公开(公告)号：JP2003020335A

公开(公告)日：2003-01-24

申请号：JP2002048643

申请日：2002-02-25

Applicant: Jsr Corp ,  ジェイエスアール株式会社

Inventor： IWAZAWA HARUO ,  HAYASHI AKIHIRO ,  SHIMOKAWA TSUTOMU ,  YAMAMOTO MASASHI

IPC: C08G77/08 ,  C08G77/22 ,  C08G77/24 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027

CPC classification number: G03F7/0397 ,  C08G77/08 ,  C08G77/24 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0757

Abstract: PROBLEM TO BE SOLVED: To provide a novel polysiloxane which exhibits a high transparency at a wavelength of 193 nm or lower, even at a wavelength of 157 nm or lower, and even at a wavelength of 147 nm, 134 nm, etc., and is excellent in resistance to dry etching; and a radiation-sensitive resin composition containing the polysiloxane. SOLUTION: This polysiloxane has structural units (I) and/or structural units (II) represented by formula (1) (wherein R is a fluorinated or fluoroalkylated monovalent aromatic or alicyclic group; and R is the above monovalent aromatic or alicyclic group, H, a halogen, a monovalent hydrocarbon group, a haloalkyl group or an amino group) and has acid-associable groups. The radiation-sensitive resin composition contains the polysiloxane and a radiation-sensitive acid generator.

Abstract translation: 要解决的问题：即使在157nm或更低的波长，甚至在147nm，134nm等的波长下，也提供了在193nm以下的波长下显示高透明度的新型聚硅氧烷，以及 耐干蚀刻性优异; 和含有聚硅氧烷的辐射敏感性树脂组合物。 解决方案：该聚硅氧烷具有由式（1）表示的结构单元（I）和/或结构单元（II）（其中R 1是氟化或氟代烷基化的单价芳族或脂环族基团; R 2是上述一价 芳族或脂环族基团，H，卤素，一价烃基，卤代烷基或氨基），并且具有酸相关基团。 辐射敏感性树脂组合物含有聚硅氧烷和辐射敏感性酸发生剂。

公开(公告)号：JP2003345020A

公开(公告)日：2003-12-03

申请号：JP2002151225

申请日：2002-05-24

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： NISHIMURA YUKIO ,  ISHII HIROYUKI ,  YAMAMOTO MASASHI ,  NISHIMURA ISAO ,  KOBAYASHI HIDEKAZU

IPC: G03F7/039 ,  C08F32/08 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a composition having high transparency for radiation at short wavelengths, excellent solubility with a developer and excellent sensitivity, pattern profile and etching resistance. SOLUTION: The radiation-sensitive resin composition contains a resin having a functional group which increases solubility with an alkali by the effect of an acid, and a radiation-sensitive acid generating agent. The resin has a repeating unit expressed by formula (1). In formula (1), R independently represents a hydrogen atom, a 1-4C alkyl group or a 1-4C perfluoroalkyl group, R 1 represents a hydrocarbon group or an oxygen-containing hydrocarbon group, n is 0 or 1 and m is 1 or 2. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种具有高透射度的组合物，其具有短波长的辐射，与显影剂的溶解性优异，并且具有优异的灵敏度，图案轮廓和耐蚀刻性。 解决方案：辐射敏感性树脂组合物含有具有官能团的树脂，该树脂具有通过酸的作用使碱对碱的溶解度增加和辐射敏感性酸产生剂。 树脂具有由式（1）表示的重复单元。 在式（1）中，R独立地表示氢原子，1-4C烷基或1-4C全氟烷基，R 表示烃基或含氧烃基，n是 0或1，m为1或2.版权所有（C）2004，JPO

公开(公告)号：JP2003295440A

公开(公告)日：2003-10-15

申请号：JP2002093942

申请日：2002-03-29

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： NISHIMURA ISAO ,  SHIMOKAWA TSUTOMU ,  NISHIMURA YUKIO ,  YAMAMOTO MASASHI

