公开(公告)号：WO2007104702A1

公开(公告)日：2007-09-20

申请号：PCT/EP2007/052191

申请日：2007-03-08

Applicant: ELETTROLAB S.R.L. ,  BORTOT, Diego

Inventor： BORTOT, Diego

IPC: H05K3/44 ,  H05K1/02

CPC classification number: H05K3/445 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10106 ,  H05K2201/10939

Abstract: The invention refers to an electronic device (300) for ambient lighting. The device according to the invention comprises a supporting element (1) with a metallic base (2) for dissipating at least a part of heat generated by electronic components (501-503). The metallic base (2) comprises one or more seats (4) electrically isolated from the metallic base (2), at least one of the electrically isolated seats (4) being suitable for containing a leg wire (100) of oneof the electronic components (501-503) while keeping the leg wire (100) electrically isolated from the metallic base (2).

Abstract translation: 本发明涉及用于环境照明的电子设备（300）。 根据本发明的装置包括具有用于消散由电子部件（501-503）产生的热量的至少一部分的金属基座（2）的支撑元件（1）。 金属基座（2）包括与金属基座（2）电隔离的一个或多个座（4），电隔离座（4）中的至少一个适于容纳电子元件之一的腿线（100） （501-503），同时保持腿线（100）与金属基座（2）电隔离。

公开(公告)号：WO2006006206A1

公开(公告)日：2006-01-19

申请号：PCT/JP2004/009719

申请日：2004-07-08

Applicant: 富士通株式会社 ,  森 英一

Inventor： 森 英一

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0231 ,  H05K1/0254 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10462 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611

Abstract: 　高電圧回路を構成するインバータは、冷陰極管に高電圧を供給して発光駆動する。インバータの高電圧発生素子の高電圧出力端子と負荷を接続するコネクタユニットのコネクタ端子とを一体構造としている。即ち、インバータは、基板に実装された高電圧を出力する高電圧発生素子の出力側に基板と略平行で離れた中空位置に一対の高電圧出力端子を延在する。高電圧発生素子の出力側にコンデンサを配置するスペースを介してコネクタユニットが基板に実装され、高電圧出力端子の先端をコネクタケース内のコネクタ端子として一体化する。

Abstract translation: 一种高压电路，包括通过向冷阴极管提供高电压来驱动发光的反相器。 逆变器中的高压发生元件的高压输出端子和用于连接负载的连接器单元的连接器端子具有一体化结构。 更具体地，逆变器具有延伸到中空位置的一对高压输出端子，使得它们与安装在基板上的高电压产生元件的输出侧上的基板分开并且大致平行，并输出高电平 电压。 连接器单元通过用于在高压发生元件的输出侧布置电容器的空间安装在基板上，并且高压输出端子的前端作为连接器端子集成在连接器壳体中。

公开(公告)号：EP0895444A1

公开(公告)日：1999-02-03

申请号：EP98306002.1

申请日：1998-07-28

Applicant: LUCAS INDUSTRIES public limited company

Inventor： Strickley, David William

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K3/445 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10553 ,  H05K2201/10939 ,  H05K2203/0323 ,  H05K2203/1184

Abstract: A circuit assembly comprises a circuit board (11) and a heat plate (12) affixed thereto. The heat plate (12) comprises a metal substrate (17) which has a layer of an electrically insulating material (18) secured to the face of the metal substrate (17) remote from the circuit board (11). The insulating layer (18) isolates the metal substrate (17) from the wire legs (14) of devices (16) placed upon the board (11).

Abstract translation: 电路组件包括电路板（11）和固定在其上的加热板（12）。 加热板（12）包括金属基板（17），其具有固定到远离电路板（11）的金属基板（17）的表面的电绝缘材料层（18）。 绝缘层（18）将金属基板（17）与放置在基板（11）上的装置（16）的线腿（14）隔离。

公开(公告)号：EP0263631A3

公开(公告)日：1989-12-06

申请号：EP87308603.7

申请日：1987-09-29

Applicant: EATON CONTROLS SpA

Inventor： Riley, John Grant ,  Doutriaux, Jean Luc

IPC: H05K7/08 ,  H05K7/02 ,  H01R9/09

CPC classification number: H01R12/523 ,  H01H11/0031 ,  H01H43/024 ,  H05K1/144 ,  H05K3/3447 ,  H05K7/02 ,  H05K7/026 ,  H05K2201/10303 ,  H05K2201/10871 ,  H05K2201/10939

Abstract: The conductors (2) exiting from the housing of a component (1) may be grouped conveniently for one customer but inconveniently for others. Manufacturing components with different groupings for each customer would lose the advantages of quantity. So the exiting conductors (2) are connected to plated through-holes in an inner PCB (5). Fastons are connected to plated holes in an outer PCB (8) in a fashion approved by an individual customer. Bridging connectors which are rigid extend between bondings in opposite holes in the two PCB's. The printed patterns on the boards enable the change of grouping of the terminals. Some bridging connectors may be extensions (7) of the exiting conductors (4). They provide rigidity of the boards and also interconnections. The inner board (5) rests on walls (3) from the housing (1), or on ledges or flanges (13) of the connectors.

