公开(公告)号：US07754803B2

公开(公告)日：2010-07-13

申请号：US10503491

申请日：2003-02-04

Applicant: Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

Inventor： Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC: C08K3/34 ,  C08K5/98 ,  C08L67/02 ,  C08J5/18 ,  C08K5/50 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K3/01 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract translation: 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10-3 [℃-1]或 在比树脂组合物的玻璃化转变温度高10℃的温度范围内，比在树脂组合物的玻璃化转变温度高50℃的温度范围内。

公开(公告)号：US20100129604A1

公开(公告)日：2010-05-27

申请号：US12451359

申请日：2008-05-13

Applicant: Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto

Inventor： Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto

IPC: B32B15/088 ,  B32B15/092 ,  B32B3/10

CPC classification number: H05K1/0346 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B27/38 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/202 ,  B32B2307/208 ,  B32B2307/21 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/718 ,  B32B2457/08 ,  C08G69/32 ,  C09D177/10 ,  H05K3/384 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/31529 ,  Y10T428/31681

Abstract: An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer.A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005≦n/(m+n)

Abstract translation: 本发明的目的是提供一种铜箔，其具有用作柔性印刷线路板的树脂基板的树脂层，并且在不进行粗糙化处理的铜箔和原料之间具有良好的粘附性 树脂层。 一种具有树脂层的铜箔，其特征在于将不进行粗糙化处理的铜箔直接接合到树脂层上，所述树脂层含有具有由下式（1）表示的结构的含酚羟基的芳族聚酰胺树脂： 在式（1）中，m和n表示平均值，满足关系式：0.005＆nlE; n /（m + n）<0.05，m + n为2〜200; Ar1是二价芳族基团; Ar 2是具有酚性羟基的二价芳香族基团，Ar 3是二价芳香族基团。

公开(公告)号：US20100083490A1

公开(公告)日：2010-04-08

申请号：US12632948

申请日：2009-12-08

Applicant: KENICHI KAWABATA ,  Takaaki Morita

Inventor： KENICHI KAWABATA ,  Takaaki Morita

IPC: H05K3/30 ,  H05K3/10

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

Abstract translation: 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

公开(公告)号：US20100051338A1

公开(公告)日：2010-03-04

申请号：US12613222

申请日：2009-11-05

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: H05K1/02

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘合促进剂金属箔，其包含含有环氧树脂作为金属上不可或缺的成分的粘合助剂层，其中粘合助剂层的厚度为0.1〜10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US20100028689A1

公开(公告)日：2010-02-04

申请号：US12183425

申请日：2008-07-31

Applicant: Kam-Chuen Yung ,  Tai-Man Yue

Inventor： Kam-Chuen Yung ,  Tai-Man Yue

IPC: B32B15/092

CPC classification number: B05D7/16 ,  B05D2504/00 ,  B05D2601/20 ,  C08G59/38 ,  C08L63/00 ,  C09D163/00 ,  H05K1/056 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0358 ,  Y10T428/31529 ,  C08L2666/22

Abstract: A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent.

Abstract translation: 导热电介质涂覆的金属板包括金属载体和涂覆到金属载体的部分固化的电介质层。 介电层包括环氧树脂，填料和偶联剂。

公开(公告)号：US07603771B2

公开(公告)日：2009-10-20

申请号：US11511462

申请日：2006-08-29

Applicant: Roger Chang

Inventor： Roger Chang

IPC: H01K3/10

CPC classification number: H05K1/187 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/186 ,  H05K3/28 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/068 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by the steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.

