公开(公告)号：JP2002182393A

公开(公告)日：2002-06-26

申请号：JP2001303791

申请日：2001-09-28

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  ISHII HIROYUKI ,  YAMAMOTO MASASHI ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, having excellent sensitivity, resolution, dry etching resistance, pattern shape, etc., and having small temperature dependence in heating after exposure. SOLUTION: The radiation sensitive resin composition contains (A) a resin comprising a copolymer of (meth)acrylic esters having an acid dissociable group- containing alicyclic structure represented by 5-t-butoxycarbonylnorbornyl (meth) acrylate and 8-t-butoxycarbonyltetracyclododecane (meth)acrylate and (meth) acrylic esters having a lactone-containing heterocyclic structure typified by compounds of formula (1) and (B) a radiation sensitive acid generating agent represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n- octanesulfonate, 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n- butanesulfonate or the like.

公开(公告)号：JP2002072484A

公开(公告)日：2002-03-12

申请号：JP2001108824

申请日：2001-04-06

Applicant: JSR CORP ,  IBM

Inventor： NISHIMURA YUKIO ,  YAMAHARA NOBORU ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU ,  ITO HIROSHI

IPC: C08K5/00 ,  C08L33/06 ,  C08L35/00 ,  C08L45/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2002072477A

公开(公告)日：2002-03-12

申请号：JP2000177487

申请日：2000-06-13

Applicant: JSR CORP

Inventor： KOBAYASHI HIDEKAZU ,  NUMATA ATSUSHI ,  YAMACHIKA MIKIO ,  YAMAMOTO MASASHI

IPC: G03F7/039 ,  C08K5/00 ,  C08K5/17 ,  C08L101/10 ,  G03F7/004 ,  G03F7/075 ,  G03F7/26 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive composition being effectively responsive to various types of radiations, having excellent sensitivity and resolution, and also having excellent long-term shelf stability and useful as a positive type chemical amplification type multilayer resist. SOLUTION: The positive type radiation sensitive resin composition for the upper layer resist of a multilayer resist contains (A) a low molecular compound obtained by preparing a compound having at least one amino group with one or two hydrogen atoms combining with a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of the hydrogen atoms of the amino group, (B) a radiation sensitive acid generating agent and (C) an alkali- insoluble or slightly alkali-soluble silicon-containing resin protected with an acid dissociable group and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.

公开(公告)号：JP2002023371A

公开(公告)日：2002-01-23

申请号：JP2000204223

申请日：2000-07-05

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  DOUKI KATSUJI ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F20/60 ,  C08F32/08 ,  C08K5/00 ,  C08L101/06 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.

公开(公告)号：JPH11228637A

公开(公告)日：1999-08-24

申请号：JP5269398

申请日：1998-02-19

Applicant: JSR CORP

Inventor： KAJITA TORU ,  SUWA MITSUFUMI ,  IWAZAWA HARUO ,  YAMAMOTO MASASHI

IPC: C08F222/06 ,  C08F232/08

Abstract: PROBLEM TO BE SOLVED: To obtain the subject copolymer having alicyclic groups and acid- cleavable polar organic groups, having high radiation penetrability, excellent dry etching resistance, excellent adhesivity, etc., and useful for optical materials, electronic materials, etc. SOLUTION: This polar norbornene derivative/maleic anhydride copolymer comprises repeating units of formula I (X and Y are each H or a 4-20C acid- cleavable organic group; A and B are each H or a 1-4C alkyl) preferably in an amount of 60-40 mol.% and repeating units of formula II preferably in an amount of 40-60 mol.%, and has a polystyrene-converted weight-average mol.wt. of 1,000-1,000,000. The copolymer is obtained by radically copolymerizing at least one kind of norbornene derivative of formula III [for example, 8-t- butoxycarbonyltetracyclo(4.4.0.1 , .1 , )dodeca-3-ene] with maleic anhydride and, if necessary, one or more other copolymerizable unsaturated compound [for example, bicyclo(2.2.1)hept-2-enel.

公开(公告)号：JPH11202491A

公开(公告)日：1999-07-30

申请号：JP1829098

申请日：1998-01-16

Applicant: JSR CORP

Inventor： SUWA MITSUFUMI ,  IWAZAWA HARUO ,  YAMAMOTO MASASHI ,  KAJITA TORU

IPC: G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. having high transparency to radiation and satisfactory dry etching resistance as a chemical amplification type resist. SOLUTION: The radiation sensitive resin compsn. contains a polymer contg. repeating units derived from a norbornene deriv. typified by 8-t- butoxycarbonyltetracyclo[4,4,0,1 ,1 ]norbornene, a radiation sensitive acid generating agent and an androstane-17-carboxylic-ester compd. typified by t- butoxycarbonylmethyl deoxycholate. In the formula, A and B are each H or an acid dissociable