Abstract translation: 从组件（1）的外壳排出的导体（2）可以方便地分组给一个客户，但是对于其他客户而言不方便。 对于每个客户，具有不同组合的制造部件将失去数量的优点。 因此，排出的导体（2）连接到内部PCB（5）中的电镀通孔。 紧固件以个人客户批准的方式连接到外部PCB（8）中的电镀孔。 在两个PCB的相对孔中的接合之间刚性的桥接连接器延伸。 板上的印刷图案可以改变端子的分组。 一些桥接连接器可以是出口导体（4）的延伸部（7）。 它们提供了板的刚性和互连。 内板（5）从壳体（1）或连接器的凸缘（13）上靠在墙壁（3）上。

公开(公告)号：EP0430842A3

公开(公告)日：1991-07-17

申请号：EP90480154.5

申请日：1990-10-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hays, Thomas John ,  Parry, Donovan Armin ,  Reis, Robert James ,  Scrabeck, Larry Dean

IPC: H05K3/22

CPC classification number: H05K1/141 ,  H05K1/0393 ,  H05K3/225 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/096 ,  H05K2201/10939

Abstract: A flexible applique or patch (30) is used to modify a circuit board (10) by attaching the flexible applique to the back side of a circuit board needing rework. The flexible applique has circuit paths (28') on both its front and back side. The flexible applique also has circuit paths which pass from the front side to the back side of the applique or patch. If additional electrical components are required by the rework, the back side of the applique or patch is provided with pads to which surface mount electrical components are easily attached. Implementing the rework using the applique or patch is simple and easy. The front side of the patch is positioned on the back side of the circuit board, and then attached to the back of the circuit board either by soldering down points along the edge of the patch or by providing an adhesive on the front side of the patch. Using this method, both simple and complex reworks can be quickly accomplished.

公开(公告)号：EP0341458A1

公开(公告)日：1989-11-15

申请号：EP89106941.1

申请日：1989-04-18

Applicant: PIONEER ELECTRONIC CORPORATION

Inventor： Ishii, Satoshi c/o Pioneer Tokorozawa Plant

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K3/3415 ,  H05K3/3442 ,  H05K3/3468 ,  H05K3/4046 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10939 ,  H05K2203/1178 ,  H05K2203/1476

Abstract: A double-sided board circuit includes a board (11) hav­ing insertion holes (12), a pair of electrically conductive pat­terns (15) disposed on the face and back of the board (11), and an electronic component (13) having directly connected electrically conductive wires (13a) inserted respectively through the insertion holes (12), at least one of the conductive wires being soldered at two positions to the conductive patterns (15) on the face and back of the board (11) to electrically connect the conductive patterns (15).

Abstract translation: 双面板电路包括具有插入孔（12）的基板（11），设置在基板（11）的表面和背面上的一对导电图案（15），以及电子部件（13），其具有直接 分别插入插入孔（12）中的至少一根导线被连接到板（11）的表面和背面上的导电图案（15）的两个位置处的电连接的导电线（13a）以电连接 导电图案（15）。

公开(公告)号：US20240049391A1

公开(公告)日：2024-02-08

申请号：US18229177

申请日：2023-08-02

Applicant: CYNTEC CO., LTD.

Inventor： Chien Ming Chen ,  DA-JUNG CHEN ,  SSU-LUNG HSU

IPC: H05K1/14 ,  H05K5/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K5/0065 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K5/0069 ,  H05K2201/10939

Abstract: An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.

公开(公告)号：US20180261935A1

公开(公告)日：2018-09-13

申请号：US15913494

申请日：2018-03-06

Applicant: Tarng Yu Enterprise co.,ltd.

Inventor： Mu-Jung Huang ,  Ying-Chung Chen

IPC: H01R12/57 ,  H05K1/18 ,  H01R43/20

CPC classification number: H01R12/57 ,  H01R13/415 ,  H01R43/20 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10378 ,  H05K2201/10757 ,  H05K2201/10939

Abstract: An altitude increasing connector and the method for manufacturing the same for an electrical connection of a sensor element and a circuit substrate inside a portable electronic device, such that the sensor element is altitude increased, thereby an appropriate disposition altitude of the sensor element is adjusted, in order to ensure normal function of the sensor element, so that the yield of the portable electronic device is increased. The altitude increasing connector has a plurality of conductive terminals, each of which has a first welding pad for welding the sensor element and a second welding pad for welding the circuit substrate, wherein a distance between welding surfaces of both the first, second welding pads of each conductive terminal is fixed, such that a relative distance between electrical joints of both the sensor element and the circuit substrate is fixed.

公开(公告)号：US09974182B2

公开(公告)日：2018-05-15

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US3888639A

公开(公告)日：1975-06-10

申请号：US42991774

申请日：1974-01-02

Applicant: TELEDYNE ELECTRO MECHANISMS

Inventor： HASTINGS MYRON L ,  ROBERTS JOSEPH P

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/363 ,  H05K3/28 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10939 ,  H05K2201/10977 ,  Y10T29/49126

Abstract: A method for electrically and mechanically connecting two printed circuit boards involves creating a first hole in the overcoat of the first circuit board at all points where electrical connection to the second circuit is desired. Then a second, smaller hole is made within the first hole, completely through the first circuit board. Next, the two circuits are juxtaposed, with the first above the second, and fastened together by an adhesive. A third hole, smaller than the second and located nearly concentric with the first and second holes, is then made through the second circuit board. Finally, the electrical and additional mechanical connection is made by inverting the combination and passing it over a solder wave of a wave soldering machine. During this process the third hole acts as a vent.