公开(公告)号：EP0556184B1

公开(公告)日：1996-02-28

申请号：EP91914556.5

申请日：1991-08-15

Applicant: HILLER, Peter

Inventor： HILLER, Peter

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10659

Abstract: The invention concerns a circuit board with electrical components which are inserted, together with their insulating elements (3), in throughbores (10) in the circuit board (9). The components project out slightly beyond the upper and lower surfaces of the circuit board. The projecting ends have contact surfaces which are soldered to conductions tracks on the circuit board. The lower ends of the components have hemispherically domed or rounded conical tips with contact surfaces which fit into conductor tracks designed as soldering eyes (7) on the circuit board (9) and are soldered to these soldering eyes . The upper ends of the components have several contact surfaces (1.1, 1.2) which are insulated from each other and which are joined to contact elements (2.1, 2.2) projecting out away from the insulating elements (3), the contact elements (2.1, 2.2) being joined by solder (5) at intervals round the bores (10) to conductor tracks (6) on the upper surface of the circuit board.

公开(公告)号：EP0249277A2

公开(公告)日：1987-12-16

申请号：EP87201033.5

申请日：1987-06-02

Applicant: Philips Patentverwaltung GmbH ,  Philips Electronics N.V.

Inventor： Düll, Helmut ,  Flunkert, Horst, Dr.

IPC: H05K3/34 ,  H01C1/148

CPC classification number: H01G2/065 ,  H01C1/148 ,  H01C17/006 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

Abstract: Passives elektrisches, für SMD-Technik geeignetes Bauele­ment mit einem zylindrischen oder quaderförmigen Träger­körper und elektrischen Anschlußkontakten an seinen Enden, die den Trägerkörper rohrförmig umschließen und die Stirn­flächen des Trägerkörpers freilassen.

Abstract translation: 无源电器制品，适合于具有在其端部的圆筒形或平行六面体形承载体和电连接触点，包围支承体SMD技术组件是管状的，并且释放所述承载体的面。

公开(公告)号：US20180359864A1

公开(公告)日：2018-12-13

申请号：US16003474

申请日：2018-06-08

Applicant: PITYU CONTROLS INC.

Inventor： Stevan DOBI

IPC: H05K3/34 ,  H05K1/18 ,  B23K1/00

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10022 ,  H05K2201/10174 ,  H05K2201/10583 ,  H05K2203/048

Abstract: A cradle for a metal electrode leadless face (MELF) device is provided. The cradle can include at least one pad, such as a solder pad, to be connected to a printed circuit board (PCB) or similar board. The pad can be configured to receive a MELF device. Such a configuration can improve positioning and alignment of the MELF device and prevent or reduce movement of the MELF device prior to or during soldering. The pad can include boundaries to engage the MELF device for alignment and to prevent or reduce movement. The boundaries of the pad can include inlets, extensions, troughs, borders, and/or other features to engage the MELF device. Boards including such cradles are also provided. Further, methods of installing a MELF device on a board using a cradle are also provided.

公开(公告)号：US09955604B2

公开(公告)日：2018-04-24

申请号：US14640873

申请日：2015-03-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Seiji Tokii ,  Manabu Tasaki

IPC: H05K1/18 ,  H05K7/02 ,  H05K3/30 ,  H05K13/04 ,  H05K7/00 ,  H05K1/16 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K7/02 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/181 ,  H05K1/182 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K13/04 ,  H05K2201/10007 ,  H05K2201/10159 ,  H05K2201/10583 ,  H05K2201/10674

Abstract: A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.

公开(公告)号：US20180069210A1

公开(公告)日：2018-03-08

申请号：US15426395

申请日：2017-02-07

Applicant: Apple Inc.

Inventor： Nathan J. Bohney ,  Todd L. Mumaw

IPC: H01M2/10 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H01M2/20 ,  H01M10/42

CPC classification number: H01M2/1055 ,  H01M2/204 ,  H01M10/425 ,  H01M2220/30 ,  H05K1/09 ,  H05K1/115 ,  H05K1/117 ,  H05K1/18 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/09009 ,  H05K2201/09027 ,  H05K2201/09181 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10522 ,  H05K2201/10583

Abstract: A streamlined battery pack can contain at least two battery cells. A printed circuit board (PCB) of the battery pack can include a protection control module. The PCB can have castellations along its perimeter in which wires are soldered. The wires can include battery power wires and battery monitoring signal wires. The castellations are sized so that the egress wires can be soldered therein without substantially protruding from the outline of the PCB. The PCB has a surface area that is no greater than an end of the battery pack, and thereby need not exceed the outer diameter of the remainder of the battery pack. The PCB and the other battery pack components may be substantially enveloped in a polyimide material. The components of the battery pack, including the PCB can arranged, sized and configured, such that they do not create protuberances in the enveloping material.

