公开(公告)号：WO00076280A1

公开(公告)日：2000-12-14

申请号：PCT/ES2000/000151

申请日：2000-04-26

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: In order to ensure manufacturability of electronic circuits with conductor strips having a copper width of over 105 microns, a new series of patterns has been designed for each of the components. A copper surface has been added to said components to receive the adhesive drops thereby compensating for the height difference if the copper surface is bigger than 105 microns. If the width of the areas of the electronic component which are to be connected to the conductive coating of the printed circuit had a width a1, the width according to the invention is now a2, thereby making it possible to deposit the corresponding adhesive material in said strip having width a2.

Abstract translation: 为了确保具有铜宽度超过105微米的导体条的电子电路的可制造性，已经为每个部件设计了一系列新的图案。 如果铜表面大于105微米，则已经将铜表面添加到所述组件以接收粘合剂滴，从而补偿高度差。 如果要连接到印刷电路板的导电涂层的电子部件的区域的宽度具有宽度a1，则根据本发明的宽度现在为a2，从而可以将相应的粘合剂材料沉积在所述 条带宽度为a2。

公开(公告)号：WO00005933A1

公开(公告)日：2000-02-03

申请号：PCT/JP1999/003898

申请日：1999-07-21

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/3452 ,  H01L23/3171 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2924/0002 ,  H05K3/3457 ,  H05K2201/098 ,  H05K2203/0594 ,  H01L2224/05552

Abstract: A printed-circuit board (1) has sufficient adhesion between its substrate (2) and conductor patterns (3) and protects the substrate (2) from damage. Each of the conductor patterns (3) has its bottom (310) with a width (c) greater than the width (d) of its top (320), i.e., its section is tropezoid. The conductor patterns (3) have lower parts (31) covered with solder resist (4) on both sides (315), and upper parts (32) exposed on both sides (325). Solder balls (6) are engaged with both sides (325).

Abstract translation: 印刷电路板（1）在其基板（2）和导体图案（3）之间具有足够的粘合力并且保护基板（2）免受损坏。 每个导体图案（3）具有其宽度（c）大于其顶部（320）的宽度（d）的底部（310），即其部分是针刺形。 导体图案（3）具有在两侧（315）上被阻焊剂（4）覆盖的下部件（31）和在两侧（325）上露出的上部件（32）。 焊球（6）与两侧（325）接合。

公开(公告)号：WO99059761A1

公开(公告)日：1999-11-25

申请号：PCT/JP1998/002239

申请日：1998-05-21

IPC: B23K26/16 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  B23K26/00

CPC classification number: B23K26/16 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/427 ,  H05K2201/098

Abstract: A laser machining method capable of preventing bulging of the wall surfaces of the worked holes by applying a beam smaller in diameter than etched holes in a copper foil, providing a high peel strength by the use of a copper-clad substrate, preventing foreign substances from depositing by irradiating a laser beam from both sides of the substrate, enabling taper to be reduced substantially during the forming of through-holes, and limiting variations in the roundness of the worked holes by attaching a film or the like to the surfaces of the substrate during working.

Abstract translation: 一种激光加工方法，其能够通过在铜箔中施加直径小于蚀刻孔的直径的梁来防止加工孔的壁面膨胀，通过使用覆铜基板提供高的剥离强度，防止异物 通过从衬底的两侧照射激光束进行沉积，使得在形成通孔期间能够基本上减小锥度，并且通过将膜等附着到衬底的表面来限制加工孔的圆度的变化 在工作期间。

公开(公告)号：WO1997017822A1

公开(公告)日：1997-05-15

申请号：PCT/SE1996001424

申请日：1996-11-06

Applicant: STRANDBERG, Reinhold

IPC: H05K03/22

CPC classification number: H05K3/4007 ,  G01R1/07378 ,  H05K3/06 ,  H05K3/22 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/098 ,  H05K2203/0346

Abstract: A method for producing contact pads on pattern boards (8) comprises a plating treatment in order to apply electrically conductive material on the board in correspondence to the desired contact pads (31). The electrically conducting material on the contact pads is subjected to a treatment with an agent capable of etching the material in order to provide chamfering or rounding of peripherical edges (34) of the contact pads.

Abstract translation: 在图案板（8）上制造接触焊盘的方法包括电镀处理，以便在对应于所需的接触焊盘（31）的基板上施加导电材料。 接触垫上的导电材料用能够蚀刻材料的试剂进行处理，以便提供接触垫的外围边缘（34）的倒角或倒角。

公开(公告)号：EP1482771B1

公开(公告)日：2018-11-28

申请号：EP04012773.0

申请日：2004-05-28

Applicant: DOWA METALTECH CO., LTD.