IPC: G03F7/039 ,  C08G63/66 ,  C08G65/04 ,  G03F7/032 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new acid-dissociating group-containing resin and a radiation-sensitive resin composition having high transparency to a radiation, satisfying basic performances required by a resist, such as sensitivity, resolution, dry etching resistance and pattern shape, excellent in adhesiveness to a substrate, causing no development defect in microfabrication and capable of producing semiconductor devices in a high yield.
SOLUTION: The acid-dissociating group-containing resin is alkali-insoluble or slightly alkali-soluble, becomes readily alkali-soluble by the action of an acid and contains a repeating unit containing an ether bond in the principal chain. The radiation-sensitive resin composition comprises the acid-dissociating group-containing resin and a radiation-sensitive acid generator.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种新的含酸解离基团的树脂和对辐射具有高透明度的辐射敏感性树脂组合物，满足抗蚀剂所需的基本性能，例如灵敏度，分辨率，耐干蚀刻性 和图案形状，与基板的粘附性优异，在微细加工中不产生显影缺陷，并且能够以高产率制造半导体器件。 解决方案：含酸解离基团的树脂是碱不溶性或轻微碱溶性的，通过酸的作用变得容易碱溶，并含有在主链中含有醚键的重复单元。 辐射敏感性树脂组合物包含含酸解离基团的树脂和辐射敏感性酸发生剂。 版权所有（C）2004，JPO

公开(公告)号：JP2009037258A

公开(公告)日：2009-02-19

申请号：JP2008270285

申请日：2008-10-20

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： SHIMA MOTOYUKI ,  ISHII HIROYUKI ,  YAMAMOTO MASASHI ,  MATSUDA DAIICHI ,  NAKAMURA ATSUSHI

IPC: G03F7/039 ,  C08F220/18 ,  G03F7/004 ,  H01L21/027

CPC classification number: G03F7/0397 ,  Y10S430/122

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition useful as a chemically amplified resist having high transmittance of radiation and excelling in sensitivity, resolution, dry etching resistance and pattern profile. SOLUTION: The radiation-sensitive resin composition comprises (A) resin having at least two recurring units selected out of recurring units derived from (meta) acrylic ester having a specific alicyclic hydrocarbon group, in the total amount of 5-70 mol% but each in the amount of 1-49 mol%, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供可用作具有高辐射透射率和优异的灵敏度，分辨率，耐干蚀刻性和图案轮廓的化学放大抗蚀剂的辐射敏感性树脂组合物。 解决方案：辐射敏感性树脂组合物包含（A）具有至少两个从具有特定脂环族烃基的（甲基）丙烯酸酯衍生的重复单元中选出的重复单元的树脂，其总量为5-70mol ％，但各自为1-49mol％，树脂不溶或几乎不溶于碱，但通过酸作用容易溶于碱，（B）光酸产生剂。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2004210910A

公开(公告)日：2004-07-29

申请号：JP2002380702

申请日：2002-12-27

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： NISHIMURA YUKIO ,  YAMAMOTO MASASHI ,  NISHIMURA ISAO

IPC: G03F7/039 ,  C08F20/10 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a (meth)acrylic polymer high in transparency to radiation, excellent in basic properties as a resist such as sensitivity, resolution, dry etching resistance, pattern form, etc. especially excellent in the solubility to a resist solvent, and suitable for a radiation-sensitive resin compound which reduces the roughness on a pattern sidewall after developing. SOLUTION: This (meth)acrylic polymer contains a repeating unit represented by formula (1) wherein R represents hydrogen or a methyl group, X represents a single bond or a 1-3C divalent organic group, Y represents a mutually independent single bond or a 1-3C divalent organic group, and R 1 represents a mutually independent hydrogen atom, a hydroxy group, a cyano group, or a -COOR 3 group. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2002182393A

