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公开(公告)号：WO2023021097A1
公开(公告)日：2023-02-23
申请号：PCT/EP2022/072980
申请日：2022-08-17
Applicant: ASML NETHERLANDS B.V.
Inventor： HELFENSTEIN, Patrick, Philipp , MIDDLEBROOKS, Scott, Anderson , VAN KRAAIJ, Markus, Gerardus, Martinus, Maria , PISARENCO, Maxim
Abstract: A method of designing a target comprising providing an initial dataset, obtaining a model of the initial dataset, performing a Bayesian optimization using the model which provides an improved model, performing an optimization of the target design using the improved model.
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公开(公告)号：WO2022194483A1
公开(公告)日：2022-09-22
申请号：PCT/EP2022/053969
申请日：2022-02-17
Applicant: ASML NETHERLANDS B.V.
Inventor： HELFENSTEIN, Patrick, Philipp , MIDDLEBROOKS, Scott, Anderson , PISARENCO, Maxim , VAN KRAAIJ, Markus, Gerardus, Martinus, Maria , KONIJNENBERG, Alexander, Prasetya
Abstract: A method and system for predicting process information (e.g., phase data) using a given input (e.g., intensity) to a parameterized model are described. A latent space of a given input is determined based on dimensional data in a latent space of the parameterized model for a given input to the parameterized model. Further, an optimum latent space is determined by constraining the latent space with prior information (e.g., wavelength) that enables converging to a solution that causes more accurate predictions of the process information. The optimum latent space is used to predict the process information. The given input may be a measured amplitude (e.g., intensity) associated with the complex electric field image. The predicted process information can be complex electric field image having amplitude data and phase data. The parameterized model comprises variational encoder-decoder architecture.
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13.发明申请
公开(公告)号：WO2022028997A1
公开(公告)日：2022-02-10
申请号：PCT/EP2021/071232
申请日：2021-07-29
Applicant: ASML NETHERLANDS B.V.
Inventor： PISARENCO, Maxim , MIDDLEBROOKS, Scott, Anderson , VAN KRAAIJ, Markus, Gerardus, Martinus, Maria , VERSCHUREN, Coen, Adrianus
Abstract: Described herein is a method and apparatus for selecting patterns from an image such as a design layout. The method includes obtaining an image (e.g., of a target layout) having a plurality of patterns; determining, based on pixel intensities within the image, a metric (e.g., entropy) indicative of an amount of information contained in one or more portions of the image; and selecting, based on the metric, a sub-set of the plurality of patterns from the one or more portions of the image having values of the metric within a specified range. The sub-set of patterns can be provided as training data for training a model associated with a patterning process.
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公开(公告)号：WO2021204638A1
公开(公告)日：2021-10-14
申请号：PCT/EP2021/058546
申请日：2021-03-31
Applicant: ASML NETHERLANDS B.V.
IPC: G03F7/20 , G01N21/956 , G06K9/62 , G06N3/02
Abstract: A method for determining an optimized weighting of an encoder and decoder network; the method comprising: for each of a plurality of test weightings, performing the following steps with the encoder and decoder operating using the test weighting: (a) encoding, using the encoder, a reference image and a distorted image into a latent space to form an encoding; (b) decoding the encoding, using the decoder, to form a distortion map indicative of a difference between the reference image and a distorted image; (c) spatially transforming the distorted image by the distortion map to obtain an aligned image; (d) comparing the aligned image to the reference image to obtain a similarity metric; and (e) determining a loss function which is at least partially defined by the similarity metric; wherein the optimized weighting is determined to be the test weighting which has an optimized loss function.
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公开(公告)号：WO2021043936A1
公开(公告)日：2021-03-11
申请号：PCT/EP2020/074663
申请日：2020-09-03
Applicant: ASML NETHERLANDS B.V.
Inventor： KOOIMAN, Marleen , PISARENCO, Maxim , SLACHTER, Abraham , MASLOW, Mark, John , OYARZUN RIVERA, Bernardo, Andres , TEL, Wim, Tjibbo , MAAS, Ruben, Cornelis
Abstract: Described herein is a method of training a model configured to predict whether a feature associated with an imaged substrate will be defective after etching of the imaged substrate and determining etch conditions based on the trained model. The method includes obtaining, via a metrology tool, (i) an after development image of the imaged substrate at a given location, the after development image including a plurality of features, and (ii) an after etch image of the imaged substrate at the given location; and training, using the after development image and the after etch image, the model configured to determine defectiveness of a given feature of the plurality of features in the after development image. In an embodiment, the determining of defectiveness is based on comparing the given feature in the after development image with a corresponding etch feature in the after etch image.
