Abstract:
PURPOSE: An inkjet printer head and method for manufacturing the same is provided to achieve improved productivity and reduce manufacturing cost by arranging a plurality of inkjet nozzles through a single metal plating process. CONSTITUTION: A method comprises a first step of preparing a substrate(201) having an embedded resistor(206) for heating an ink and a bottom metal layer(310) deposited onto the substrate; a second step of spin coating or film coating the photoresistor or polyimide onto the bottom metal layer through a photolithography process, and forming first and second photoresist molds; a third step of forming a preliminary metal barrier layer formed of a Ni-plating layer onto the bottom metal layer, such that the preliminary metal barrier layer has a height corresponding to the height of first and second photoresist molds, and forming a main metal barrier layer(508) in such a manner that the top of the first photoresist mold is completely covered by the Ni-plating layer and the top of the second photoresist mold is not completely covered by the overplating Ni-plating layer, so as to form an inkjet nozzle(207) having a predetermined size and shape; a fourth step of partially etching the first photoresist mold, second photoresist mold and the bottom metal layer, so as to form an ink flow channel(203) within the main metal barrier layer; and a fifth step of partially etching the substrate so as to form a main ink supply path(202) communicated to the ink flow channel.
Abstract:
PURPOSE: A semiconductor device of which area occupied on a substrate is small and of which passive electric device having little serial resistance and large current limit is integrated with a monolithic method is provided. CONSTITUTION: The inductor(1) is composed of three parts which are formed by a single metal plating at the same time; a signal pillar(102) functioned as a path electrically connected with an integrated circuit(100) of a substrate(101); a supporting bar(103) supporting a spiral inductor(104) with a specific number to promote the mechanical stability while manufacturing and using; and the spiral inductor(104) minimizing the electromagnetic influence which can affect the integrated circuit(100) of the lower area and minimizing the signal loss to the substrate(101).
Abstract:
The method for forming a very small n+ type source region by using an oxide film of phosphor silicate glass (PSG) material to prevent the generation of latch-back, comprises the steps of growing an N- epitaxial layer (31) onto an N+ silicon substrate (30) to form a thin gate oxide film layer at a device area to form a gate (34) thereon, injecting Boron ions into the N- epitaxial layer (31) to form a P- body region (32) by heat-treating, forming an N+ region (38), and parallel- connecting the N+ region (38) to the P- body region (32) by using a platinum silicide (39) to form a source (40).
Abstract:
Disclosed are a three dimensional metal device floated over a semiconductor substrate, a circuit thereof, and a manufacturing method thereof. A passive electric device for wireless communications and optical communications, such as a spiral inductor, a solenoid inductor, a spiral transformer, a solenoid transformer, a micro mirror, a transmission line is floated over and apart by a few ten micrometers from the semiconductor substrate. These three dimensional metal devices remarkably decrease a signal loss to the substrate, to thereby enhance the device performance, to allow a modeling of a device separated from the substrate, and to make it possible to form an integrated circuit below the device. Further, the three dimensional metal device is manufactured in a monolithic method on the integrated circuit such that it does not affect on the integrated circuit formed therebelow.
Abstract:
PURPOSE: A solenoid inductor including an air core and a magnetic core is provided to have no limit for length and to be manufactured simply. CONSTITUTION: A method for an air solenoid inductor comprises following steps: a board having conductive lines on its upper surface is prepared(S1 Step); a three dimensional bridge mold is formed on the board by MESD (Multi-Exposure and Single Development) process(S2 Step); an iron bridge is formed on both the three dimensional bridge mold and the board(S3 Step). The method for solenoid inductor having magnetic core consists of: a board having conductive lines on its upper surface is prepared(S1 Step); a sacrificial layer is formed on the board(S2 Step); the board has magnetic core(S3 Step); the three dimensional bridge mold is formed on the board by SD(Single Development) process(S4 Step); the iron bridge is formed on both the three dimensional bridge mold and the board(S3 Step). The solenoid inductor has iron bridge which has both conductive lines and conductive posts in one body and which has no limit for length. As all processes is undertaken below 120 deg.C, it has high compatibility, many kinds of boards can be used for it.