Abstract:
A semiconductor memory, particularly of the electrically programmable and erasable type such as a flash memory, comprises at least one two-dimensional array (SCT) of memory cells (MC) with a plurality of rows (row0-row511) and a plurality of columns (COL) of memory cells. The columns of the two-dimensional array are grouped in a plurality of packets (CP0-CP1), and the memory cells belonging to the columns of each packet are formed in a respective semiconductor region (4) with a first type of conductivity, this region (4) being distinct from the semiconductor regions (4) with the first type of conductivity in which the memory cells belonging to the columns of the remaining packets are formed. The semiconductor regions with the first type of conductivity divide the set of memory cells belonging to each row into a plurality of subsets of memory cells that constitute elemental memory units which can be modified individually. It is thus possible to produce memory units of very small dimensions (for example, bytes, words, or long words) which can be erased individually, without excessive overhead in terms of area.
Abstract:
The memory cell (101) is of the type with a single level of polysilicon, and is produced in a substrate (102) of semiconductor material with a first type of conductivity, and comprises a control gate region (6) with a second type of conductivity, formed in the substrate (102) in a first region of active area (30); regions of source (4a, 4b) and drain (5a, 5b) with the second type of conductivity, formed in the substrate (102) in a second region of active area (31); and a floating gate region (9) which extends transversely relative to the first (30) and the second (31) regions of active area. The control gate region (6) is surrounded by a first well (103) with the first type of conductivity, which in turn is surrounded, below and laterally, by a third well (108) with the second type of conductivity. The regions of source (4a, 4b) and drain (5a, 5b) are accommodated in a second well (104) with the first type of conductivity, which in turn is surrounded below and laterally by a fourth well (112) with the second type of conductivity.
Abstract:
A process for manufacturing an array of cells in a body (1) of semiconductor material wherein a common conduction region (11) of a first conductivity type and a plurality of shared control regions (12), of a second conductivity type, are formed in the body. The shared control regions (12) extend on the common conduction region (11) and are laterally delimited by insulating regions (32). Then, a grid-like layer (36) is formed on the body (1) to delimit a first plurality of empty regions (38) directly overlying the body and conductive regions of semiconductor material and the first conductivity type (44) are formed by filling the first plurality of empty regions (38), each conductive region forming, together with the common conduction region and an own shared control region (12), a bipolar junction transistor (20).
Abstract:
A method of self-test and correction of errors due to a loss charge for a flash memory constituted by an array or matrix of cells (bits), organized in rows and columns, erasable and programmable by whole sectors in which the matrix is divided, implemented by realizing at least an additional row and at least an additional column of cells for each memory sector; storing parity codes is the additional row and column, and carrying out periodically a self-test routine and eventual correction routine composed of the following steps: repeating the sequential reading per bytes and parity check; verifying the consistency of the parity value with the value stored in the respective parity bit; if the verification is negative, retaining the current row address and proceeding to sequentially verify column parity starting from the first column until identifying the column for which the verification yields a negative result, and if the failed bit so individuated is "1" reprogramming it to "0".
Abstract:
A flash compatible EEPROM device has a first flash matrix and a second matrix with EEPROM functionalities of substantially similar layout, both are divided into blocks of cells formed in substrate regions isolated from one another. In said second matrix, the information is organized in pages each one contained in a row of memory cells of one of said block of subdivision of the matrix. A hierarchic structure including a row decoder addresses the wordline of all the cells of a selected row of the block, co-operating with a column decoder in selecting single cells of the rows. A boosted voltage of polarity opposite to the single supply voltage of the device is applied during an erasing phase to a single wordline selected by means of said row decoder, to page-erase said information by applying a boosted voltage to the common source of all the cells of the block and to the isolated region of the substrate containing all the cells of the block. A logical circuit confirms the programmed state of each cell containing a logic zero information of the not erased rows of the block after one or more rows or pages have been erased, applying said first boosted voltage to a wordline at a time and said supply voltage to one or more bitlines at a time for confirming a preexistent programmed state, while keeping to ground voltage the common source of all the cells of the block and the confined isolated region of the substrate.