公开(公告)号：FR2740224A1

公开(公告)日：1997-04-25

申请号：FR9612844

申请日：1996-10-15

Applicant: IBM

Inventor： BAYER THOMAS ,  MEISSNER KLAUS ,  STOHR ROLAND ,  GRESCHNER JOHANN ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：CA1305872C

公开(公告)日：1992-08-04

申请号：CA548420

申请日：1987-10-01

Applicant: IBM

Inventor： DUERIG URS T ,  GIMZEWSKI JAMES K ,  GRESCHNER JOHANN ,  POHL WOLFGANG D ,  WOLTER OLAF

IPC: G01B7/34 ,  G01B7/00 ,  G01B21/30 ,  G01D5/04 ,  G01L1/00 ,  G01L1/04 ,  G01N13/00 ,  G01N23/00 ,  G01N37/00 ,  G01Q20/04 ,  G01Q40/00 ,  G01Q60/38 ,  G01Q70/14 ,  H01J37/26 ,  H01J37/28

Abstract: The micromechanical sensor head is designed to measure forces down to 10-13 N. It comprises a common base from which a cantilever beam and a beam member extend in parallel. The cantilever beam carries a sharply pointed tip of a hard material, dielectric or not, for interaction with the surface of a sample to be investigated. Bulges forming a tunneling junction protrude from facing surfaces of said beams, the gap between said bulges being adjustable by means of electrostatic forces generated by a potential (Vd) applied to a pair of electrodes respectively coated onto parallel surfaces of said beams. The sensor head consists of one single piece of semiconductor material, such as silicon or gallium arsenide (or any other compounds thereof) which is fabricated to the dimensions required for the application by means of conventional semiconductor chip manufacturing techniques. SZ9-86-002

公开(公告)号：CA1196113A

公开(公告)日：1985-10-29

申请号：CA412981

申请日：1982-10-06

Applicant: IBM

Inventor： BOHLEN HARALD ,  KAUS GERHARD ,  GRESCHNER JOHANN ,  KEYSER JOACHIM H ,  KULCKE WERNER

IPC: H01R24/00 ,  H01L23/48 ,  H01L23/532 ,  H01R12/18 ,  H01R13/02

Abstract: CONTACT DEVICE FOR RELEASABLY CONNECTING ELECTRICAL COMPONENTS Two electrical components containing electric conductor lines are interconnected by silicon contact fingers mounted on a back part made of silicon and carrying the fingers. The fingers and back part preferably represent an integral component of an integrated circuit provided on a monocrystalline substrate which is to be connected to other electrical components Fingers and back part are preferably made in accordance with micromechanical silicon semiconductor technology.

公开(公告)号：DE19646120C2

公开(公告)日：2001-07-26

申请号：DE19646120

申请日：1996-11-08

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  WEISS HELGA

IPC: B81B3/00 ,  G01B7/34 ,  G01L1/14 ,  G01Q60/16 ,  G01Q60/38 ,  G01Q70/10 ,  G01Q70/14 ,  H01J37/28 ,  H01J49/00 ,  H01L49/00 ,  G12B21/02

公开(公告)号：GB2306804B

公开(公告)日：1999-07-14

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：GB2306804A

公开(公告)日：1997-05-07

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：DE3683763D1

公开(公告)日：1992-03-12

申请号：DE3683763

申请日：1986-03-27

Applicant: IBM DEUTSCHLAND

Inventor： ELSNER GERHARD ,  GRESCHNER JOHANN ,  HINKEL HOLGER

IPC: H01L21/68 ,  H01L21/027 ,  H01L21/306 ,  H01L21/67 ,  H01L23/544 ,  H01L21/31

Abstract: Identically positioned alignment marks are formed on opposite sides of a semiconductor wafer by (i) coating both wafer sides with an insulating layer (2,3); (ii) directing high energy heavy ions onto the front side layer (2), the ions penetrating both layers (2,3) nuclear tracks (4, 4') to form single disturbed lattice nuclear tracks (4, 4') in the layers without disturbing the crystal latt-ice of the wafer; (iii) etching the nuclear tracks (4,4') to form identically positioned pores in the layers; and (iv) using the pores as alignment marks for further processing.