公开(公告)号：US20160344119A1

公开(公告)日：2016-11-24

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

公开(公告)号：US20160295697A1

公开(公告)日：2016-10-06

申请号：US14442105

申请日：2013-10-29

Applicant: KITAGAWA INDUSTRIES CO., LTD.

Inventor： Tatsuya NAKAMURA

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: A capacitor holder comprises: a holding portion having a cylindrical inner wall surface, at least an outer peripheral portion of the inner wall surface being open, the holding portion being configured to hold a capacitor inserted through the opening into an inside of the inner wall surface; a fixed portion formed integrally with the holding portion and positioned opposite to the opening of the holding portion; a pair of fitting grooves formed at a pair of end surfaces of the fixed portion opposed to each other adjacent to the holding portion, the fitting grooves being configured to fittably engage with end edges of a printed circuit board to extend along a surface of the printed circuit board; and a proximity suppressor configured to suppress portions of the fixed portion where the fitting grooves are formed from being brought into proximity each other.

Abstract translation: 电容器保持器包括：具有圆筒形内壁表面的保持部分，内壁表面的至少外周部分是开放的，保持部分构造成将通过开口插入的电容器保持在内壁表面的内部 ; 与所述保持部一体形成并与所述保持部的开口相对定位的固定部; 一对嵌合槽，形成在所述固定部分的相对于所述保持部分相对的一对端面处，所述嵌合槽被配置为与所述印刷电路板的端部边缘适配地接合以沿着所述印刷电路板的表面延伸 电路板; 以及接近抑制器，被配置为抑制形成有嵌合槽的固定部分的彼此接近的部分。

公开(公告)号：US20160148911A1

公开(公告)日：2016-05-26

申请号：US14903858

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

Abstract translation: 提供了一种纳米级LED组件及其制造方法。 首先，独立制造的纳米级LED器件可以对准并连接到彼此不同的两个电极，以解决将具有纳米单元的纳米级LED器件耦合到彼此不同的两个电极的限制 站立状态。 此外，由于LED器件和电极设置在同一平面上，所以可以提高LED器件的光提取效率。 此外，可以调整纳米级LED器件的数量。 第二，由于纳米尺度的LED器件不能立即连接到上电极和下电极，而是要被连接到在同一平面上彼此不同的两个电极，所以光提取效率可以非常改善 。 此外，由于在LED器件的表面上形成单独的层以防止LED器件和电极电短路，所以可以使LED电极组件的缺陷最小化。 此外，为了准备LED装置的非常罕见的缺陷的发生，可以将多个LED器件连接到电极以保持纳米级LED电极组件的原始功能。

公开(公告)号：US20160073507A1

公开(公告)日：2016-03-10

申请号：US14939761

申请日：2015-11-12

Applicant: United States of America as Represented by the Secretary of the Army

Inventor： Bruce V. Hughes

IPC: H05K3/10

CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和有源的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状的心轴上制造，例如圆柱体或球体，以便形成中空弯曲的非平面结构。

公开(公告)号：US08649183B2

公开(公告)日：2014-02-11

申请号：US13024818

申请日：2011-02-10

Applicant: Rodney Austin Green ,  Kevin Craig Bellette ,  Perry Arthur Kelly

Inventor： Rodney Austin Green ,  Kevin Craig Bellette ,  Perry Arthur Kelly

IPC: H05K1/18

CPC classification number: H05K3/30 ,  H01L2924/0002 ,  H05K1/182 ,  H05K13/04 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/10583 ,  H01L2924/00

Abstract: An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.

Abstract translation: 一种电子组件，其包括具有限定开放空间的基板的电路板和具有壳体和多个引线的部件，所述开放空间足够大以至少部分地接收所述部件的壳体。