公开(公告)号：EP3386278A1

公开(公告)日：2018-10-10

申请号：EP17382183.6

申请日：2017-04-06

Applicant: Valeo Iluminacion

Inventor： ROLDAN, Jose-David ,  LARA-CABEZA, Juan ,  MARTINEZ-PEREZ, Jose-Ramon ,  BORREGO, Maria-Luisa

IPC: H05K1/02 ,  F21S8/10

CPC classification number: H05K1/0295 ,  F21S41/141 ,  H05K1/0206 ,  H05K2201/09945 ,  H05K2201/10106

Abstract: This invention relates to a printed circuit board (1) for an automated vehicle lighting device (10). This printed circuit board (1) comprises a first face (11), a second face (12) opposite to the first face (11), a first connection point (3) and a second connection point (4). The first connection point (3) is located on the first face (11) and is suitable for installing a light source (2), and the second connection point (4) is located on the second face (12) and is suitable for installing a light source (2).

公开(公告)号：EP3054543B1

公开(公告)日：2018-06-20

申请号：EP14860440.8

申请日：2014-10-15

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： HACHIYA, Yoshikazu

IPC: H02G3/08 ,  B60R16/03 ,  H05K1/02 ,  H05K3/46 ,  B60R16/023 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box (10) includes a bus bar circuit unit (12) obtained by arranging a plurality of bus bars (28a to 28g) including a power source-side bus bar (28c) to be connected to a power source line and a ground-side bus bar (28d) to be connected to a ground line on insulated boards (26a, 26b). In the electrical junction box (10), the power source-side bus bar (28c) and the ground-side bus bar (28d) are arranged adjacent to each other, and an oxide deposition inhibiting structure (42) is provided in exposed portions (44a to 44c) of the insulated board (26a) exposed through a gap between the power source-side bus bar (28c) and the ground-side bus bar (28d).

公开(公告)号：EP0691660B1

公开(公告)日：2006-11-15

申请号：EP95303147.3

申请日：1995-05-10

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Goto, Yasushi ,  Tsukagoshi, Isao ,  Ohta, Tomohisa

IPC: H01B1/22 ,  C09J7/02

CPC classification number: H01R13/2414 ,  C09J7/20 ,  C09J9/02 ,  H01B1/22 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01R4/04 ,  H05K3/102 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H01L2924/00

Abstract: Anisotropically electroconductive resin film material, produced by adhering electroconductive particles to an adhering layer formed on a support and fixing therein, and introducing a film-forming resin incompatible with the adhering material between the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

公开(公告)号：EP0709886B1

公开(公告)日：2000-06-28

申请号：EP95402404.8

申请日：1995-10-26

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Caillat, Patrice

IPC: H01L23/498 ,  H01L23/492

CPC classification number: H01L21/6835 ,  H01L23/4922 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/4038 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0733 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2848 ,  H01L2924/00

公开(公告)号：EP0863550A3

公开(公告)日：1999-01-07

申请号：EP98300813.7

申请日：1998-02-04

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： Meola, Carmine G. ,  Johnson, Daniel D. ,  Banks, Donald R. ,  Ameen, Joseph G.

IPC: H01L23/498

CPC classification number: H05K3/3436 ,  H01L23/145 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/4038 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09945 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24826 ,  Y10T428/249958 ,  Y10T428/31544

Abstract: A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.

公开(公告)号：EP0855049A1

公开(公告)日：1998-07-29

申请号：EP97938107.0

申请日：1997-08-01

Applicant: LOCTITE (IRELAND) LIMITED ,  LOCTITE CORPORATION

Inventor： MCARDLE, Ciaran, B. ,  BURKE, Joseph ,  WELCH, Edward, K.

IPC: G03F7 ,  H01R4 ,  H05K3

CPC classification number: H05K3/323 ,  G03F7/34 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01R4/04 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0769 ,  H05K2203/104 ,  Y10T428/26 ,  H01L2924/00

Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.

公开(公告)号：EP0619935B1

公开(公告)日：1998-05-13

申请号：EP93902885.8

申请日：1992-12-30

Applicant: TESSERA, INC.

Inventor： DISTEFANO, Thomas, H. ,  KHANDROS, Igor ,  GRUBE, Gary, W. ,  EHRENBERG, Scott, G.

IPC: H05K1/00 ,  H05K3/02 ,  H01K3/10 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

Abstract: A multi-layer circuit panel assembly is formed by laminating circuit panels (10) with interposers (12) incorporating flowable conductive material (48) at interconnect locations and a flowable dielectric material (30, 38) at other locations. Excess materials are captured in reservoirs (20) in the circuit panels. The flowable materials and reservoirs allow the interposers to compress and take up tolerances in the components. The stacked panels may have contacts (538) on their top surfaces, through conductors (527) extending between top and bottom and terminals (530) connected to the bottom end of each through conductor. The terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact an adjacent panels are aligned with one another, these are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors.

公开(公告)号：EP0737375A1

公开(公告)日：1996-10-16

申请号：EP95901946.0

申请日：1994-11-15

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： KOSKENMAKI, David, C. ,  CALHOUN, Clyde, D.

