公开(公告)号：EP0998723A2

公开(公告)日：2000-05-10

申请号：EP98947338.4

申请日：1998-07-25

Applicant: Angstrom Pharmaceuticals, inc.

Inventor： Angstrom Pharmaceuticals, inc.

IPC: G06K19/00

CPC classification number: G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2203/1446

Abstract: The invention concerns a module, in particular designed to be used in chip cards, consisting of a chip module including an integrated switching circuit and a transmission module comprising at least a transmitting element for data and/or energy transmission between the integrated switching circuit and an external appliance or vice-versa. The chip module and the transmission module each have contact elements used for their mutual electrical connection, the chip module (3) contact elements (11) and the transmission module (2) contact elements (7) being assembled by blocking the mutually corresponding contact elements (7, 11).

公开(公告)号：EP1121006A3

公开(公告)日：2003-05-21

申请号：EP00311220.8

申请日：2000-12-15

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Watanabe, Yoshikiyo, Alps Electric Co., Ltd.

IPC: H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K3/3426 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A transmitter-receiver unit is disclosed wherein a frame (4) is provided with solder-rise preventing means (H) between a circuit board (1) and retaining portions (4c), thereby preventing solder from rising up to the retaining portions (4c). Thus, the engagement between engaging holes (6c) and the retaining portions (4c) is ensured in comparison with the prior art. The transmitter-receiver unit permits a cover (6) to be mounted positively to the frame (4) and is suitable for the reduction of size and weight.

Abstract translation: 公开了一种发射机 - 接收机单元，其中框架在电路板（1）和保持部分（4c）之间设置有焊料上升防止装置（H），从而防止焊料上升到保持部分。 因此，与现有技术相比，确保了接合孔和保持部之间的接合。 发射器 - 接收器单元允许盖子正确地安装到框架上并且适合于减小尺寸和重量。

公开(公告)号：EP0924764A2

公开(公告)日：1999-06-23

申请号：EP98121912.4

申请日：1998-11-18

Applicant: Hitachi, Ltd. ,  Hitachi ULSI Systems Co.,Ltd.

Inventor： Azuma, Shuichiro ,  Okinaga, Takayuki ,  Emata, Takashi ,  Kudaishi, Tomoaki ,  Wada, Tamaki ,  Nishi, Kunihiko ,  Masuda, Masachika ,  Sugano, Toshio

IPC: H01L25/065 ,  H01L23/495

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

Abstract translation: 通过将具有以高密度封装在布线板上的存储芯片的载带封装（TCP）安装在一起来实现大容量存储器的小型电子设备（存储器模块和存储卡）。 更具体地说，TCP由绝缘带，在其一侧形成的引线，封装有半导体芯片的封装树脂和布置在两个相对的短边上的一对支撑引线组成。 一对支撑引线用于将TCP保持在相对于布线板的安装表面的恒定倾斜角度。 通过改变垂直于安装表面的长度，可以将TCP安装到期望的倾斜角度。

公开(公告)号：US20170310031A1

公开(公告)日：2017-10-26

申请号：US15646234

申请日：2017-07-11

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/11 ,  H01R43/04 ,  H01R12/71

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US20170149156A1

公开(公告)日：2017-05-25

申请号：US15200695

申请日：2016-07-01

Applicant: MERCURY SYSTEMS, INC.

Inventor： Philip BEUCLER ,  Daniel COOLIDGE ,  Darryl J. MCKENNEY ,  Kevin JORCZAK

IPC: H01R12/71 ,  H01R13/652 ,  H05K1/11 ,  H05K3/34 ,  H05K1/02 ,  H01R12/58 ,  H05K1/18

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

公开(公告)号：US20090246615A1

公开(公告)日：2009-10-01

申请号：US12358032

申请日：2009-01-22

Applicant: Junyoung Park

Inventor： Junyoung Park

IPC: H01M6/42 ,  H01M4/02

CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

Abstract: A battery pack that prevents a solder material from flowing down due to a tab electrically connecting a battery to a protective circuit board, thereby improving reliability, coupling efficiency, safety, and productivity is disclosed. The battery pack includes: a multi-cell battery having a positive electrode and a negative electrode, in which a plurality of battery cells are electrically connected to each other; a protective circuit board electrically connected to the multi-cell battery and having via holes; a pair of conductive tabs each including an insert portion inserted into a corresponding via hole and a bending portion integrally extending from the insert portion and bent from the insert portion; and a pair of soldering portions each being formed at at least some portions of a corresponding insert portion and a corresponding bending portion.

