公开(公告)号：AU2002361679A1

公开(公告)日：2003-07-09

申请号：AU2002361679

申请日：2002-12-13

Applicant: IBM

Inventor： FORNOF ANN R ,  HEDRICK JEFFREY C ,  LEE KANG-WOOK ,  MALONE KELLY ,  TYBERG CHRISTY S

IPC: H01L21/316 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

公开(公告)号：AU2002361679A8

公开(公告)日：2003-07-09

申请号：AU2002361679

申请日：2002-12-13

Applicant: IBM

Inventor： MALONE KELLY ,  HEDRICK JEFFREY C ,  LEE KANG-WOOK ,  TYBERG CHRISTY S ,  FORNOF ANN R

IPC: H01L21/316 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L23/48 ,  H01L21/4763

公开(公告)号：DE10106161A1

公开(公告)日：2001-09-13

申请号：DE10106161

申请日：2001-02-10

Applicant: IBM

Inventor： DAVIS CHARLES R ,  EDELSTEIN DANIEL CHARLES ,  HAY JOHN C ,  HEDRICK JEFFREY C ,  JAHNES CHRISTOPHER ,  MC GAHAY VINCENT ,  NYE HENRY

IPC: H01L21/768 ,  H01L21/3205 ,  H01L23/52 ,  H01L23/522 ,  H01L23/532

Abstract: Planar layer for conductors, includes numerous connecting lines separated from each other by dielectric. This has relatively low: dielectric constant and modulus of elasticity. A planar, perforated dielectric film layer included, has a higher modulus of elasticity. One of the conductor- and the perforated layers, is located on an integrated circuit substrate, defining a first layer. The other conductor- and perforated layer is located on the first, such that perforations make selective contact with conductors of the conductor layer.

公开(公告)号：DE69313954D1

公开(公告)日：1997-10-23

申请号：DE69313954

申请日：1993-07-30

Applicant: IBM

Inventor： AFZALI ARDAKANI ALI ,  GOTRO JEFFREY T ,  HEDRICK JEFFREY C ,  PAPATHOMAS KONSTANTINOS ,  PATEL NIRANJAN M ,  SHAW JANE M ,  VIEHBECK ALFRED

IPC: B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03

Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

公开(公告)号：DE60323152D1

公开(公告)日：2008-10-02

申请号：DE60323152

申请日：2003-11-24

Applicant: DOW GLOBAL TECHNOLOGIES INC ,  IBM

Inventor： HEDRICK JEFFREY C ,  SANKARAPANDIAN MUTHUMANICKAM ,  TYBERG CHRISTY S ,  GODSCHALX JAMES P ,  NIU QING SHAN ,  SILVIS H CRAIG

IPC: C08G61/00 ,  C08G61/10 ,  C08L65/00 ,  C09D165/00 ,  H01L23/532

Abstract: A crosslinked polyarylene material with a reduced coefficient of thermal expansion at high temperatures compared with conventional crosslinked polyarylene materials is provided. In addition, an integrated circuit article containing a crosslinked polyarylene polymer with reduced coefficient of thermal expansion at high temperatures is provided.

公开(公告)号：HK1084405A1

公开(公告)日：2006-07-28

申请号：HK06104079

申请日：2006-04-03

Applicant: DOW GLOBAL TECHNOLOGIES INC ,  IBM

Inventor： HEDRICK JEFFREY C ,  SANKARAPANDIAN MUTHUMANICKAM ,  TYBERG CHRISTY S ,  GODSCHALX JAMES P ,  NIU QING SHAN J ,  SILVIS H CRAIG

IPC: C08G20090101 ,  C08G61/00 ,  C08G61/10 ,  C08L20090101 ,  C08L65/00 ,  C09D165/00 ,  H01L20090101 ,  H01L23/532

Abstract: A crosslinked polyarylene material with a reduced coefficient of thermal expansion at high temperatures compared with conventional crosslinked polyarylene materials is provided. In addition, an integrated circuit article containing a crosslinked polyarylene polymer with reduced coefficient of thermal expansion at high temperatures is provided.