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    CLEANING OF SEMICONDUCTOR PROCESSING SYSTEMS
    12.
    发明专利
    CLEANING OF SEMICONDUCTOR PROCESSING SYSTEMS 未知

    公开(公告)号：SG171606A1

    公开(公告)日：2011-06-29

    申请号：SG2011029022

    申请日：2007-04-26

    Applicant: ADVANCED TECH MATERIALS

    Inventor： DIMEO FRANK JR ,  DIETZ JAMES ,  OLANDER W KARL ,  KAIM ROBERT ,  BISHOP STEVEN E ,  NEUNER JEFFREY W ,  ARNO JOSE I ,  MARGANSKI PAUL J ,  SWEENEY JOSEPH D ,  ELDRIDGE DAVID ,  YEDAVE SHARAD ,  BYL OLEG ,  STAUF GREGORY T

    Abstract: A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the residue and minimally reactive with the materials from which the components of the ion implanter are constructed. When the residue and the material from which the components are constructed is the same, then the gas-phase reactive material may be reactive with both the residue and the component part. Particularly preferred gas- phase reactive materials utilized comprise gaseous compounds such as XeF2, XeF4, XeF6, NF3, IF5, IF7, SF6, C2F6, F2, CF4, KrF2, C12, HC1, C1F3, C102, N2F4, N2F2, N3F, NFH2, NH2F, HOBr, Br2, C3F8, C4F8, C5F8, CHF3, CH2F2, CH3F, COF2, HF, C2HF5, C2H2F4, C2H3F3, C2H4F2, C2H5F, C3F6, and organochlorides such as COC12, CC14, CHC13, CH2C12 and CH3C1.

    Micro-machined thin film hydrogen gas sensor, and method of making and using thesame
    13.
    发明专利
    Micro-machined thin film hydrogen gas sensor, and method of making and using thesame 未知

    公开(公告)号：AU4324400A

    公开(公告)日：2000-08-07

    申请号：AU4324400

    申请日：2000-01-12

    Applicant: ADVANCED TECH MATERIALS

    Inventor： DIMEO FRANK JR ,  BHANDARI GAUTAM

    IPC: G01N21/59 ,  G01N21/75 ,  G01N21/78 ,  G01N27/04 ,  G01N27/12 ,  G01N27/22 ,  G01N33/00 ,  G01N7/00 ,  H01C7/00

    Abstract: A hydrogen sensor including a thin film sensor element formed, e.g., by metalorganic chemical vapor deposition (MOCVD) or physical vapor deposition (PVD), on a microhotplate structure. The thin film sensor element includes a film of a hydrogen-interactive metal film that reversibly interacts with hydrogen to provide a correspondingly altered response characteristic, such as optical transmissivity, electrical conductance, electrical resistance, electrical capacitance, magnetoresistance, photoconductivity, etc., relative to the response characteristic of the film in the absence of hydrogen. The hydrogen-interactive metal film may be overcoated with a thin film hydrogen-permeable barrier layer to protect the hydrogen-interactive film from deleterious interaction with non-hydrogen species. The hydrogen sensor of the invention may be usefully employed for the detection of hydrogen in an environment susceptible to the incursion or generation of hydrogen and may be conveniently configured as a hand-held apparatus.

    MATERIAL CONTAINMENT SYSTEM
    15.
    发明申请
    MATERIAL CONTAINMENT SYSTEM 审中-公开
    材料容器系统

    公开(公告)号：WO2007024988A3

    公开(公告)日：2007-06-14

    申请号：PCT/US2006032978

    申请日：2006-08-22

    Applicant: ADVANCED TECH MATERIALS ,  MCMANUS JAMES V ,  DIMEO FRANK JR

    Inventor： MCMANUS JAMES V ,  DIMEO FRANK JR

    IPC: B60R25/00

    CPC classification number: F17C11/00 ,  B65D55/14

    Abstract: Containment packages (10) having utility for transport of hazardous gases and security systems for controlling access to packages, e.g., hazardous gas containment packages (20). In a specific implementation, a containment package includes an overpack (11) for improving the safety and security of gas-containment vessels during transportation, e.g., air shipment, in which the overpack is pressurized by a protective gas at pressure in excess of the pressure in the gas- containment vessels, and a global positioning system (GPS) coordinated programmable lock and key system (30) is integrated with the containment package for controlled access to the gas- containment vessels only when the GPS component indicates that the containment package is at a specific geographic location.

    Abstract translation: 具有用于运输有害气体的实用性的密封包装（10）和用于控制包装（例如危险气体密封包装（20））的通道的安全系统。 在具体的实施方式中，容纳包装包括用于在运输（例如空运）期间提高气体容纳容器的安全性和安全性的外包装（11），其中，外包装通过压力超过压力的保护气体 在全球定位系统（GPS）协调的可编程锁和钥匙系统（30）中与气体密封容器集成在一起，以便仅在GPS部件指示密封包装是 在特定的地理位置。

    MATERIAL CONTAINMENT SYSTEM
    16.
    发明申请
    MATERIAL CONTAINMENT SYSTEM 审中-公开
    材料容纳系统

    公开(公告)号：WO2007024987A3

    公开(公告)日：2007-04-19

    申请号：PCT/US2006032977

    申请日：2006-08-22

    Applicant: ADVANCED TECH MATERIALS ,  MCMANUS JAMES V ,  SAMETH JERROLD DAVID ,  DIMEO FRANK JR

    Inventor： MCMANUS JAMES V ,  SAMETH JERROLD DAVID ,  DIMEO FRANK JR

    IPC: B65B3/00 ,  B01D53/04

    CPC classification number: B65D7/045 ,  B65D85/84 ,  B65D2203/10

    Abstract: Containment packages (10) having utility for transport of hazardous gases and security systems for controlling access to packages, e.g., hazardous gas containment packages (20). In a specific implementation, a containment package includes an overpack (11) for improving the safety and security of gas-containment vessels during transportation, e.g., air shipment, in which the overpack is pressurized by a protective gas at pressure in excess of the pressure in the gas-containment vessels, and a global positioning system (GPS) coordinated programmable lock and key system (30) is integrated with the containment package for controlled access to the gas- containment vessels only when the GPS component indicates that the containment package is at a specific geographic location.

    Abstract translation: 具有用于运输危险气体的容纳包装（10）和用于控制进入包装的安全系统，例如危险气体容纳包装（20）。 在具体实施中，遏制包装包括用于改善运输期间气体容纳容器的安全性和安全性的外包装（11），例如空运，其中外包装由压力超过压力的保护气体加压 在气体封存容器中，全球定位系统（GPS）可协调的可编程锁和钥匙系统（30）与容纳包集成在一起，仅在GPS组件表示安全壳包装是 在特定的地理位置。

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