公开(公告)号：WO00039854A1

公开(公告)日：2000-07-06

申请号：PCT/KR1999/000808

申请日：1999-12-23

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/822 ,  H01L23/522 ,  H01L23/66 ,  H01L27/00 ,  H01L27/04 ,  H01P3/06 ,  H01P3/08 ,  H01P11/00 ,  H05K1/02

CPC classification number: H05K1/0221 ,  H01L23/5225 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01P3/06 ,  H01P11/005 ,  H05K1/0272 ,  H05K2201/09809 ,  H05K2201/09981 ,  H05K2203/0733 ,  H01L2924/00

Abstract: Disclosed is a coaxial type signal line that solves problems associated with signal interference and the connection of signal lines that are generated in a radio frequency (RF) electrical system. A method for manufacturing the coaxial type signal line includes the steps of forming a groove on a substrate, forming a first ground line on a surface of the groove and a plain surface of the substrate, forming a first dielectric layer including dielectric material on the first ground line formed on the surface of the groove, forming a signal line on the first dielectric layer the signal line for transmitting signals, forming a second dielectric layer including dielectric material on the signal line and the first dielectric layer, and forming a second ground line on the first ground line and the second dielectric layer. Since the signal line in the signal line structure according to the present invention is electrically shielded by the first and second ground lines, interference between the signal line and other signal lines on the semiconductor substrate can be prevented, and accordingly, the signal lines may be designed compactly on a semiconductor substrate and the system size can be reduced.

Abstract translation: 公开了一种同轴型信号线，其解决与射频（RF）电气系统中产生的信号干扰和信号线的连接相关的问题。 一种用于制造同轴型信号线的方法包括以下步骤：在衬底上形成沟槽，在槽的表面上形成第一接地线和衬底的平坦表面，在第一衬底上形成包括电介质材料的第一介电层 接地线，形成在沟槽的表面上，在第一电介质层上形成用于传输信号的信号线的信号线，在信号线和第一电介质层上形成包括电介质材料的第二电介质层，形成第二接地线 在第一接地线和第二介质层上。 由于根据本发明的信号线结构中的信号线被第一和第二接地线电屏蔽，所以可以防止信号线与半导体衬底上的其它信号线之间的干扰，因此信号线可以是 在半导体衬底上紧凑地设计，并且可以减小系统尺寸。

公开(公告)号：WO1996039012A1

公开(公告)日：1996-12-05

申请号：PCT/US1996008223

申请日：1996-05-31

Applicant: THE WHITAKER CORPORATION

Inventor： THE WHITAKER CORPORATION ,  DOYLE, Scott, B.

IPC: H05K01/18

CPC classification number: H05K1/18 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6622 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/3447 ,  H05K2201/09581 ,  H05K2201/09809 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: An electrical connection between a transmission line and an integrated circuit package comprises, a circuit board (12) on which are mounted a transmission line (28, 402, 202, 503, 505) and an integrated circuit package (10), a projecting portion of a pin (14, 14A, 14B) projecting from an integrated circuit package (10), a transmission line feed (32, 404) that further comprises a waveguide cavity (204, 504, 506) connected to the pin (14, 14A, 14B) and a dielectric material (106) surrounding the pin (14, 14A, 14B), the dielectric material being between the pin and a ground feed (92, 412, 414, 208, 508, 510) of the transmission line (28, 402, 202, 503, 505).

Abstract translation: 传输线和集成电路封装之间的电连接包括：电路板（12），其上安装有传输线（28,402,202,503,505）和集成电路封装（10），突出部分 从集成电路封装（10）突出的引脚（14,14A，14B），还包括连接到所述引脚（14,14A）的波导腔（204,504,506）的传输线馈送（32,404） ，14B）和围绕所述销（14,14A，14B）的电介质材料（106），所述电介质材料位于所述引脚和所述传输线的接地馈电（92,412,414,208,508,510）之间 28，402，202，503，505）。

公开(公告)号：WO1996002958A1

公开(公告)日：1996-02-01

申请号：PCT/IB1995000655

申请日：1995-07-14

Applicant: CONNECTOR SYSTEMS TECHNOLOGY N.V. ,  PAAGMAN, Bernardus

Inventor： CONNECTOR SYSTEMS TECHNOLOGY N.V.

