公开(公告)号：AT375380T

公开(公告)日：2007-10-15

申请号：AT03256305

申请日：2003-10-07

Applicant: GEN ELECTRIC

Inventor： GORCZYCA THOMAS BERT

IPC: C08L83/04 ,  C08G59/42 ,  C08G59/58 ,  C08K5/5419 ,  C08L63/00 ,  C08L83/05 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

Abstract: A curable epoxy resin composition comprises a silicone resin(s), an epoxy resin(s), an anhydride curing agent(s), a siloxane surfactant(s), and an ancillary curing catalyst(s). An independent claim is also included for a packaged solid device comprising a package, a chip (4), and an encapsulant (11) comprising the resin composition.

公开(公告)号：AU2003284300A1

公开(公告)日：2004-05-13

申请号：AU2003284300

申请日：2003-10-20

Applicant: GEN ELECTRIC

Inventor： SAIA RICHARD JOSEPH ,  GORCZYCA THOMAS BERT ,  KAPUSTA CHRISTOPHER JAMES ,  BALCH ERNEST WAYNE ,  CLAYDON GLENN SCOTT ,  DASGUPTA SAHMITA ,  DELGADO ELADIO CLEMENTE

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  G02B6/42 ,  G02B6/00

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

公开(公告)号：CA2216464A1

公开(公告)日：1998-05-04

申请号：CA2216464

申请日：1997-09-25

Applicant: GEN ELECTRIC

Inventor： PAGE TIMOTHY DIETRICH ,  VAKIL HIMANSHU BACHUBHAI ,  GORCZYCA THOMAS BERT ,  SILVERSTEIN SETH DAVID ,  BERGMAN ROLF SVERRE ,  GHEZZO MARIO ,  HUEY CHARLES SAMUEL

IPC: H01L21/22 ,  H01L21/00 ,  H01L21/26 ,  H01L21/324 ,  H01L21/02

Abstract: A thermal processor for at least one semiconductor wafer includes a reactor chamber having a material substantially transparent to light including a wavelength within the range of about 200 nanometers to about 800 nanometers for holding the at least one semiconductor wafer. A coating including a material substantially reflective of infrared radiation can be present on at least a portion of the reactor chamber. A light source provides radiant energy to the at least one semiconductor wafer through the coating and the reactor chamber. The light source can include an ultraviolet discharge lamp, a halogen infrared incandescent lamp, or a mental halide visible discharge lamp. The coating can be situated on an inner or outer surface of the reactor chamber. If the reactor chamber has inner and outer walls, the coating can be situated on either the inner wall or the outer wall.

公开(公告)号：DE3675741D1

公开(公告)日：1991-01-03

申请号：DE3675741

申请日：1986-09-23

Applicant: GEN ELECTRIC

Inventor： BOLON DONALD ALLEN ,  GORCZYCA THOMAS BERT

IPC: C08G18/40 ,  C08G18/38 ,  C08G18/60 ,  C08G18/64 ,  C08G73/10 ,  C08G73/12 ,  C08G73/14 ,  C08J3/24 ,  C09D5/25 ,  C09D179/08 ,  H01B3/30

Abstract: Carboxy-terminated prepolymers are prepared by the reaction of a diamine, preferably an aromatic diamine, or a mixture thereof with a triamine, with a carboxy anhydride such as trimellitic anhydride and a dianhydride such as bisphenol A dianhydride. The prepolymers, or functional derivatives thereof, are then reacted with a diisocyanate or diamine, or a mixture thereof with a triisocyanate or triamine, preferably an aromatic diisocyanate, to produce copolyamideimides. The products prepared using triamines or triisocyanates are crosslinked. Other products containing alkyl or alicyclic groups attached to aromatic radicals can be oxidatively crosslinked, e.g., by heating in air.

公开(公告)号：DE3231149A1

公开(公告)日：1983-04-07

申请号：DE3231149

申请日：1982-08-21

Applicant: GEN ELECTRIC

Inventor： BOLON DONALD ALLEN ,  GORCZYCA THOMAS BERT

IPC: C08G73/00 ,  C08G73/10 ,  C09D5/25 ,  C09D179/08 ,  C08G65/00 ,  C08G75/00 ,  C09D3/49 ,  H01B3/30

Abstract: Disclosed is a coating solution including an oligomeric polyetherimide component, an organic diamine component, an organic triamine component, a solvent system and optionally water, which may be coated on a substrate and polymerized to form high quality polyetherimide coatings and a process for preparing the solution.

公开(公告)号：CA2951381C

公开(公告)日：2023-03-28

申请号：CA2951381

申请日：2015-06-09

Applicant: GEN ELECTRIC

Inventor： SETLUR ANANT ACHYUT ,  WEAVER STANTON EARL ,  GORCZYCA THOMAS BERT ,  CHOWDHURY ASHFAQUL ISLAM ,  MURPHY JAMES EDWARD ,  GARCIA FLORENCIO

IPC: H01L33/50 ,  C09K11/02 ,  C09K11/61

Abstract: A process for fabricating a LED lighting apparatus includes disposing a composite coating on a surafce of a LED chip, The composite coating comprises a first composite layer having a manganese doped phosphor of formula I and a first binder and a second composite layer comprising a second phosphor composition and a second binder. The first binder, the second binder or both include a poIy(meth)acrylate. Ax [MFy]:Mn4+.......... (I), wherein A is Li, Na. K, Rb, Cs, or a combination thereof; M is Si, Ge, Sn, Ti, Zr, AL Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; y is 5, 6 or 7.