Abstract translation: 提供至少两个多层电路板的方法，组合所述至少两个多层电路板以形成组合的多层电路板，以及在所述组合多层电路板上形成多个外部导电通孔，电路和触点。 每个多层电路板通过以下步骤制造：制备具有多个芯片部分的单层印刷电路板，将至少一个芯片附接到相应的芯片部分，将具有多个外壳的框架附接到单层印刷电路板，附接 将半流体胶片粘贴到框架上，对半流体胶片上的导电层进行真空加压，并通过多层电路板形成多个导电内通孔。 所述至少两个多层电路板通过反转多层电路板中的一个并在反向多层电路板上真空压制其它多层电路板的步骤组合。

公开(公告)号：US20090178840A1

公开(公告)日：2009-07-16

申请号：US12351333

申请日：2009-01-09

Applicant: Woon-Chun Kim ,  Sung Yi

Inventor： Woon-Chun Kim ,  Sung Yi

IPC: H05K1/11 ,  H05K3/02 ,  H05K3/06

CPC classification number: H05K3/387 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4661 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

Abstract translation: 公开了印刷电路板及其制造方法。 根据本发明的实施例的方法包括：提供其上依次层叠有第一绝缘层，第一电路图案，第二绝缘层和树脂层的基板; 镗孔穿透基底的通孔; 通过去污工艺在树脂层上形成粗糙度; 形成通过所述通孔在层之间形成电连接的通孔; 并在其上形成粗糙度的树脂层上形成第二电路图案。

公开(公告)号：US20090110916A1

公开(公告)日：2009-04-30

申请号：US11988072

申请日：2006-07-03

Applicant: Valery Ostrovsky

Inventor： Valery Ostrovsky

IPC: B32B15/085 ,  B29C70/88 ,  B32B37/00 ,  B32B37/02 ,  H05K1/05

CPC classification number: H05K3/386 ,  B32B15/085 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B37/153 ,  B32B2250/40 ,  B32B2264/102 ,  B32B2311/12 ,  B32B2323/10 ,  B32B2457/08 ,  H05K1/032 ,  H05K3/022 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0143 ,  H05K2203/0759 ,  H05K2203/1545 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/31692

Abstract: The invention provides a low energy loss, multi-layered polypropylene/metal foil product useful for further processing into printed circuit boards and antenna boards for microwave circuitry. A continuous process for manufacture of the product is described. The process comprises the steps of: providing metal foil; optionally, extrusion coating molten polypropylene upon said metal foil, to obtain a foil coated with a polypropylene foundation layer; casting a molten polypropylene tie-layer upon said metal foil or upon said coated metal foil; and laminating a polypropylene sheet on said tie layer. In the process, heat is applied to induce fusing of the layers of the multi-layered product.

Abstract translation: 本发明提供了一种低能量损失的多层聚丙烯/金属箔产品，用于进一步加工成用于微波电路的印刷电路板和天线板。 描述了用于制造产品的连续方法。 该方法包括以下步骤：提供金属箔; 任选地，在所述金属箔上挤出涂覆熔融聚丙烯，以获得涂覆有聚丙烯基础层的箔; 在所述金属箔上或所述涂覆的金属箔上浇铸熔融聚丙烯粘结层; 并在所述粘结层上层压聚丙烯片材。 在该过程中，施加热量以引起多层产品的层的熔合。

公开(公告)号：US07459047B2

公开(公告)日：2008-12-02

申请号：US11194606

申请日：2005-08-02

Applicant: Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

Inventor： Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

IPC: B29C65/52 ,  B32B15/08

CPC classification number: B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B37/12 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0346 ,  H05K3/025 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.

Abstract translation: 通过将聚酰胺酸清漆涂布到载体上的非常薄的铜箔上，半干燥清漆，使用热辊压机将聚酰亚胺膜层压到涂覆有漆膜的铜箔上，制备柔性金属箔/聚酰亚胺层压体 在具有受控氧浓度的气氛中处理该层压板用于溶剂去除和酰亚胺化。 由聚酰胺酸酰亚胺化得到的聚酰亚胺粘合剂层的厚度最高达6μm，聚酰亚胺膜和聚酰亚胺粘合剂层的厚度之和高达25μm。 聚酰亚胺粘合剂层的Tg> 400℃

公开(公告)号：US07415761B2

公开(公告)日：2008-08-26

申请号：US10356464

申请日：2003-02-03

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。