IPC: H01R09/09

CPC classification number: H05K1/112 ,  H01R12/523 ,  H01R12/58 ,  H01R13/6585 ,  H01R24/50 ,  H05K1/0219 ,  H05K3/308 ,  H05K2201/0715 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/1059

Abstract: Assembly provided with at least one shielded connector (2, 12, 17, 50) and a board (1), each shielded connector being connected to a predetermined side of said board (1) and being provided with at least one signal contact member (3) fitted in a hole (7) of the board (1), the connector having a shielded housing (61) to shield each signal contact member (3), wherein the board (1), except in areas where connectors (2, 12, 17, 50) are fitted to the board (1), is provided with a first continuous electrically conductive layer (9) on one side and a second continuous electrically conductive layer (10) on the opposite side, each of the shielded connector housings being electrically connected to one of said layers (9, 10), in order to prevent electromagnetic radiation generated by any of said signal contact members (3) from propagating to the outside word.

Abstract translation: 装配有至少一个屏蔽连接器（2,12,17,50）和一个板（1），每个屏蔽连接器连接到所述板（1）的预定侧，并且设置有至少一个信号接触构件 3）安装在板（1）的孔（7）中，连接器具有用于屏蔽每个信号接触构件（3）的屏蔽壳体（61），其中板（1）除了连接器（2， 12，17，50）装配到板（1）上，在一侧设置有第一连续导电层（9），在相对侧设置有第二连续导电层（10），每个屏蔽连接器 壳体电连接到所述层之一（9,10），以便防止任何所述信号接触构件（3）产生的电磁辐射传播到外部字。

公开(公告)号：EP1906715A3

公开(公告)日：2014-01-22

申请号：EP07017830.6

申请日：2007-09-12

Applicant: Samsung Display Co., Ltd.

Inventor： Kang, Byeong-Soo

IPC: H05K1/16

CPC classification number: H05K1/16 ,  G02F1/13452 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0219 ,  H05K1/0268 ,  H05K1/0298 ,  H05K2201/09145 ,  H05K2201/09809

Abstract: A display device including a display panel and a printed circuit board. The printed circuit board includes an insulating layer, a circuit wire portion, an antenna arranged on the insulating layer and a connection wire portion. The insulating layer includes a base portion and a protruding portion protruded from a side of the base portion. The circuit wire portion is arranged on the base portion. The antenna is arranged on the protruding portion and insulated from the circuit wire portion. The connection wire portion is arranged on the base portion and electrically connected to the antenna. The antenna is exposed outside of the display panel.

公开(公告)号：EP2513969A1

公开(公告)日：2012-10-24

申请号：EP10796242.5

申请日：2010-12-14

Applicant: Qualcomm Incorporated

Inventor： LI, Xia ,  ZHAO, Wei ,  CAO, Yu ,  GU, Shiqun ,  KANG, Seung H. ,  KING, Ming-Chu

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/498 ,  H01L23/48 ,  H01L23/64 ,  H05K1/02

CPC classification number: H01L23/552 ,  H01L23/14 ,  H01L23/49827 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0222 ,  H05K1/0245 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09809 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A system of via structures disposed in a substrate. The system includes a first via structure that comprises an outer conductive layer, an inner insulating layer, and an inner conductive layer disposed in the substrate. The outer conductive layer separates the inner insulating layer and the substrate and the inner insulating layer separates the inner conductive layer and the outer conductive layer. A first signal of a first complementary pair passes through the inner conductive layer and a second signal of the first complementary pair passes through the outer conductive layer. In different embodiments, a method of forming a via structure in an electronic substrate is provided.

Abstract translation: 设置在基板中的通孔结构的系统。 该系统包括第一通孔结构，其包括外部导电层，内部绝缘层和设置在基板中的内部导电层。 外部导电层分离内部绝缘层和基板，内部绝缘层分离内部导电层和外部导电层。 第一互补对的第一信号通过内导电层，第一互补对的第二信号通过外导电层。 在不同的实施例中，提供了一种在电子衬底中形成通孔结构的方法。

公开(公告)号：EP2494598A1

公开(公告)日：2012-09-05

申请号：EP10737421.7

申请日：2010-07-15

Applicant: Xilinx, Inc.

