中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

36 records (took 0.03 seconds)

    MANUFACTURING METHOD OF PACKAGE CARRIER
    12.
    发明申请
    MANUFACTURING METHOD OF PACKAGE CARRIER 有权

    公开(公告)号：US20250040026A1

    公开(公告)日：2025-01-30

    申请号：US18918080

    申请日：2024-10-17

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen ,  Chi-Chun Po

    IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

    Abstract: A manufacturing method of the package carrier includes the following steps. A circuit substrate having a through via is provided. A heat-conducting material layer coving the inner wall of the through via is electroplated on the circuit substrate. A first build-up structure and a second build-up structure are respectively formed on two opposite sides of the circuit substrate. Parts of the first build-up structure, the circuit substrate, the heat-conducting material layer and the second build-up structure are removed to expose the remaining heat-conducting material layer, so as to define a heat-conducting element and form a circuit structure layer including a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conducting portion is aligned with a side surface of the circuit structure layer.

    Circuit board structure
    13.
    发明授权
    Circuit board structure 有权

    公开(公告)号：US12144113B2

    公开(公告)日：2024-11-12

    申请号：US17938977

    申请日：2022-09-07

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Chi-Min Chang ,  Ming-Hao Wu ,  Yi-Pin Lin ,  Tung-Chang Lin ,  Jun-Rui Huang

    IPC: H05K1/11 ,  H05K1/02

    Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.

    Printed circuit board stack structure and manufacturing method thereof
    14.
    发明授权
    Printed circuit board stack structure and manufacturing method thereof 有权

    公开(公告)号：US11910535B2

    公开(公告)日：2024-02-20

    申请号：US17685404

    申请日：2022-03-03

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Shih-Lian Cheng

    IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42

    CPC classification number: H05K3/0094 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K3/429 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/09909

    Abstract: A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

    Multilayer circuit board structure and manufacturing method thereof
    15.
    发明授权
    Multilayer circuit board structure and manufacturing method thereof 有权

    公开(公告)号：US10736215B1

    公开(公告)日：2020-08-04

    申请号：US16421467

    申请日：2019-05-23

    Applicant: Unimicron Technology Corp.

    Inventor： Shao-Chien Lee ,  Ming-Hao Wu ,  Zong-Hua Li

    IPC: H05K1/02 ,  H05K3/32 ,  H05K3/46 ,  H05K3/24

    Abstract: A multilayer circuit board structure includes a first multilayer circuit board and a second multilayer circuit board. The first multilayer circuit board includes a first patterned circuit layer and a first dummy circuit layer. The first dummy circuit layer surrounds the first patterned circuit layer. The second multilayer circuit board is disposed on the first multilayer circuit board, and includes a second patterned circuit layer and a second dummy circuit layer surrounding the second patterned circuit layer. The first patterned circuit layer is bonded to the second patterned circuit layer and the first dummy circuit layer is bonded to the second dummy circuit layer. A hollow space is defined between the first multilayer circuit board and the second multilayer circuit board.

    CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
    16.
    发明申请
    CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20180153036A1

    公开(公告)日：2018-05-31

    申请号：US15427061

    申请日：2017-02-08

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Wen-Fang Liu

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

    Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive via connecting the first and the second patterned circuit layers. The first build-up circuit structure is disposed on the upper surface of the core layer and covers the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface.

    SUBSTRATE STRUCTURE HAVING COMPONENT-DISPOSING AREA AND MANUFACTURING PROCESS THEREOF
    19.
    发明申请
    SUBSTRATE STRUCTURE HAVING COMPONENT-DISPOSING AREA AND MANUFACTURING PROCESS THEREOF 有权
    具有组件处理区域的基板结构及其制造工艺

    公开(公告)号：US20140138130A1

    公开(公告)日：2014-05-22

    申请号：US13740286

    申请日：2013-01-14

    Applicant: UNIMICRON TECHNOLOGY CORP.

    Inventor： Cheng-Jui Chang ,  Ming-Hao Wu

    IPC: H05K1/11 ,  H05K1/09 ,  H05K13/04

    CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15333 ,  H01L2924/37001 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    Abstract: A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on. The second dielectric-layer is disposed on the first dielectric-layer and covers the laser-resistant metallic-pattern, the second dielectric-layer includes a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric-layer and communicated with the openings to expose the pads.

    Abstract translation: 提供了具有部件配置区域的基板结构及其工艺。 具有部件配置区域的基板结构包括芯层，第一介电层，耐激光金属图案和第二介电层。 芯层包括第一表面，部件布置区域和设置在第一表面上并且包括多个焊盘的图案化金属层，并且焊盘位于部件布置区域内。 第一介电层设置在芯层上并且包括多个开口以分别暴露焊盘。 激光抵抗金属图案设置在第一电介质层上并且包围第一电介质层的投影区域，其中元件布置区域正交地投影在其上。 第二电介质层设置在第一电介质层上并覆盖耐激光金属图案，第二介电层包括与投影区域对应的部件设置腔，穿透第二介电层并与 露出垫的开口。

    Circuit board structure
    20.
    发明授权
    Circuit board structure 有权

    公开(公告)号：US12256488B2

    公开(公告)日：2025-03-18

    申请号：US18162713

    申请日：2023-02-01

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Jun-Rui Huang ,  Ming-Hao Wu ,  Tung-Chang Lin

    IPC: H05K1/02 ,  H05K1/11

    Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.

Patent Agency Ranking