公开(公告)号：US20080137316A1

公开(公告)日：2008-06-12

申请号：US11857871

申请日：2007-09-19

Applicant: Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H01R9/00 ,  H05K3/10

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Abstract translation: 公开了使用和印刷这种导电图案的导电图案和方法。 在某些实例中，导电图案可以通过在衬底上的支撑件之间设置导电材料来制造。 可以移除支撑件以提供具有期望长度和/或几何形状的导电图案。

公开(公告)号：EP3156157A4

公开(公告)日：2018-02-21

申请号：EP15808870

申请日：2015-06-16

Applicant: UNIV OSAKA

Inventor： SUGANUMA KATSUAKI ,  JIU JINTING

IPC: B22F9/24 ,  B22F1/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00 ,  H05K1/09

CPC classification number: B22F1/0022 ,  B22F1/00 ,  B22F1/0014 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B22F2304/10 ,  B22F2998/10 ,  C09D5/24 ,  C09D7/1275 ,  C09D7/1283 ,  C09D7/68 ,  C09D7/69 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00 ,  H05K1/09 ,  H05K1/092 ,  H05K2201/0203

Abstract: A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.

公开(公告)号：US20240276640A1

公开(公告)日：2024-08-15

申请号：US18386053

申请日：2023-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young-Gon Kim ,  Hokwon Yoon ,  Eunseok Kang

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/0254 ,  H05K3/4015 ,  H05K2201/0203 ,  H05K2201/099

Abstract: An electronic component package according to an embodiment includes a circuit board including an insulating layer, a circuit wiring disposed inside the insulating layer, a plurality of first conductive pads disposed in a first region on the insulating layer and connected to the circuit wiring, an auxiliary pad disposed over the first conductive pad and having a diameter smaller than that of the first conductive pad, and a solder resist layer disposed over the insulating layer, having a first opening overlapping the first region, and spaced apart from the auxiliary pad; an electronic component spaced apart from the solder resist layer and disposed over the first opening; and a conductive adhesive member electrically connecting the auxiliary pad and the electronic component.

公开(公告)号：US20170188455A1

公开(公告)日：2017-06-29

申请号：US14998263

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Yoshihiro Tomita ,  Joshua D. Heppner ,  Shawna M. Liff ,  Pramod Malatkar

IPC: H05K1/03 ,  H05K1/18 ,  A41D13/00 ,  H05K3/00 ,  A41D1/00 ,  A43B3/00 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B1/0054 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

公开(公告)号：US20170164484A1

公开(公告)日：2017-06-08

申请号：US15439555

申请日：2017-02-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K3/12 ,  H05K3/00 ,  H05K3/22 ,  H05K1/09

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

公开(公告)号：WO2016012753A1

公开(公告)日：2016-01-28

申请号：PCT/GB2015/052024

申请日：2015-07-14

Applicant: ALPHA METALS, INC. ,  SETNA, Rohan P

Inventor： PUJARI, Narahari ,  SINGH, Bawa ,  BHATKAL, Ravi ,  SARKAR, Siuli ,  RUSTOGI, Anubhav

IPC: H01B1/22 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K3/34

CPC classification number: H01B1/22 ,  B22F1/0014 ,  B22F1/0055 ,  B22F1/0074 ,  B22F1/025 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K1/095 ,  H05K1/189 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste comprising conductive particles dispersed in an organic medium, the organic medium comprising a solvent; and a binder comprising a polyester.

Abstract translation: 一种导电浆料，其包含分散在有机介质中的导电颗粒，所述有机介质包含溶剂; 和包含聚酯的粘合剂。

公开(公告)号：WO2014142007A1

公开(公告)日：2014-09-18

申请号：PCT/JP2014/055832

申请日：2014-03-06

Applicant: DIC株式会社

Inventor： 義原　直 ,  勝田　晴彦 ,  片山　嘉則 ,  白髪　潤 ,  村川　昭 ,  冨士川　亘 ,  斉藤　公恵

IPC: H05K3/18 ,  C25D5/56 ,  C25D7/00

CPC classification number: H05K3/188 ,  C25D5/02 ,  C25D5/56 ,  C25D7/00 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/12 ,  H05K3/207 ,  H05K3/246 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/09218 ,  H05K2203/0108 ,  H05K2203/097

