公开(公告)号：US6086774A

公开(公告)日：2000-07-11

申请号：US993924

申请日：1997-12-18

Applicant: Francis Ho ,  Yoshihisa Yamamoto

Inventor： Francis Ho ,  Yoshihisa Yamamoto

IPC: B81C1/00 ,  C25F3/02 ,  G01P15/08 ,  G01P15/09 ,  G01P15/12 ,  G01Q70/16 ,  B44C1/22 ,  C25F3/12 ,  G01P15/02

CPC classification number: G01Q70/16 ,  B81C1/00531 ,  B82Y35/00 ,  G01P15/0802 ,  G01P15/0922 ,  G01P15/123 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81C2201/0132 ,  B81C2201/0143 ,  G01P2015/0828

Abstract: A method of making released structures by using at least two directional etching steps. Cantilevers, bridges and many other structures can be made with the present invention. In a preferred embodiment, two directional etching steps are performed at opposing angles nonnormal to the substrate surface such that the substrate is undercut and a structure is released. Alternatively, more than two directional etching steps may be performed at various angles. For example, the substrate may be rotated continuously during the directional etching process. A cantilever formed by the method of the present invention necessarily has a substantially triangular cross section. Directional etching processes that can be used include focused ion beam etching and ECR plasma etching. Some directional etching processes may require the use of a patterned etch resist layer. Other etching processes such as focused ion beam etching may use scanning techniques to select which regions are etched. A backside etch can be performed to remove remaining substrate material under the released micromachined structure. The method is particularly well suited for making released cantilevers.

Abstract translation: 通过使用至少两个方向蚀刻步骤来制造释放结构的方法。 悬臂，桥梁和许多其他结构可以用本发明制成。 在优选实施例中，以相对于基板表面非正常的角度执行两个定向蚀刻步骤，使得基底被切削并且结构被释放。 或者，可以以各种角度执行多于两个的定向蚀刻步骤。 例如，可以在定向蚀刻工艺期间连续旋转衬底。 通过本发明的方法形成的悬臂必须具有基本上三角形的横截面。 可以使用的定向蚀刻工艺包括聚焦离子束蚀刻和ECR等离子体蚀刻。 一些定向蚀刻工艺可能需要使用图案化的抗蚀剂层。 诸如聚焦离子束蚀刻的其它蚀刻工艺可以使用扫描技术来选择蚀刻哪些区域。 可以执行背面蚀刻以在释放的微加工结构下去除剩余的基底材料。 该方法特别适用于制备释放的悬臂。

公开(公告)号：US12057147B2

公开(公告)日：2024-08-06

申请号：US17511741

申请日：2021-10-27

Applicant: Seagate Technology LLC

Inventor： Tong Zhao ,  Li Wan ,  Michael Christopher Kautzky

IPC: G11B5/31 ,  B81C1/00 ,  B82B1/00 ,  H01F10/30 ,  H01L21/3065 ,  H01L21/67 ,  B82Y10/00 ,  G11B5/00 ,  G11B11/24 ,  H01L21/3213

CPC classification number: G11B5/3163 ,  B81C1/00111 ,  B82B1/003 ,  G11B5/3133 ,  H01F10/30 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  B81C2201/0132 ,  B81C2201/0143 ,  B82Y10/00 ,  G11B2005/0021 ,  G11B11/24 ,  H01L21/32136

Abstract: A method of forming a thin film structure involves performing one or more repetitions to form a template on a wafer. The repetitions include: depositing a layer of a template material to a first thickness T1; and ion beam milling the layer of the template material to remove thickness T2, where T2

公开(公告)号：US11939216B2

公开(公告)日：2024-03-26

申请号：US17188082

申请日：2021-03-01

Applicant: Infineon Technologies AG

Inventor： Andre Brockmeier ,  Stephan Helbig ,  Adolf Koller

IPC: B81C1/00 ,  G02B26/08 ,  G02B26/10

CPC classification number: B81C1/00904 ,  B81C1/00888 ,  G02B26/0833 ,  G02B26/105 ,  B81B2201/042 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/0143

Abstract: A method includes producing a semiconductor wafer. The semiconductor wafer includes a plurality of microelectromechanical system (MEMS) semiconductor chips, wherein the MEMS semiconductor chips have MEMS structures arranged at a first main surface of the semiconductor wafer, a first semiconductor material layer arranged at the first main surface, and a second semiconductor material layer arranged under the first semiconductor material layer, wherein a doping of the first semiconductor material layer is greater than a doping of the second semiconductor material layer. The method further includes removing the first semiconductor material layer in a region between adjacent MEMS semiconductor chips. The method further includes applying a stealth dicing process from the first main surface of the semiconductor wafer and between the adjacent MEMS semiconductor chips.