Inventor： WYLAND, Christopher, P.

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L23/64 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0251 ,  H05K1/116 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

Abstract: Vias (106) are typically of a lower impedance than the signal lines (102, 128) connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. An embodiment avoids impedance mismatch in circuits and achieves an advance in the art by providing a via (106) with higher impedance through the addition of split ring resonators (104, 112, 120, 126) to each end of the via (106).

公开(公告)号：EP2392200A1

公开(公告)日：2011-12-07

申请号：EP10704613.8

申请日：2010-02-01

Applicant: Tyco Electronics Corporation

Inventor： SMEJTEK, Dalibor, J.

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly (10) includes a base printed circuit (12) having a printed circuit receiving area (29) and a plurality of electrical contacts provided on the printed circuit receiving area (30). The printed circuit assembly also includes a secondary printed circuit (14) having a secondary substrate (54) including a mating edge (46) and a plurality of secondary contacts (70) provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

公开(公告)号：EP2208405B1

公开(公告)日：2011-05-18

申请号：EP08845428.5

申请日：2008-11-03

Applicant: Cinterion Wireless Modules GmbH

Inventor： WENDLER, Ralf ,  ROMAHN, Jörg ,  BÖLCKE, Annette

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/325 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09381 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10265

Abstract: The invention relates to a configuration, comprising a first circuit board (ELP), which has a contact surface (KF) for contacting a connection element (VE), said contact surface (KF) comprising a central contact point and a concentric ring enclosing said central contact point; a second circuit board (ZLP); and a connection element (VE), which is electrically contacted on a first side with the second circuit board (ZLP) and which comprises a first spring element (FE1) and at least one second spring element (FE2, FE3) on a second side, which is opposite the first side, said first spring element (FE1) being electrically contacted with the central contact point of the first circuit board (ELP) and the at least one second spring element (FE2, FE3) being electrically contacted with the concentric ring of the first circuit board (ELP).

公开(公告)号：EP1981316A3

公开(公告)日：2009-11-04

申请号：EP08251323.5

申请日：2008-04-04

Applicant: Kabushiki Kaisha Toshiba

Inventor： Suzuki, Ryota c/o Toshiba Corporation ,  Tanabe, Masahiro c/o Toshiba Corporation ,  Nakada, Taihei c/o Toshiba Corporation ,  Kumamoto, Tsuyoshi c/o Toshiba Corporation ,  Yamashita, Yuusuke c/o Toshiba Corporation

IPC: H05K1/02

CPC classification number: H05K1/0251 ,  H05K1/0222 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: A multilayer high-frequency circuit board includes a signal line layer (102) in which a high-frequency signal line (11) is formed, ground layers (101, 103) which are laminated on both sides of the signal line layer, and an interlayer circuit which is provided in the signal line layer and which includes a ground connecting portion (13) connected to the ground layers and a signal line connecting portion (12) connected to the signal line. The interlayer circuit is characterized in that one of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other concentrically with the one being separated from the outer periphery of the other along the signal line layer, and an inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

公开(公告)号：EP1827061A3

公开(公告)日：2009-09-09

申请号：EP07250735.3

申请日：2007-02-21

Applicant: TEKTRONIX, INC.

Inventor： Ebbutt, Ralph

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0219 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/81 ,  H01L2223/6622 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09809 ,  H05K2201/10424 ,  H05K2201/10734 ,  H05K2203/0769 ,  H01L2924/00

Abstract: A circuit assembly has two circuit boards parallel to each other and having major faces facing each other. Each major face has a signal contact connected to a signal trace. At least one of the major faces has a ground contact surrounding the signal contact. The signal and ground contacts are connected by way of a column element defining an axis perpendicular to the board faces. The column element has an inner conductor electrically connecting the signal contact, and a shield electrically isolated from and surrounding the inner conductor. A number of the column elements, as well as solder elements, may be supported by a carrier, which is placed between the boards for an electrical connection process, and which then may be dissolved.