Abstract: 印刷プロセスとめっきプロセスの複合技術によりパターン断面形状に優れる導電性高精細パターンを形成する方法を提供するとともに、めっき核パターンをはじめとする積層体の各界面に優れた密着性を付与することで、高精度の電気回路として好適に用いることができる導電性高精細パターン、その製造方法を提供する。（１）基板上に、樹脂組成物を塗布してなる受理層を形成する工程、（２）めっき核粒子を含有するインクを凸版反転印刷法にて印刷し、受理層上にめっき核パターンを形成する工程、（３）工程（２）のめっき核パターン上へ電解めっき法により金属を析出させる工程、を有する導電性高精細パターン形成方法、当該方法で得られた導電性高精細パターン及びこれを含む電気回路を提供する。

Abstract translation: 提供了一种通过组合打印处理和电镀处理的技术形成具有优异图案横截面形状的导电超细纹图案的方法。 进一步提供：优选使用通过对包括镀芯图案的分层产品的各界面提供优异粘附性的导电超细图案作为高精度电路; 和导电超细纹图案制作方法。 具体地提供一种导电性超细纹图案形成方法，包括：（1）通过在基板上涂布树脂组合物形成接收层的步骤; （2）通过凸版反转印刷来印刷含有镀芯的颗粒的油墨的步骤，以及在接收层上形成镀芯图案; 和（3）以及通过电镀将金属沉积在步骤（2）的镀芯图案上的步骤。 进一步具体提供的是通过所述方法获得的导电超细纹图案和包括导电超细纹图案的电路。

公开(公告)号：WO2015115161A1

公开(公告)日：2015-08-06

申请号：PCT/JP2015/050620

申请日：2015-01-13

Applicant: デクセリアルズ株式会社

Inventor： 猿山　賢一 ,  阿久津　恭志

IPC: H01R11/01 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01L21/60

CPC classification number: H05K1/181 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2203/326 ,  H01L2224/81203 ,  H01L2224/83101 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0203

Abstract: 　回路基板の配線ピッチや電子部品の電極端子がファインピッチ化されても、電子部品と回路基板との導通性を確保するとともに、電子部品の電極端子間におけるショートを防止する。　回路基板（１２）上に異方性導電接着剤（１）を介して電子部品（１８）が接続された接続体（１０）において、異方性導電接着剤（１）は、バインダー樹脂（３）に導電性粒子（４）が規則的に配列され、電子部品（１８）に形成された接続電極（１９）間のスペース（２３）における導電性粒子（４）同士の粒子間距離は、回路基板（１２）に形成された基板電極（１７）と接続電極（１９）との間に捕捉された導電性粒子(４)同士の粒子間距離よりも長い。

Abstract translation: 本发明的目的是确保当电路基板或电子部件的电极端子的布线间距被赋予更细的间距并且防止在电极之间发生短路时，在电子部件和电路基板之间存在导电性 电子元件的端子。 本发明提供了一种连接体（10），其具有通过各向异性导电粘合剂（1）连接在电路基板（12）上的电子部件（18），其中各向异性导电粘合剂（1）具有规则排列的导电颗粒（4） 在粘合剂树脂（3）中，形成在电子部件（18）上的连接电极（19）之间的空间（23）中的导电粒子（4）之间的粒子间距离长于 捕集在形成在电路基板（12）上的连接电极（19）和基板电极（17）之间的导电颗粒（4）。

公开(公告)号：WO2017112066A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/057909

申请日：2016-10-20

Applicant: INTEL CORPORATION

Inventor： TOMITA, Yoshihiro ,  HEPPNER, Joshua D. ,  LIFF, Shawna M. ,  MALATKAR, Pramod

IPC: H01L21/677

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

Abstract translation: 根据所公开的实施例，提供了用于实现磁性颗粒嵌入式柔性衬底，用于磁盘的印刷柔性衬底或用于磁化或磁化的磁性载体的电磁载体的方法，系统和设备， 铁磁柔性衬底。 例如，根据一个实施例，公开了用于制造具有一个或多个电互连以与电气设备的引线耦合的柔性基板的装置; 将磁性颗粒或铁磁性颗粒整合到柔性基板中; 在柔性衬底的一个或多个制造过程期间用载体板支撑柔性衬底，其中柔性衬底通过与柔性衬底集成的磁性颗粒或铁磁颗粒之间的吸引磁力与载体板保持平坦， 载板的互补磁吸引力; 以及在完成用于柔性衬底的一个或多个制造工艺之后从柔性衬底移除柔性衬底。 披露了其他相关的实施例。

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC classification number: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.