公开(公告)号：US11897763B2

公开(公告)日：2024-02-13

申请号：US17103796

申请日：2020-11-24

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Sismundo Talledo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0108 ,  B81C2201/0143 ,  B81C2201/0146

Abstract: A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.

公开(公告)号：US20180372563A1

公开(公告)日：2018-12-27

申请号：US16014912

申请日：2018-06-21

Applicant: University of Florida Research Foundation, Incorporated

Inventor： John E. Rogers ,  Mark Sheplak ,  Yong Kyu Yoon ,  Jack Judy

IPC: G01L1/14 ,  G01L9/00 ,  B81B3/00 ,  H01Q13/10

CPC classification number: G01L1/148 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/0264 ,  B81C2201/0143 ,  G01L9/0042 ,  G01L9/0047 ,  G01L9/0073 ,  G01L9/0077 ,  H01Q1/002 ,  H01Q1/2208 ,  H01Q9/0428 ,  H01Q13/106

Abstract: Methods and apparatuses for measuring static and dynamic pressures in harsh environments are disclosed. A pressure sensor according to one embodiment of the present invention may include a diaphragm constructed from materials designed to operate in harsh environments. A waveguide may be operably connected to the diaphragm, and an electromagnetic wave producing and receiving (e.g., sensing) device may be attached to the waveguide, opposite the diaphragm. A handle may be connected between the diaphragm and the waveguide to provide both structural support and electrical functionality for the sensor. A gap may be included between the handle and the diaphragm, allowing the diaphragm to move freely. An antenna and a ground plane may be formed on the diaphragm or the handle. Electromagnetic waves may be reflected off the antenna and detected to directly measure static and dynamic pressures applied to the diaphragm.

公开(公告)号：US20180267075A1

公开(公告)日：2018-09-20

申请号：US15763240

申请日：2016-03-18

Applicant: Hitachi, Ltd.

Inventor： Shuntaro MACHIDA ,  Nobuyuki SUGII ,  Keiji WATANABE ,  Daisuke RYUZAKI ,  Tetsufumi KAWAMURA ,  Kazuki WATANABE

IPC: G01P15/08 ,  B81C99/00

CPC classification number: G01P15/0802 ,  B81C99/001 ,  B81C99/0025 ,  B81C99/0065 ,  B81C2201/0143 ,  B81C2201/0181 ,  B81C2203/038 ,  G01P15/125

Abstract: For the purpose of shortening the MEMS manufacturing TAT, the MEMS manufacturing method according to the present invention includes a step of extracting the first MEMS with first characteristic in a range approximate to the required characteristic from the plurality of MEMS preliminarily prepared on the main surface of the substrate, and a step of forming a second MEMS having the required characteristic by directly processing the first MEMS.

公开(公告)号：US09822443B1

公开(公告)日：2017-11-21

申请号：US15010653

申请日：2016-01-29

Applicant: Multibeam Corporation

Inventor： Michael C. Smayling ,  Kevin M. Monahan ,  David K. Lam ,  Theodore A. Prescop

IPC: H01J37/30 ,  C23C14/48

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for targeted, maskless modification of material on or in a substrate using charged particle beams. Electrostatically-deflected charged particle beam columns can be targeted in direct dependence on the design layout database to perform direct and knock-on ion implantation, producing patterned material modifications with selected chemical and 3D-structural profiles. The number of required process steps is reduced, reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Local gas and photon injectors and detectors are local to corresponding individual columns, and support superior, highly-configurable process execution and control. Targeted implantation can be used to prepare the substrate for patterned blanket etch; patterned ALD can be used to prepare the substrate for patterned blanket deposition; neither process requiring photomasks or resist. Arrays of highly configurable beam columns can also be used to perform both positive and negative tone lithography in a single pass.

公开(公告)号：US20170247252A1

公开(公告)日：2017-08-31

申请号：US15444086

申请日：2017-02-27

Applicant: SMARTTIP BV

Inventor： Edin Sarajlic

IPC: B81C1/00

CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.

