材料（30）。 通常，填充材料相对固体和颗粒状，其中填充材料的直径控制表面安装装置和安装结构之间的安装距离（d）。 填充物允许在表面安装装置的初始放置期间和随后的再加热期间保持期望的距离。

公开(公告)号：WO2004052547A3

公开(公告)日：2004-12-02

申请号：PCT/US0338614

申请日：2003-12-05

Applicant: SURFECT TECHNOLOGIES INC ,  GRIEGO THOMAS P

Inventor： GRIEGO THOMAS P

IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34 ,  C25B11/04

CPC classification number: H01L21/76898 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  C25D7/123 ,  C25D15/00 ,  C25D15/02 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/2885 ,  H01L21/76877 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/09572 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/104 ,  Y10T428/12063 ,  B22F1/025 ,  B22F1/0088 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For. solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

Abstract translation: 使用涂覆和/或磁性颗粒沉积包括焊点，凸块，通孔，结合环等结构的方法。 颗粒可以用可焊接材料涂覆。 对于。 焊料回流焊接材料之后，焊料可以包括未熔化的颗粒在基质中，从而增加接头的强度并降低连接阵列的间距。 颗粒和涂层可形成较高熔点的合金，允许多次随后的回流步骤。 颗粒和/或涂层可以是磁性的。 可以在沉积期间施加外部磁场以精确地控制颗粒装载和沉积位置。 因此，具有不相容的电位的元件可以在一个步骤中电沉积。 使用这样的领域允许填充诸如通孔的高纵横比结构，而不需要结构的完全种子金属化。 而且，由涂覆有催化材料的磁性颗粒组成的催化剂，任选地包括中间层。

公开(公告)号：WO2004065050A2

公开(公告)日：2004-08-05

申请号：PCT/US2004/000834

申请日：2004-01-14

Applicant: MOLEX INCORPORATED ,  KEYSER, Frank ,  FUERST, Robert

Inventor： KEYSER, Frank ,  FUERST, Robert

IPC: B23K

CPC classification number: B23K35/0244 ,  B23K35/025 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: A system and method are disclosed for providing a solder joint between a pair of electrical devices which have juxtapositionable solderable portions. A solder material is provided between the solderable portions at the solder joint. A spacer material is suspended in the solder material to maintain the electrical devices spaced a predetermined distance from each other at the solder joint. The spacer material has a melting point higher than that of the solder material.

Abstract translation: 公开了一种系统和方法，用于在具有可并置的可焊接部分的一对电气装置之间提供焊接接头。 在焊点处的可焊接部分之间提供焊料材料。 间隔件材料悬挂在焊接材料中以保持电气装置在焊接点处彼此间隔预定距离。 间隔材料的熔点高于焊料材料的熔点。

公开(公告)号：WO2003032335A1

公开(公告)日：2003-04-17

申请号：PCT/US2002/032654

申请日：2002-10-11

Applicant: LITTELFUSE, INC.

Inventor： HARRIS IV, Edwin, James

IPC: H01C7/00

CPC classification number: H01C7/12 ,  H01C7/027 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0738 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49172

Abstract: The present invention provides an improved voltage variable material ("VVM"). More specifically, the present invention provides an improved printed circuit board substrate, an improved device having circuit protection an improved data communications cable having circuit protection and a method for mass producing devices employing the VVM substrate of the present invention. The VVM substrate eliminates the need for an intermediate daughter or carrier board by impregnating conductive particles and possibly semiconductive and/or insulative particles associated with known volatage variable materials into the varnish or epoxy resin associated with known printed circuit board substrates.

Abstract translation: 本发明提供了一种改进的电压可变材料“VVM”。 更具体地，本发明提供一种改进的印刷电路板基板，具有电路保护的改进的装置，具有电路保护的改进的数据通信电缆以及使用本发明的VVM基板的批量生产装置的方法。 VVM基板通过将与已知的挥发性可变材料相关联的导电颗粒和可能的半导体和/或绝缘颗粒浸渍到与已知印刷电路板基底相关联的清漆或环氧树脂中而不需要中间子体或载体板。

公开(公告)号：WO02049797A1

公开(公告)日：2002-06-27

申请号：PCT/JP2001/011152

申请日：2001-12-19

IPC: B23K3/06 ,  B23K35/14 ,  H05K3/34 ,  H01L21/52

CPC classification number: H01L24/01 ,  B23K3/063 ,  B23K2201/40 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/292 ,  H01L2224/29211 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/3478 ,  H05K2201/0215 ,  H05K2203/0143 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/0425 ,  Y10T428/12528 ,  Y10T428/12708 ,  Y10T428/12903 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/29298

Abstract: Solder foil formed by rolling metal particles such as Cu particles and a material containing Sn particles as solder particles is suitable for high-temperature-side solder-joining in a temperature-step solder-joining, and a semiconductor device and an electronic device obtained by using such solder joining are excellent in mechanical characteristics and reliability.