公开(公告)号：JP2003241384A

公开(公告)日：2003-08-27

申请号：JP2002046679

申请日：2002-02-22

Applicant: JSR CORP ,  IBM ,  JSR MICRO INC

Inventor： NISHIMURA YUKIO ,  YAMAMOTO MASASHI ,  ISHII HIROYUKI ,  MARK SLEZAK ,  BRUNSVOLD WILLIAM R ,  MARGARET C LAWSON ,  CHEN KUANG-JUNG ,  KWONG RANEE W ,  VARANASI PUSHKARA RAO

IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation and useful as a chemically amplified resist excellent in sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin typified by a copolymer of 2-methyl-2-adamantyl methacrylate, 3-hydroxy-1- adamantyl methacrylate and a methacrylic ester of formula (1), (B) a radiation- sensitive acid generator typified by triphenylsulfonium nonafluoro-n- butanesulfonate or 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium perfluoro-n- octanesulfonate and (C) a solvent. Preferably the solvent (C) includes at least one selected from the group comprising propylene glycol monomethyl ether acetate, 2-heptanone and cyclohexanone. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003173026A

公开(公告)日：2003-06-20

申请号：JP2002009054

申请日：2002-01-17

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  YAMAMOTO MASASHI ,  KATAOKA ATSUKO ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to radiation and excellent in basic physical properties as a resist such as sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin comprising a copolymer of (meth)acrylic esters having lactone-containing heterocyclic structures typified by compounds of formula (1) and acid-dissociable group-containing (meth)acrylic esters typified by t-tubyl (meth)acrylate, 2- methyl-2-adamantyl (meth)acrylate and 2-norbornyl-2-n-propyl (meth)acrylate and (B) a radiation-sensitive acid generator typified by 1-(3,5-dimethyl-4- hydroxyphenyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate and 1-(4-n- butoxy-1-naphtyl)tetrahydrothiophenium perfluoro-n-octanesulfonate. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003020335A

公开(公告)日：2003-01-24

申请号：JP2002048643

申请日：2002-02-25

Applicant: Jsr Corp ,  ジェイエスアール株式会社

Inventor： IWAZAWA HARUO ,  HAYASHI AKIHIRO ,  SHIMOKAWA TSUTOMU ,  YAMAMOTO MASASHI

IPC: C08G77/08 ,  C08G77/22 ,  C08G77/24 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027

CPC classification number: G03F7/0397 ,  C08G77/08 ,  C08G77/24 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0757

Abstract: PROBLEM TO BE SOLVED: To provide a novel polysiloxane which exhibits a high transparency at a wavelength of 193 nm or lower, even at a wavelength of 157 nm or lower, and even at a wavelength of 147 nm, 134 nm, etc., and is excellent in resistance to dry etching; and a radiation-sensitive resin composition containing the polysiloxane. SOLUTION: This polysiloxane has structural units (I) and/or structural units (II) represented by formula (1) (wherein R is a fluorinated or fluoroalkylated monovalent aromatic or alicyclic group; and R is the above monovalent aromatic or alicyclic group, H, a halogen, a monovalent hydrocarbon group, a haloalkyl group or an amino group) and has acid-associable groups. The radiation-sensitive resin composition contains the polysiloxane and a radiation-sensitive acid generator.

Abstract translation: 要解决的问题：即使在157nm或更低的波长，甚至在147nm，134nm等的波长下，也提供了在193nm以下的波长下显示高透明度的新型聚硅氧烷，以及 耐干蚀刻性优异; 和含有聚硅氧烷的辐射敏感性树脂组合物。 解决方案：该聚硅氧烷具有由式（1）表示的结构单元（I）和/或结构单元（II）（其中R 1是氟化或氟代烷基化的单价芳族或脂环族基团; R 2是上述一价 芳族或脂环族基团，H，卤素，一价烃基，卤代烷基或氨基），并且具有酸相关基团。 辐射敏感性树脂组合物含有聚硅氧烷和辐射敏感性酸发生剂。

公开(公告)号：JP2002311590A

公开(公告)日：2002-10-23

申请号：JP2001113462

申请日：2001-04-12

Applicant: JSR CORP

Inventor： YAMAMOTO MASASHI ,  ISHIDA EIKO ,  ISHII HIROYUKI ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition for forming a fine line pattern particularly even when the space width of a line-and-space pattern is wide and excellent also in transparency, sensitivity and resolution to radiation. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble resin containing repeating units derived from a compound obtained by substituting a group of formula (1), (2) or (3) (where R , R and R are each H or lower alkyl; X is methylene, -O- or -S-; and (a) is 1-5) for the hydrogen atom of a carboxyl group in (meth)acrylic acid and repeating units derived from 2-methyl-2-adamantyl (meth)acrylate or the like and exhibiting alkali solubility under the action of an acid, (B) a radiation sensitive acid generator and (C) a polycyclic compound having a functional group such as a t-butoxycarbonyl group.