公开(公告)日：2002-06-26

申请号：JP2001303791

申请日：2001-09-28

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  ISHII HIROYUKI ,  YAMAMOTO MASASHI ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, having excellent sensitivity, resolution, dry etching resistance, pattern shape, etc., and having small temperature dependence in heating after exposure. SOLUTION: The radiation sensitive resin composition contains (A) a resin comprising a copolymer of (meth)acrylic esters having an acid dissociable group- containing alicyclic structure represented by 5-t-butoxycarbonylnorbornyl (meth) acrylate and 8-t-butoxycarbonyltetracyclododecane (meth)acrylate and (meth) acrylic esters having a lactone-containing heterocyclic structure typified by compounds of formula (1) and (B) a radiation sensitive acid generating agent represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n- octanesulfonate, 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n- butanesulfonate or the like.

公开(公告)号：JP2002072484A

公开(公告)日：2002-03-12

申请号：JP2001108824

申请日：2001-04-06

Applicant: JSR CORP ,  IBM

Inventor： NISHIMURA YUKIO ,  YAMAHARA NOBORU ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU ,  ITO HIROSHI

IPC: C08K5/00 ,  C08L33/06 ,  C08L35/00 ,  C08L45/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2002072477A

公开(公告)日：2002-03-12

申请号：JP2000177487

申请日：2000-06-13

Applicant: JSR CORP

Inventor： KOBAYASHI HIDEKAZU ,  NUMATA ATSUSHI ,  YAMACHIKA MIKIO ,  YAMAMOTO MASASHI

IPC: G03F7/039 ,  C08K5/00 ,  C08K5/17 ,  C08L101/10 ,  G03F7/004 ,  G03F7/075 ,  G03F7/26 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive composition being effectively responsive to various types of radiations, having excellent sensitivity and resolution, and also having excellent long-term shelf stability and useful as a positive type chemical amplification type multilayer resist. SOLUTION: The positive type radiation sensitive resin composition for the upper layer resist of a multilayer resist contains (A) a low molecular compound obtained by preparing a compound having at least one amino group with one or two hydrogen atoms combining with a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of the hydrogen atoms of the amino group, (B) a radiation sensitive acid generating agent and (C) an alkali- insoluble or slightly alkali-soluble silicon-containing resin protected with an acid dissociable group and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.

公开(公告)号：JP2002023371A

公开(公告)日：2002-01-23

申请号：JP2000204223

申请日：2000-07-05

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  DOUKI KATSUJI ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F20/60 ,  C08F32/08 ,  C08K5/00 ,  C08L101/06 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.

公开(公告)号：JPH11228637A

公开(公告)日：1999-08-24

申请号：JP5269398

申请日：1998-02-19

Applicant: JSR CORP

Inventor： KAJITA TORU ,  SUWA MITSUFUMI ,  IWAZAWA HARUO ,  YAMAMOTO MASASHI

IPC: C08F222/06 ,  C08F232/08

Abstract: PROBLEM TO BE SOLVED: To obtain the subject copolymer having alicyclic groups and acid- cleavable polar organic groups, having high radiation penetrability, excellent dry etching resistance, excellent adhesivity, etc., and useful for optical materials, electronic materials, etc. SOLUTION: This polar norbornene derivative/maleic anhydride copolymer comprises repeating units of formula I (X and Y are each H or a 4-20C acid- cleavable organic group; A and B are each H or a 1-4C alkyl) preferably in an amount of 60-40 mol.% and repeating units of formula II preferably in an amount of 40-60 mol.%, and has a polystyrene-converted weight-average mol.wt. of 1,000-1,000,000. The copolymer is obtained by radically copolymerizing at least one kind of norbornene derivative of formula III [for example, 8-t- butoxycarbonyltetracyclo(4.4.0.1 , .1 , )dodeca-3-ene] with maleic anhydride and, if necessary, one or more other copolymerizable unsaturated compound [for example, bicyclo(2.2.1)hept-2-enel.