公开(公告)号：US20190221728A1

公开(公告)日：2019-07-18

申请号：US16250774

申请日：2019-01-17

Applicant: EPISTAR CORPORATION

Inventor： Jen-Chieh YU ,  Yih-Hua RENN ,  Hsin-Mao LIU ,  Lung-Kuan LAI ,  Ching-Tai CHENG

IPC: H01L33/50 ,  H01L33/58 ,  H01L25/13

CPC classification number: H01L33/507 ,  H01L25/13 ,  H01L33/58

Abstract: An embodiment of present disclosure discloses a light-emitting device which includes a first light-emitting unit, a second light-emitting unit, a first optic structure, a second optic structure, a first light-transmitting structure, a second light-transmitting structure, and a light-blocking structure. The first optic structure covers a top surface and a side surface of the first light-emitting unit, the second optic structure covers a top surface and a side surface of the second light-emitting unit. The first light-transmitting structure covers the first optic structure. The second light-transmitting structure covers the second optic structure. The light-blocking structure surrounds the first light-emitting unit and the second light-emitting unit, and covers the side surfaces of the first optic structure, the second optic structure, the first light-transmitting structure and the second light-transmitting structure.

公开(公告)号：US20190207069A1

公开(公告)日：2019-07-04

申请号：US16298648

申请日：2019-03-11

Applicant: EPISTAR CORPORATION

Inventor： Lung-Kuan LAI ,  Ching-Tai CHENG ,  Yih-Hua RENN ,  Min-Hsun HSIEH ,  Chun-Hung LIU ,  Shih-An LIAO ,  Ming-Chi HSU ,  Yu Chen LIAO

IPC: H01L33/60 ,  H01L33/54 ,  H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/50 ,  H01L33/38 ,  F21V8/00

CPC classification number: H01L33/60 ,  G02B6/0051 ,  G02B6/0073 ,  H01L25/0753 ,  H01L33/385 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/96 ,  H01L2924/1815 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.

公开(公告)号：US20180076369A1

公开(公告)日：2018-03-15

申请号：US15699598

申请日：2017-09-08

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Lung-Kuan LAI ,  Yih-Hua RENN ,  Min-Hsun HSIEH

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/647 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A light-emitting device includes a light-emitting element, a light pervious layer, an electrode defining layer, a first soldering pad and a second soldering pad. The light-emitting element has an upper surface, a bottom surface, and a lateral surface arranged between the upper surface and the bottom surface. The light pervious layer covers the upper surface and the lateral surface. The electrode defining layer covers a part of the light pervious layer. The first soldering pad and the second soldering pad are surrounded by the electrode defining layer. A gap is located between the first soldering pad and the second soldering pad while the gap remains substantially constant.

公开(公告)号：US20170222102A1

公开(公告)日：2017-08-03

申请号：US15395917

申请日：2016-12-30

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Chun-Hua SHIH ,  Yih-Hua RENN

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/508 ,  H01L33/483 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041

Abstract: A light-emitting device includes a light-emitting element, a wavelength conversion layer and a light pervious element. The light-emitting element includes a top surface, a bottom surface, a plurality of side surfaces connecting to the top surface and the bottom surface, and a first electrical contact formed on the bottom surface. The wavelength conversion layer covers the top surface of the light-emitting element to form a first thickness, has an average thickness, and includes a transparent binder and a plurality of wavelength conversion particles having an equivalent particle diameter D50. The light pervious element includes a light exiting surface and is disposed on the wavelength conversion layer. The D50 of the wavelength conversion particles is not great than 10 μm. A ratio of the average thickness to the D50 of the wavelength conversion layer is ranged from 6 to 20.

