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    Copper-clad laminate, multilayer copper-clad laminate and process for producing the same
    181.
    发明公开
    Copper-clad laminate, multilayer copper-clad laminate and process for producing the same 失效
    Kupferkaschiertes Laminat，mehrschichtiges kupferkaschiertes Laminat und Verfahren zur Herstellung

    公开(公告)号：EP0797378A3

    公开(公告)日：1998-06-03

    申请号：EP96306670

    申请日：1996-09-13

    Applicant: HITACHI CHEMICAL CO LTD

    Inventor： OKANO NORIO ,  KOBAYASHI KAZUHITO ,  NAKASO AKISHI

    IPC: B32B15/08 ,  H05K1/03 ,  H05K3/46 ,  B32B27/20

    CPC classification number: B32B15/14 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/0373 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0358

    Abstract: A copper-clad laminate comprising an electrically insulating layer comprising a thermosetting resin and electrically insulating whiskers, and a copper foil formed on at least one side of the insulating layer, the insulating layer and copper foil being integrated by thermal press molding, and a multilayer copper-clad laminate having an interlayer circuit therein, which laminate comprises an interlayer circuit plate, a copper foil for an outer circuit, and an electrically insulating layer interposed therebetween, the circuit plate, copper foil and insulating layer being integrated by thermal press molding, and the insulating layer comprising electrically insulating whiskers dispersed in a thermosetting resin, are effective for producing multilayer printed circuit boards with a very reduced thickness and high wiring density.

    Abstract translation: 1.一种覆铜层压板，其特征在于，具有包含热固性树脂和电绝缘晶须的电绝缘层，以及形成在所述绝缘层的至少一侧的铜箔，所述绝缘层和铜箔通过热压成型而一体化， 具有层间电路的覆铜层压板，其层叠体包括层间电路板，外部电路用铜箔和插入其间的电绝缘层，电路板，铜箔和绝缘层通过热压成型一体化， 并且包含分散在热固性树脂中的电绝缘晶须的绝缘层对于制造具有非常小的厚度和高布线密度的多层印刷电路板是有效的。

    METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DEVICE
    183.
    发明申请
    METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DEVICE 审中-公开
    制造柔性和/或可拉伸电子器件的方法

    公开(公告)号：WO2014200428A1

    公开(公告)日：2014-12-18

    申请号：PCT/SG2014/000255

    申请日：2014-06-03

    Applicant: NANYANG TECHNOLOGICAL UNIVERSITY

    Inventor： YAN, Chaoyi ,  LEE, Pooi See

    IPC: H05K1/03 ,  H01L29/12

    CPC classification number: H05K3/0073 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/401 ,  H01L29/413 ,  H01L51/0048 ,  H01L51/50 ,  H02S50/00 ,  H02S50/10 ,  H05K1/0283 ,  H05K1/097 ,  H05K3/207 ,  H05K3/246 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2203/0191 ,  H05K2203/1476 ,  H05K2203/304

    Abstract: A method of manufacturing a flexible electronic device is provided. The method comprises a) filtering a mixture comprising an electrically conducting nanostructured material through a membrane such that the electrically conducting nanostructured material is deposited on the membrane; b) depositing an elastomeric polymerisable material on the electrically conducting nanostructured material and curing the elastomeric polymerisable material thereby embedding the electrically conducting nanostructured material in an elastomeric polymer thus formed; and c) separating the elastomeric polymer with the embedded electrically conducting nanostructured material from the membrane to obtain the flexible electronic device. Flexible electronic device manufactured by the method, and use of the flexible electronic device are also provided.

    Abstract translation: 提供一种制造柔性电子装置的方法。 该方法包括a）通过膜过滤包含导电纳米结构材料的混合物，使得导电纳米结构材料沉积在膜上; b）将弹性体可聚合材料沉积在导电纳米结构材料上并固化弹性体可聚合材料，从而将导电纳米结构材料嵌入如此形成的弹性体聚合物中; 以及c）将所述弹性体聚合物与所述嵌入的导电纳米结构材料从所述膜分离以获得所述柔性电子器件。 还提供了通过该方法制造的柔性电子装置和柔性电子装置的使用。

    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT
    189.
    发明申请
    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT 审中-公开
    焊接电子元件的方法和电子元器件的焊接结构

    公开(公告)号：WO2007055410A1

    公开(公告)日：2007-05-18

    申请号：PCT/JP2006/322902

    申请日：2006-11-10

    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  SAKAI, Tadahiko ,  MAEDA, Tadashi ,  OZONO, Mitsuru

    Inventor： SAKAI, Tadahiko ,  MAEDA, Tadashi ,  OZONO, Mitsuru

    IPC: H05K3/34 ,  B23K35/02

    CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder (8) is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder (8) has a flake or dendrite shape including a core segment (8a) of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment (8b) of the metal with good-wettability for the molten solder and to be solid-solved in the core segment (8a) molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles (18) . Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末（8）混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末（8）具有片状或枝晶状，其包含在比构成焊料凸点的焊料的液相温度高的温度下熔融的金属的芯部（8a）和具有良好的金属的表面部分（8b）的金属粉末 - 熔融焊料的润湿性并固溶在芯部段（8a）中熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔化并固化成变成基本上球形的金属颗粒（18）。 因此，在再流动之后，在易于发生迁移的状态下，金属粉末不会残留在助焊剂残留物中，从而结合了焊料连接性和绝缘保险。

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