Abstract translation: 通过使诸如Cu颗粒的金属颗粒和含有Sn颗粒的材料作为焊料颗粒而形成的焊料箔适合于温度 - 步骤焊接中的高温侧焊接，以及半导体器件和通过 使用这样的焊料接合机械特性和可靠性优异。

公开(公告)号：WO01017320A1

公开(公告)日：2001-03-08

申请号：PCT/US2000/021672

申请日：2000-08-08

IPC: C25D5/54 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K3/18 ,  H05K3/42

CPC classification number: H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A device includes a substrate (10) comprising a voltage switchable dielectric material. A current carrying formation (30) is formed on a plurality of selected sections of a surface of the substrate. Another device includes a substrate (310) comprising a voltage switchable dielectric material. The substrate includes a first surface (312) and a second surface (313) opposite to the first surface. A via (350) extends between the first surface (312) and the second surface (313) of the substrate. A current carrying formation (330, 340) is formed on a plurality of selected sections of the first and second surfaces (312, 313), as well as on a surface of the substrate defining the vias (350) to extend an electrical connection from the first surface (312) to the second surface (313).

Abstract translation: 一种器件包括具有可切换电介质材料的衬底（10）。 载流层（30）形成在基板的表面的多个选定部分上。 另一装置包括包括可切换电介质材料的衬底（310）。 基板包括与第一表面相对的第一表面（312）和第二表面（313）。 通孔（350）在基板的第一表面（312）和第二表面（313）之间延伸。 电流承载结构（330,340）形成在第一和第二表面（312,313）的多个选定部分上，以及在限定通孔（350）的基板的表面上，以从 第一表面（312）到第二表面（313）。

公开(公告)号：WO01008458A1

公开(公告)日：2001-02-01

申请号：PCT/JP2000/004880

申请日：2000-07-19

IPC: H05K3/00 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4602 ,  H05K3/0035 ,  H05K2201/0215 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

Abstract: A wiring board having a via-on-via structure that is excellent in all of the size, manufacturing process, and electrical connection is manufactured by filling the inside of an inner-layer via (15) with silver paste (17) and forming an upper-layer via (18) which extends over both the inside of the inner layer via and a land (19) by laser beam machining. As a result, the inner dimensions of the via-on-via structure are small. In addition, electrical connection is assured since a wiring pattern (14) directly contacts the land (19) (a wiring pattern (11)) of the inner-layer via (15) even though no cap plating is formed on the inner-layer via (15). Further, the manufacturing process is simple. Furthermore, since the filling material for the inner-layer via (15) is silver paste (17), damage to the inside of the inner-layer via (15) by the laser beam machining for forming the upper-layer via (18) is minimized.

Abstract translation: 通过使用银膏（17）填充内层通孔（15）的内部，制造具有所有尺寸，制造工艺和电连接都优异的通孔通孔结构的布线板，并形成 上层通孔（18），其通过激光束加工在内层通孔的内部和平台（19）上延伸。 结果，通孔通孔结构的内部尺寸小。 此外，由于布线图案14直接接触内层通孔（15）的凸台（19）（布线图案（11）），所以即使在内层上没有形成镀覆，也确保了电连接 通过（15）。 此外，制造过程简单。 此外，由于用于内层通孔（15）的填充材料是银膏（17），通过用于形成上层通孔（18）的激光束加工对内层通孔（15）内部的损坏， 被最小化。