公开(公告)号：US20170162763A1

公开(公告)日：2017-06-08

申请号：US14959972

申请日：2015-12-04

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Yih-Hua RENN ,  Chun-Hua SHIH

IPC: H01L33/52 ,  H01L33/58 ,  H01L33/50

CPC classification number: H01L33/52 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A light-emitting device includes a light-emitting element, a cover layer, and an anti-adhesion layer. The light-emitting element has a top surface, a bottom surface and a first side surface. The cover layer covers the light-emitting element and includes a first transparent binder and a plurality of wavelength conversion particles dispersed within the first transparent binder. The anti-adhesion layer includes a fluoro-containing material, and is disposed on the cover layer and the top surface.

公开(公告)号：US20240405181A1

公开(公告)日：2024-12-05

申请号：US18733304

申请日：2024-06-04

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Wei-Yu CHEN ,  Li-Shen TANG ,  Kun-Wei KAO ,  Jia-Xing CHUNG ,  Wei-Shan HU ,  Ching-Tai CHENG ,  Chang-Tai HSIAO ,  Yih-Hua RENN ,  Chun-Yen WU

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/40

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This arrangement includes a substrate, an adhesive structure, and a first semiconductor device. The substrate includes an upper surface. The adhesive structure is located on the upper surface and includes a first concave region. The first semiconductor device includes a lower surface facing toward the adhesive structure and a conductive bump located under the lower surface and in the first concave region. The conductive bump includes a first portion and a second portion. Wherein the lower surface does not contact the adhesive structure, the first portion contacts the first concave region, and the second portion does not contact the first concave region.

公开(公告)号：US20230176417A1

公开(公告)日：2023-06-08

申请号：US18072264

申请日：2022-11-30

Applicant: EPISTAR CORPORATION ,  YENRICH TECHNOLOGY CORPORATION

Inventor： Wen-Chien WU ,  Wei-Shan HU ,  Ching-Tai CHENG

IPC: G02F1/13357

CPC classification number: G02F1/133603 ,  G02F1/133605 ,  G02F1/133611

Abstract: A backlight module is provided. The backlight module includes a substrate having a substrate surface, a conductive layer disposed on the substrate surface, a plurality of LED chips disposed on and electrically connected to the conductive layer, a light-permeable layer having a light-permeable surface away from the substrate surface, and a pattern layer disposed on the light-permeable surface and having a plurality of first patterns corresponding to and respectively located above the plurality of LED chips. Wherein, each first pattern has a maximum width. A maximum width of one first pattern satisfies the following formula:


WP≥2n(TE−TL)(1−1/n2)1/2+WL;

wherein WP is the maximum width of one first pattern, n is a refractivity of the light-permeable layer, TE is a thickness of the light-permeable layer, TL is a thickness of the LED chip, WL is a maximum width of LED chip corresponding to the first pattern.

公开(公告)号：US20220302357A1

公开(公告)日：2022-09-22

申请号：US17834487

申请日：2022-06-07

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Ju-Lien KUO ,  Min-Hsun HSIEH ,  Shau-Yi CHEN ,  Shih-An LIAO ,  Jhih-Hao CHEN

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L33/22 ,  H01L51/52

Abstract: This disclosure discloses a light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor

公开(公告)号：US20200328330A1

公开(公告)日：2020-10-15

申请号：US16846059

申请日：2020-04-10

Applicant: EPISTAR CORPORATION

Inventor： Tsung-Hong LU ,  Pao-Yu LIAO ,  Ching-Tai CHENG

IPC: H01L33/50 ,  H01L33/06 ,  H01L33/56 ,  H01L33/54 ,  H01L33/10

Abstract: A LED package comprises an LED chip, a reflective structure which encloses the LED chip, a wavelength conversion structure placed on the LED chip, and an absorbing structure which encloses or is placed on the reflective structure.

公开(公告)号：US20190341523A1

公开(公告)日：2019-11-07

申请号：US16514489

申请日：2019-07-17

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Ju-Lien KUO ,  Min-Hsun HSIEH ,  Shau-Yi CHEN ,  Shih-An LIAO ,  Jhih-Hao CHEN

IPC: H01L33/22 ,  H01L33/50 ,  H01L33/00 ,  H01L51/52

Abstract: A light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor.