公开(公告)号：EP4276056A9

公开(公告)日：2023-12-27

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).

公开(公告)号：EP4276056A1

公开(公告)日：2023-11-15

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).

公开(公告)号：EP3726056A1

公开(公告)日：2020-10-21

申请号：EP20169715.8

申请日：2020-04-15

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  BALDO, Lorenzo ,  DUQI, Enri

IPC: F04B43/04 ,  F04B45/047 ,  F04B43/02

Abstract: The micropump device (1) is formed in a monolithic body (3) of semiconductor material integrating a plurality of actuator elements (5) arranged side-by-side. Each actuator element (5) has a first chamber (15) extending at a distance from a first face (3A) of the monolithic body; a membrane (18) arranged between the first face (3A) and the first chamber (15); a piezoelectric element (19) extending on the first face (3A) over the membrane (18); a second chamber (20), arranged between the first chamber (15) and a second face (3B) of the monolithic body; a fluidic inlet path (10) fluidically connecting the second chamber (20) with the outside of the monolithic body (3); and a fluid outlet opening (11) extending in a transverse direction in the monolithic body (3) from the second face (3B) as far as the second chamber (20), through the first chamber (15). The monolithic formation of a plurality of actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

公开(公告)号：EP3687192A1

公开(公告)日：2020-07-29

申请号：EP20153473.2

申请日：2020-01-23

Applicant: STMicroelectronics S.r.l.

Inventor： CERINI, Fabrizio ,  DUQI, Enri ,  ADORNO, Silvia ,  BALDO, Lorenzo

IPC: H04R19/00

Abstract: An actuation structure (10) of a MEMS electroacoustic transducer (11) is formed in a die (12) of semiconductor material having a monolithic body (13) with a front surface (13a) and a rear surface (13b) extending in a horizontal plane (xy) and defined in which are: a frame (14); an actuator element (15) arranged in a central opening (16) defined by the frame (14); cantilever elements (18), coupled at the front surface (13a) between the actuator element (15) and the frame (14); and piezoelectric regions (19) arranged on the cantilever elements (18) and configured to be biased to cause a deformation of the cantilever elements (18) by the piezoelectric effect. A first stopper arrangement (30) is integrated in the die (12) and configured to interact with the cantilever elements (18) to limit a movement thereof in a first direction of a vertical axis (z) orthogonal to the horizontal plane (xy), towards the underlying central opening (16).

公开(公告)号：EP2121513A2

公开(公告)日：2009-11-25

申请号：EP08707208.8

申请日：2008-01-23

Applicant: STMicroelectronics S.r.l.

Inventor： BALDO, Lorenzo ,  COMBI, Chantal ,  CORTESE, Mario, Francesco

IPC: B81B7/00 ,  G01L9/00 ,  G01L13/02 ,  G01D11/24

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: a substrate (2) provided with at least one passing opening (5), a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at least one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises: a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).

公开(公告)号：EP1945561A2

公开(公告)日：2008-07-23

申请号：EP06777802.7

申请日：2006-07-14

Applicant: STMicroelectronics S.r.l.

Inventor： COMBI, Chantal ,  VIGNA, Benedetto ,  ZIGLIOLI, Federico Giovanni ,  BALDO, Lorenzo ,  MAGUGLIANI, Manuela ,  LASALANDRA, Ernesto ,  RIVA, Caterina

IPC: B81B7/02

CPC classification number: B81B7/0061 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R1/04 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.

Abstract translation: 具有A衬底级组件的半导体材料的器件衬底具有顶面和外壳的第一集成器件，包括器件衬底内形成的掩埋空腔，并用悬浮在在顶面的接近掩埋空腔的膜。 甲封盖衬底耦合到所述顶面之上的器件衬底，以便覆盖所述第一集成器件在寻求做的膜上方提供第一空白空间的方式。 电接触元件电连接与所述衬底级组件的外部集成器件。 在一个实施例中，器件衬底至少集成设置有respectivement膜的进一步集成器件，和另外的空的空间，从所述第一空的空间流体地隔离，则在进一步的集成器件的respectivement膜提供。

公开(公告)号：EP4005972A1

公开(公告)日：2022-06-01

申请号：EP21211139.7

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics International N.V.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  FERRARI, Paolo ,  VIGNA, Benedetto ,  VILLA, Flavio Francesco ,  CASTOLDI, Laura Maria ,  GELMI, Ilaria

IPC: B81C1/00 ,  H04R1/08

Abstract: A semiconductor device includes: a substrate (2); a transduction microstructure (3) integrated in the substrate (2); a cap (5) joined to the substrate (2) and having a first face (5a) adjacent to the substrate (2) and a second, outer, face (5b); and a channel (15) extending through the cap (5) from the second face (5b) to the first face (5a) and communicating with the transduction microstructure (3). A protective membrane (17) made of porous polycrystalline silicon permeable to aeriform substances is set across the channel (15).

公开(公告)号：EP3854751A1

公开(公告)日：2021-07-28

申请号：EP21152454.1

申请日：2021-01-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BONI, Nicolò ,  BALDO, Lorenzo ,  MERLI, Massimiliano ,  CARMINATI, Roberto

IPC: B81C1/00 ,  G02B26/08

Abstract: A method of processing a wafer (100) for manufacturing an oscillating structure (30), comprising the steps of: forming torsional elastic elements (56, 58); forming a mobile element (54, 60) connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure (112); and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.

公开(公告)号：EP3808199A1

公开(公告)日：2021-04-21

申请号：EP20201170.6

申请日：2020-10-09

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  CERINI, Fabrizio ,  BALDO, Lorenzo

IPC: A24F47/00 ,  G01L1/16 ,  G01L9/00 ,  G01L23/10 ,  H01L41/113 ,  G01L9/08 ,  A61B5/00 ,  B81B7/00 ,  A24F40/51 ,  A61M11/04 ,  A61M15/06

Abstract: A MEMS switch (100), actuatable by a fluid, wherein a piezoelectric pressure sensor (130) detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor (130) is formed by a chip (139) of semiconductor material having a through cavity (140) and a sensitive membrane (142), which extends over the through cavity (140) and has a first and a second surface (142A, 142B). The piezoelectric pressure sensor (130) is mounted on a face of a board (118) having a through hole (144) so that the through cavity (140) overlies and is in fluid connection with the through hole (144). The board (118) has a fixing structure (133, 134), which enables securing in an opening (136) of a partition wall (107) separating a first and a second space (126, 117) from each other. The board (118) is arranged so that the first surface (142A) of the sensitive membrane (142) faces the first space (126), and the second surface (142B) of the sensitive membrane (142) faces the second space (117).

公开(公告)号：EP3726113A1

公开(公告)日：2020-10-21

申请号：EP20169706.7

申请日：2020-04-15

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo

IPC: F16K99/00

Abstract: A microfluidic valve (50) formed in a body (51) having a first (51A) and a second (51B) surface; an inlet channel (54) extending in the body (51) from the second surface (51B); a first transverse channel (56) extending in the body (51) in a transverse direction with respect to the inlet channel (54); and an outlet channel (60) extending in the body (51) from the first surface (51A). The inlet channel (54), the first transverse channel (56) and the outlet channel (60) form a fluidic path (92). The microfluidic valve (50) further has an occluding portion (62), formed by the body (51) and extending over the transverse channel (56); and a piezoelectric actuator (72) coupled to the occluding portion (62) and configured to move the occluding portion (62) from an opening position of the valve (50), where the occluding portion (62) does not interfere with the fluidic path (92), and a closing position of the valve (50), where the occluding portion (62) interferes with and interrupts the fluidic path (92).