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Patent Agency Ranking16.发明申请
公开(公告)号：WO2020011507A1
公开(公告)日：2020-01-16
申请号：PCT/EP2019/066317
申请日：2019-06-20
Applicant: ASML NETHERLANDS B.V.
Inventor： PISARENCO, Maxim , MIDDLEBROOKS, Scott, Anderson , VAN KRAAIJ, Markus, Gerardus, Martinus, Maria , KOOPMAN, Adrianus, Cornelis, Matheus
IPC: G03F7/20 , G03F1/84 , G03F1/86 , G06T7/00 , G01N21/956
Abstract: A method for determining the existence of a defect in a printed pattern includes obtaining a) a captured image of a printed pattern from an image capture device, and b) a simulated image of the printed pattern generated by a process model. The method also includes generating a combined image as a weighted combination of portions of the captured image and the simulated image. Also, the method includes determining whether a defect exists in the printed pattern based on the combined image.
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公开(公告)号：WO2022135948A1
公开(公告)日：2022-06-30
申请号：PCT/EP2021/084913
申请日：2021-12-09
Applicant: ASML NETHERLANDS B.V.
Inventor： XU, Huina , MATSUSHITA, Yana , HASAN, Tanbir , KOU, Ren-Jay , GOEL, Namita , LI, Hongmei , PISARENCO, Maxim , KOOIMAN, Marleen , BATISTAKIS, Chrysostomos , ONVLEE, Johannes
IPC: G06T7/00
Abstract: A method and apparatus for analyzing an input electron microscope image of a first area on a first wafer are disclosed. The method comprises obtaining a plurality of mode images from the input electron microscope image corresponding to a plurality of interpretable modes. The method further comprises evaluating the plurality of mode images, and determining, based on evaluation results, contributions from the plurality of interpretable modes to the input electron microscope image. The method also comprises predicting one or more characteristics in the first area on the first wafer based on the determined contributions. In some embodiments, a method and apparatus for performing an automatic root cause analysis based on an input electron microscope image of a wafer are also disclosed.
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公开(公告)号：WO2022135923A1
公开(公告)日：2022-06-30
申请号：PCT/EP2021/084702
申请日：2021-12-08
Applicant: ASML NETHERLANDS B.V.
Abstract: A method for training a machine learning model includes obtaining a set of unpaired after-development (AD) images and after-etch (AE) images associated with a substrate. Each AD image in the set is obtained at a location on the substrate that is different from the location at which any of the AE images is obtained. The method further includes training the machine learning model to generate a predicted AE image based on the AD images and the AE images, wherein the predicted AE image corresponds to a location from which an input AD image of the AD images is obtained.
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公开(公告)号：WO2021001109A1
公开(公告)日：2021-01-07
申请号：PCT/EP2020/065400
申请日：2020-06-04
Applicant: ASML NETHERLANDS B.V.
Inventor： PISARENCO, Maxim , VAN DER SCHAAR, Maurits , ZHANG, Huaichen , VAN LARE, Marie-Claire
IPC: G03F7/20
Abstract: A method for applying a deposition model in a semiconductor manufacturing process is described. The method comprises predicting a deposition profile of a substrate using the deposition model; and using the predicted deposition profile to enhance a metrology target design. The deposition model is calibrated using experimental cross-section profile information from a layer of a physical wafer. In some embodiments, the deposition model is a machine-learning model, and calibrating the deposition model comprises training the machine-learning model. The metrology target design may comprise an alignment metrology target design or an overlay metrology target design, for example.
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20.发明申请
公开(公告)号：WO2019219314A1
公开(公告)日：2019-11-21
申请号：PCT/EP2019/059732
申请日：2019-04-16
Applicant: ASML NETHERLANDS B.V.
IPC: G03F7/20
Abstract: A method of calculating electromagnetic scattering properties of a structure represented as a nominal structure and a structural perturbation, the method comprising a step (1008) of numerically solving a volume integral equation comprising a nominal linear system to determine a nominal vector field being independent with respect to the structural perturbation; a step (1010) of using a perturbed linear system to determine an approximation of a vector field perturbation arising from the structural perturbation, by solving a volume integral equation or an adjoint linear system. Matrix-vector multiplication of a nominal linear system matrix convolution operator may be restricted to sub-matrices; and a step (1012) of calculating electromagnetic scattering properties of the structure using the determined nominal vector field and the determined approximation of the vector field perturbation.
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