Inventor： Tsukaguchi, Nobuyoshi ,  Kosaka, Michihiro

IPC: H05K3/06 ,  C23F1/20 ,  C04B37/02

CPC classification number: H05K1/0265 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/706 ,  C23F1/20 ,  H01L21/4867 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/067 ,  H05K2201/098 ,  H01L2924/00

Abstract: Producing metal/ceramic circuit board comprises forming metal layer on side(s) of ceramic substrate (10) and resist on metal layer, then etching and removing portion of metal layer with etchant of mixed solution. The metal layer contains aluminum as principal component. The resist layer is shaped. The etchant of mixed solution is prepared by mixing ferric chloride with water without adding any acids to form metal circuit on ceramic substrate side(s). An independent claim is included for metal/ceramic circuit board comprising ceramic substrate and metal circuit plate (12) on side(s) of the substrate. The metal circuit plate has skirt spreading length of = 200 Micro on peripheral edge of the metal circuit plate. The corrugated is the maximum distance between straight lines parallel to the linear peripheral edge of the metal circuit plate to be formed. The metal circuit plate has skirt spreading length of = 200 Micro. The ratio of skirt spreading length to the thickness of the metal circuit plate is = 0.5. The skirt spreading length is a distance between a plane perpendicular to the principal plane of the metal circuit plate at one end of the bottom face of the metal circuit plate on the same side as one end of the bottom face of the metal circuit plate. The distance is positive when bottom face has greater area than the top face.

公开(公告)号：EP2745656B1

公开(公告)日：2018-09-05

申请号：EP12732572.8

申请日：2012-06-18

Applicant: Robert Bosch GmbH

Inventor： DAUB, Martina ,  BRETTSCHNEIDER, Thomas ,  DORRER, Christian

IPC: H05K3/04

CPC classification number: H05K3/046 ,  H05K1/036 ,  H05K3/027 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/09363 ,  H05K2201/098 ,  H05K2201/2072 ,  H05K2203/107 ,  H05K2203/1581

公开(公告)号：EP2656702A4

公开(公告)日：2018-03-07

申请号：EP11850595

申请日：2011-12-23

Applicant: LG INNOTEK CO LTD

Inventor： LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

公开(公告)号：EP3207771A1

公开(公告)日：2017-08-23

申请号：EP15781900.4

申请日：2015-10-12

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： LOOSE, Thomas ,  TURWITT, Martin

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0265 ,  H05K1/0306 ,  H05K2201/0382 ,  H05K2201/09736 ,  H05K2201/098

Abstract: The invention relates to a composite material, comprising a ceramic substrate S having at least one metal layer M on at least one surface of the ceramic substrate S, wherein said metal layer M has a specific shape in the lateral and/or vertical direction. The invention further relates to a corresponding layout of a conducting track and to the use of said layout, to a method for producing at least one conducting track, to a circuit board, and to a stamping and/or embossing tool.

Abstract translation: 本发明涉及一种复合材料，其包括在陶瓷衬底S的至少一个表面上具有至少一个金属层M的陶瓷衬底S，其中所述金属层M在侧向和/或垂直方向上具有特定形状。 本发明进一步涉及导电轨道的相应布局以及所述布局的使用，涉及用于制造至少一个导电轨道，电路板以及冲压和/或压印工具的方法。

公开(公告)号：EP3143847A1

公开(公告)日：2017-03-22

申请号：EP15726023.3

申请日：2015-05-13

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： STAHR, Johannes ,  SCHRITTWIESER, Wolfgang ,  MORIANZ, Mike ,  VOCKENBERGER, Christian ,  LEITGEB, Markus

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  H05K3/12

CPC classification number: H05K1/18 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/115 ,  H05K1/185 ,  H05K3/10 ,  H05K3/1258 ,  H05K3/40 ,  H05K3/4053 ,  H05K2201/09218 ,  H05K2201/098 ,  H05K2201/09854

Abstract: The invention relates to an electronic device (100) having an electrically insulating support structure (102), an electrically conductive conductor path (104) on a surface of the support structure (102), and an electrically conductive contact structure (106) which extends from the surface into the support structure (102) and is electrically connected to the conductor path (104) at a connection point (108), thereby forming a common conductor track (110). The conductor path (104) and the contact structure (106) transition into each other in an enlargement-free manner at the connection point (108).

Abstract translation: 本发明涉及一种具有电绝缘支撑结构，在支撑结构的表面上的导电导体路径以及从表面延伸到支撑结构中并且电连接到导体路径的导电接触结构的电子设备 在连接点处，从而形成公共导体轨迹。 导体路径和接触结构在连接点处以无放大的方式彼此转变。

公开(公告)号：EP3119169A1

公开(公告)日：2017-01-18

申请号：EP15181783.0

申请日：2015-08-20

Applicant: LG Innotek Co., Ltd.

Inventor： BAE, Yun Mi ,  KWON, Soon Gyu ,  KIM, Sang Hwa ,  LEE, Sang Young ,  LEE, Jin Hak ,  LEE, Han Su ,  JEONG, Dong Hun ,  JEONG, In Ho ,  CHOI, Dae Young ,  HWANG, Jung Ho

IPC: H05K3/10 ,  H05K3/24

CPC classification number: H05K1/11 ,  C25D3/38 ,  C25D3/48 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  H05K1/09 ,  H05K3/108 ,  H05K3/181 ,  H05K3/188 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/1184

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract translation: 印刷电路板包括绝缘层，绝缘层上的电路图案以及电路图案上的表面处理层。 表面处理层包括具有比电路图案的顶表面的宽度更宽的宽度的底表面。