Abstract translation: 公开了一种电池组，其防止由于电池将电池连接到保护电路板而将焊料材料向下流动，从而提高了可靠性，耦合效率，安全性和生产率。 电池组包括：具有正电极和负电极的多单元电池，多个电池单元彼此电连接; 电连接到多节电池并具有通孔的保护电路板; 一对导电片，每个导电片包括插入对应的通孔中的插入部分和从插入部分整体延伸并从插入部分弯曲的弯曲部分; 以及一对焊接部分，每个焊接部分在相应的插入部分和对应的弯曲部分的至少一些部分处形成。

公开(公告)号：US20010009503A1

公开(公告)日：2001-07-26

申请号：US09758569

申请日：2001-01-10

Applicant: Alps Electric Co., Ltd.

Inventor： Yoshikiyo Watanabe

IPC: H05K007/20

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K3/3426 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A transmitter-receiver unit is disclosed wherein a frame is provided with solder-rise preventing means between a circuit board and retaining portions, thereby preventing solder from rising up to the retaining portions. Thus, the engagement between engaging holes and the retaining portions is ensured in comparison with the prior art. The transmitter-receiver unit permits a cover to be mounted positively to the frame and is suitable for the reduction of size and weight.

Abstract translation: 公开了一种发送器 - 接收器单元，其中框架在电路板和保持部分之间设置有焊料上升防止装置，从而防止焊料上升到保持部分。 因此，与现有技术相比，确保了接合孔和保持部之间的接合。 发射器 - 接收器单元允许盖子正确地安装到框架上，并且适合于减小尺寸和重量。

公开(公告)号：US4072377A

公开(公告)日：1978-02-07

申请号：US684884

申请日：1976-05-10

Applicant: Harley J. Van de Loo ,  Hans J. Ziegler

Inventor： Harley J. Van de Loo ,  Hans J. Ziegler

IPC: H01R9/24 ,  H02G15/076 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K1/10

CPC classification number: H05K1/118 ,  H01R12/58 ,  H01R9/2466 ,  H02G15/076 ,  H05K3/308 ,  H01R12/613 ,  H01R12/62 ,  H05K1/0393 ,  H05K2201/096 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/1078 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/1446 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/3447

Abstract: A terminal block includes a printed circuit element which has conductive paths deposited on one of its surfaces, with each path extending from a terminal area surrounding an opening in the element to a centralized area. In one embodiment, the printed circuit element is a rigid board and terminals are mounted on the board and extend through each opening and project outwardly on the opposite surface of the board. The terminals are swedged at one end to physically retain them on the board and to electrically connect them to the conductive path. The rigid board is attached to an open box-like shell through which a cable carrying wire conductor extends and connects, interior to the block, to the conductive paths on the circuit board. In another embodiment, the circuit element is a flat, flexible sheet which is disposed against a support board provided with apertures aligned with the openings in the flexible sheet. The terminals extend through both the board and the sheet and may be swedged at one end to grip the support board and flexible element and to electrically connect the terminals to the conductive path. Alternately, the terminals may be soldered to the terminal area surrounding an opening of the flexible sheet. A back plate may be connected to the board to sandwich the flexible sheet therebetween.

Abstract translation: 端子块包括具有沉积在其表面之一上的导电路径的印刷电路元件，每个路径从围绕元件中的开口的端子区域延伸到集中区域。 在一个实施例中，印刷电路元件是刚性板，并且端子安装在板上并延伸穿过每个开口并在板的相对表面上向外突出。 端子在一端被摆动，以物理地将它们保持在板上并将它们电连接到导电路径上。 刚性板连接到敞开的箱状壳体上，电缆承载线导体通过该外壳延伸并连接到块体内部到电路板上的导电路径。 在另一个实施例中，电路元件是平坦的柔性片材，其被设置为抵靠设置有与柔性片材中的​​开口对准的孔的支撑板。 端子延伸穿过板和板，并且可以在一端被卷绕以夹持支撑板和柔性元件并且将端子电连接到导电路径。 或者，端子可以焊接到围绕柔性片的开口的端子区域。 背板可以连接到板以将柔性片夹在其间。

公开(公告)号：JP3607859B2

公开(公告)日：2005-01-05

申请号：JP2000244762

申请日：2000-08-11

Applicant: アスモ株式会社

Inventor： 英之 ▼高▲橋

IPC: H02K3/50 ,  H02K11/00 ,  H02K29/00 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01R12/32

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H02K3/50 ,  H02K11/33 ,  H05K3/4046 ,  H05K2201/09854 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10856

公开(公告)号：JP3718039B2

公开(公告)日：2005-11-16

申请号：JP34787197

申请日：1997-12-17

Applicant: 株式会社日立製作所 ,  株式会社日立超エル・エス・アイ・システムズ

Inventor： 智明 下石 ,  環 和田 ,  正親 増田 ,  修一郎 東 ,  孝司 江俣 ,  隆幸 沖永 ,  利夫 管野 ,  邦彦 西

IPC: H01L25/00 ,  G11C5/00 ,  H01L23/50 ,  H01L25/10 ,  H01L25/18 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.