公开(公告)号：WO00016597A1

公开(公告)日：2000-03-23

申请号：PCT/JP1999/005003

申请日：1999-09-14

IPC: C23C18/34 ,  C25D5/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a printed wiring board having a high-density wiring and a highly-reliable connection between conductor layers even if the annealing process is omitted because a conductor circuit made of an electroplating layer excellent in crystallinity and uniform electrodepositability and formed on a base sheet and a via hole are provided. The method comprising forming an interlayer resin insulating layer on a conductor wiring forming board, making an opening for making a via hole in the interlayer resin insulating layer, forming an electroless plating layer (1008) on the interlayer resin insulating layer, applying a resist film (1003) to the layer (1008), forming an electroplating film thereon, removing the resist film, and removing the electroless plating layer by etching so as to form a conductor wiring and a via hole characterized in that the electroless plating layer (1008) serves as a cathode, the plating metal serves as an anode, and electroplating is performed intermittently while maintaining the voltage between the anode and cathode at a constant value.

Abstract translation: 即使退火处理被省略，因为具有高结晶度和电沉积性均匀的电镀层制成的导体电路形成在基底上，所以制造具有高密度布线和导体层之间高可靠性连接的印刷布线板的方法 片和通孔。 该方法包括在导体布线形成基板上形成层间树脂绝缘层，在层间树脂绝缘层上形成通孔的开口，在层间树脂绝缘层上形成化学镀层（1008），涂敷抗蚀膜 （1003）到层（1008），在其上形成电镀膜，去除抗蚀剂膜，并通过蚀刻去除化学镀层以形成导体布线和通孔，其特征在于，化学镀层（1008） 作为阴极，电镀金属用作阳极，并且在将阳极和阴极之间的电压维持在恒定值的同时间歇地进行电镀。

公开(公告)号：WO2017112066A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/057909

申请日：2016-10-20

Applicant: INTEL CORPORATION

Inventor： TOMITA, Yoshihiro ,  HEPPNER, Joshua D. ,  LIFF, Shawna M. ,  MALATKAR, Pramod

IPC: H01L21/677

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

Abstract translation: 根据所公开的实施例，提供了用于实现磁性颗粒嵌入式柔性衬底，用于磁盘的印刷柔性衬底或用于磁化或磁化的磁性载体的电磁载体的方法，系统和设备， 铁磁柔性衬底。 例如，根据一个实施例，公开了用于制造具有一个或多个电互连以与电气设备的引线耦合的柔性基板的装置; 将磁性颗粒或铁磁性颗粒整合到柔性基板中; 在柔性衬底的一个或多个制造过程期间用载体板支撑柔性衬底，其中柔性衬底通过与柔性衬底集成的磁性颗粒或铁磁颗粒之间的吸引磁力与载体板保持平坦， 载板的互补磁吸引力; 以及在完成用于柔性衬底的一个或多个制造工艺之后从柔性衬底移除柔性衬底。 披露了其他相关的实施例。

公开(公告)号：WO2016208401A1

公开(公告)日：2016-12-29

申请号：PCT/JP2016/067162

申请日：2016-06-09

Applicant: 株式会社村田製作所

Inventor： 用水邦明

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0259 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/022 ,  H05K3/303 ,  H05K3/4038 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2201/049 ,  H05K2201/10522

Abstract: 樹脂基板（１０）は、複数の導電性粒子（７）が樹脂（６）に混ぜあわされた絶縁性基材（５）と、絶縁性基材（５）の主面に設けられた複数の導体パターン（８）と、を備える。絶縁性基材（５）の同一の主面上で２つの導体パターン（８）が互いに直接導通することなく隣接する間隔が最も狭い位置での間隔寸法を（Ｌ１）とし、絶縁性基材（５）の異なる主面間で２つの導体パターン（８）が互いに直接導通することなく対向する間隔が最も狭い位置での間隔寸法を（Ｌ２）とすると、（Ｌ１）は（Ｌ２）以上である（Ｌ１≧Ｌ２）。

Abstract translation: 该树脂基板（10）设置有绝缘基体（5），多个导电粒子（7）与树脂（6）混合，多个导体图案（8）设置在 绝缘基座（5）。 当在绝缘基体（5）的同一主表面上相邻但不直接导通的两个导体图案（8）之间的间隙最小的位置处的间隙尺寸表示为（L1）时， 并且在绝缘基体（5）的不同主表面上彼此相邻但不直接导通的两个导体图案（8）之间的间隙最小的位置处的间隙尺寸表示为（L2），（ L1）大于或等于（L2）（L1≥L2）。