IPC: H01R11 ,  H01R4 ,  H01R13 ,  H05K3

CPC classification number: H01R13/2414 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/104 ,  Y10T428/1452 ,  Y10T428/25 ,  Y10T428/28

Abstract: The present invention provides electrically conductive sheet materials (10) that contain columns of electrically conductive particles aligned to form continuous columns (19) between lateral faces of the conductive sheet material (10). The particle columns (19) are arranged so that the sheet is conductive through the thickness, but is electrically insulating in lateral directions. The present invention also provides methods by which such electrically conductive sheet materials (10) can be made. The present invention is able to provide conductive pathways in a precise, regular array, at a very fine pitch.

公开(公告)号：EP0620702A2

公开(公告)日：1994-10-19

申请号：EP94810179.5

申请日：1994-03-23

Applicant: DYCONEX PATENTE AG

Inventor： Schmidt, Walter ,  Martinelli, Marco

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K1/0287 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/068 ,  H05K2203/1476

Abstract: Der erfindungsgemässe Kern für elektrische Verbindungssubstrate, insbesondere für Leiterplatten und Folienleiterplatten, weist eine Innenschicht (I) mit einer Säulenstruktur auf und beidseitige, metallische Deckschichten (A, A'), wobei die Säulenstruktur der Innenschicht (I) aus vorteilhafterweise regelmässig angeordneten, voneinander und von den Deckschichten (A, A') beabstandeten, quer zur flächigen Ausdehnung des Kerns gerichteten Säulen (9.1, 9.2) aus einem elektrisch leitenden Material in einer Matrix (6) aus einem elektrisch isolierenden Material besteht. Die Deckschichten (A, A') weisen beispielsweise elektrische Anschlüsse (16, 16', 17, 17') in Form von durchplattierten Sacklöchern (13, 14) an ausgewählte Säulen (9) der Innenschicht (I) auf und sind derart strukturiert, dass sie ein regelmässiges Muster von Anschlüssen (16, 16') an die gegenüberliegende Deckschicht und Anschlüssen (17, 17') an von den Deckschichten isolierte Durchsteiger aufweisen. Dieses Rastermuster kann ein Rastermass in der Gegend von 0,5 mm aufweisen.

Abstract translation: 芯雅丁到本发明的用于电互连衬底，爱特别是对于印刷电路板和柔性印刷电路板，具有内层（I），其具有柱状结构和金属覆盖层（A，A“）上bothsides，列结构 这有利地规则地排列在内层（I）组成的柱（9.1，9.2）的，彼此并从覆盖层（A，A“）相对于横向于所述芯的平面范围间隔开的 并且由在由电绝缘材料制成的基体（6）的导电材料制成。 覆盖层（A，A '）有，例如，电连接（16，16'，17，17“）在镀通盲孔的形式（13，14）在所述内的选择的列（9） 层（I）和在寻求一种方式thatthey具有连接（16，16“），以相反的覆盖层和连接（17，17”）的规则图案被构造成通过连接器其由（由）的绝缘 覆盖层。 这种网格图案可以有大约0.5毫米的网格大小。

公开(公告)号：EP0396522A2

公开(公告)日：1990-11-07

申请号：EP90850153.9

申请日：1990-04-24

Applicant: International Business Machines Corporation

Inventor： Frankeny, Jerome Albert ,  Frankeny, Richard Francis ,  Hermann, Karl ,  Wustrau, Rolf

IPC: H01R43/02 ,  H05K3/36 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K3/321 ,  H01R4/02 ,  H05K3/323 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/361 ,  H05K3/4069 ,  H05K13/0465 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A carrier preferably in the form of a thin insulative and heat-resistant sheet (14) has a plurality of apertures (26) extending therethrough which are preloaded to carry a reflowable electrically conductive solder (28) or paste. Upon positioning the carrier between lands (18-24) of circuit carriers, printed circuit boards, combinations thereof or the like, predetermined electrical interconnections may be effected between such lands by reflow. The electrical interconnection is completed between given upper and lower such lands through the conductive material in a plurality of apertures disposed between the lands. In a preferred embodiment the aperture density relative to the area of the lands to be interconnected is selected to provide redundancy by permitting plural interconnections through apertures to a given land pair. Aperture diameter and amount of reflowable material present therein is further selected whereby upon such reflowing apertures between adjacent pads act as solder dams to prevent undesirable electrical interconnection between such adjacent pads. A system is provided whereby the carrier need not be precisely aligned relative to the land patterns and whereby necessity for precise screening of conductive material to accommodate fine pitch land/pad configurations is eliminated.

Abstract translation: 优选为薄绝缘耐热片（14）形式的载体具有穿过其中的多个孔（26），其被预加载以承载可回流的导电焊料（28）或糊料。 在将载体定位在电路载体，印刷电路板，其组合等的平台（18-24）之间时，可以通过回流在这些焊盘之间实现预定的电互连。 在布置在焊盘之间的多个孔中，通过导电材料在给定的上部和下部这种焊盘之间完成电互连。 在优选实施例中，通过允许通过孔到给定的岸对对多个互连来选择相对于待互连的焊盘区域的孔径密度以提供冗余。 进一步选择孔径和其中存在的可回流材料的量，由此在这种回流之间，相邻焊盘之间的孔隙用作焊接阻挡层，以防止这种相邻焊盘之间的不期望的电互连。 提供了一种系统，其中载体不需要相对于焊盘图案精确地对准，并且由此消除了导电材料的精确筛选以适应细间距焊盘/焊盘构造的必要性。