公开(公告)号：DE102012101746A1

公开(公告)日：2012-09-06

申请号：DE102012101746

申请日：2012-03-01

Applicant: GEN ELECTRIC

Inventor： GORCZYCA THOMAS BERT ,  KORMAN CHARLES STEVEN ,  SMITH SCOTT

IPC: H01L31/05 ,  H01L31/0224 ,  H01L31/052

Abstract: Das Modul enthält Photovoltaikzellen, ein dielektrisches Material und ein metallisiertes Material. Jede Photovoltaikzelle enthält ein Substratmaterial mit einer Sonnenseite und einer Rückseite, erste dotierte Bereiche, die mit zweiten dotierten Bereichen ineinandergreifend ausgebildet sind, wobei beide dotierte Bereiche auf der Rückseite angeordnet sind und einer positiv dotiert ist, während der andere negativ dotiert ist, und elektrische Kontakte auf jedem von den ersten und zweiten dotierten Bereichen. Das dielektrische Material ist an der Rückseite des Substratmaterials angeklebt. Durch das dielektrische Material hindurch sind Durchkontaktierungen ausgebildet, die sich bis zu wenigstens einem Abschnitt der elektrischen Kontakte erstrecken. Das metallisierte Material erstreckt sich von den elektrischen Kontakten aus durch die Durchkontaktierungen hindurch und ist auf einer Rückseite des dielektrischen Materials gemustert. Das metallisierte Material ist aus einem Material ausgebildet, das sowohl elektrisch als auch thermisch leitfähig ist.

公开(公告)号：DE60316759T2

公开(公告)日：2008-07-17

申请号：DE60316759

申请日：2003-10-07

Applicant: GEN ELECTRIC

Inventor： GORCZYCA THOMAS BERT

IPC: C08L83/04 ,  C08G59/42 ,  C08G59/58 ,  C08K5/5419 ,  C08L63/00 ,  C08L83/05 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

Abstract: A curable epoxy resin composition comprises a silicone resin(s), an epoxy resin(s), an anhydride curing agent(s), a siloxane surfactant(s), and an ancillary curing catalyst(s). An independent claim is also included for a packaged solid device comprising a package, a chip (4), and an encapsulant (11) comprising the resin composition.

公开(公告)号：CA2587922A1

公开(公告)日：2006-05-15

申请号：CA2587922

申请日：2005-11-15

Applicant: GEN ELECTRIC

Inventor： MCCONNELEE PAUL ALAN ,  ERLAT AHMET GUN ,  GORCZYCA THOMAS BERT ,  SCHAEPKENS MARC ,  KIM TAE WON ,  YAN MIN ,  HELLER CHRISTIAN MARIA ANTON

IPC: B32B27/16 ,  B05D3/00 ,  C08J7/04

Abstract: A composite article with at least one high integrity protective coating, the high integrity protective coating having at least one planarizing layer and at least one organic-inorganic composition barrier coating layer. A method for depositing a high integrity protective coating.

公开(公告)号：AU2004283172A1

公开(公告)日：2005-05-06

申请号：AU2004283172

申请日：2004-08-05

Applicant: GEN ELECTRIC

Inventor： TOLLIVER TODD RYAN ,  NIELSEN MATTHEW CHRISTIAN ,  GORCZYCA THOMAS BERT ,  SHIH MIN-YI ,  DENG KUNG-LI ,  GUIDA RENATO

IPC: C03B37/00 ,  G02B6/12 ,  G02B6/125 ,  G02B6/138 ,  G02B6/26 ,  G02B6/30 ,  G02B6/32 ,  G02B6/42 ,  G02F1/35

Abstract: A waveguide (116) fabrication method includes depositing a photodefinable copolymer material (14) comprising methyl methacrylate, tetrafluoropropyl methacrylate, and an epoxy monomer; fixing optical elements (10, 12) relative to the copolymer material; sending light through at least one of the optical elements and copolymer material towards the other; volatilizing uncured monomer. Another waveguide (116) fabrication method includes: fixing optical elements (110, 112) relative to each other, each having an optical surface (11, 13); providing a copolymer blob (114) over the optical surfaces with sufficient surface tension to result in the copolymer blob having a curved surface (15); sending light through each of the optical elements towards the curved surface and the other; volatilizing uncured monomer. An optical path fabrication method comprises: fixing optical elements (70, 76) relative to each other, each having an optical surface (71, 77); translating and rotating a mirror (78) until aligned to optimally direct light from one of the optical elements to the other; securing the aligned mirror in position.