公开(公告)号：US09364807B2

公开(公告)日：2016-06-14

申请号：US13635972

申请日：2011-03-10

Applicant: Christian Schoen ,  Michael Wagner

Inventor： Christian Schoen ,  Michael Wagner

IPC: B01J4/00 ,  B01D3/00 ,  B81C1/00 ,  B01L3/00

CPC classification number: B01J4/001 ,  B01L3/502707 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2200/0621 ,  B01L2200/10 ,  B01L2300/0636 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0822 ,  B01L2300/0864 ,  B01L2300/0887 ,  B01L2300/161 ,  B01L2400/0406 ,  B01L2400/0688 ,  B01L2400/088 ,  B81C1/00047 ,  B81C1/00063 ,  B81C2201/0105 ,  B81C2201/0143 ,  B81C2201/0156 ,  Y10T137/85938

Abstract: The invention relates to a component (4) of a biosensor, comprising at least one first device (6) for receiving a sample liquid, wherein the device (6) is connected via a distributor channel (7) to further receiving devices (8 to 11), into each of which a feed channel (71, 72, 73, 74) branching off from the distributor channel (7) opens, and the feed channels (71, 72, 73, 74) are arranged in succession in flow direction (S) of the sample liquid passed on through the distributor channel (7). In accordance with the invention, it is envisaged that, in the distributor channel (7), in each case between two immediately successive feed channels (71, 72; 72, 73; 73, 74) in flow direction (S), at least one region (K) for at least temporary slowing or stoppage of the capillary flow of the sample liquid has been inserted. It is thus possible to control the capillary flow of the sample liquid such that always only one receiving device (8, 9, 10, 11) is filled with the volume flow of sample liquid available before the next is filled, and effectively simultaneous filling of the receiving devices (8, 9, 10, 11) is prevented. This leads to rapid and complete filling of the respective receiving device (8, 9, 10, 11). Additionally presented is a process with which the regions (K) can be inserted into the distributor channel (7) in a simple manner.

Abstract translation: 本发明涉及生物传感器的组件（4），其包括用于接收样品液体的至少一个第一装置（6），其中所述装置（6）经由分配器通道（7）连接到另外的接收装置（8至 其中，从分配器通道（7）分支出的进料通道（71,72,73,74）打开，并且进料通道（71,72,73,74）在流动方向上连续地排列 （S）通过分配器通道（7）通过的样品液体。 根据本发明，设想在分配器通道（7）中，在每种情况下，在流动方向（S）处的两个紧邻的供给通道（71,72; 72,73; 73,74）之间至少 已经插入了用于至少暂时放慢或停止样品液体的毛细管流动的区域（K）。 因此，可以控制样品液体的毛细管流动，使得总是只有一个接收装置（8,9,10,11）填充下一个填充之前可用的样品液体的体积流量，并且有效地同时填充 接收装置（8,9,10,11）被防止。 这导致相应的接收装置（8,9,10,11）的快速和完全的填充。 另外提出了一种可以简单地将区域（K）插入到分配器通道（7）中的过程。

公开(公告)号：US20150107752A1

公开(公告)日：2015-04-23

申请号：US14397054

申请日：2013-04-25

Applicant: ALERE SAN DIEGO, INC.

Inventor： Erik Mikael Olsson ,  Jonathan Riveron ,  Armando Raul Tovar

IPC: B29C65/16 ,  B29C65/08 ,  B29C59/00 ,  B29C69/00 ,  B29C45/00 ,  B29C47/00

CPC classification number: B29C65/7855 ,  B23K26/244 ,  B23K26/324 ,  B23K26/60 ,  B23K2103/30 ,  B29C59/16 ,  B29C65/08 ,  B29C65/1606 ,  B29C65/1609 ,  B29C65/1612 ,  B29C65/1616 ,  B29C65/1632 ,  B29C65/1635 ,  B29C65/1654 ,  B29C65/1664 ,  B29C65/1677 ,  B29C65/1683 ,  B29C65/1696 ,  B29C65/72 ,  B29C66/0246 ,  B29C66/028 ,  B29C66/1122 ,  B29C66/21 ,  B29C66/232 ,  B29C66/234 ,  B29C66/24244 ,  B29C66/30223 ,  B29C66/3452 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/73361 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/836 ,  B29C66/9513 ,  B29C2035/0838 ,  B29C2791/009 ,  B29K2995/0027 ,  B29L2009/00 ,  B29L2031/756 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0143 ,  B81C2201/019 ,  Y10T156/1039 ,  Y10T156/1064 ,  B29K2025/06 ,  B29K2069/00 ,  B29K2033/12 ,  B29K2067/00 ,  B29K2071/00 ,  B29K2909/08

Abstract: The present invention relates to methods for joining materials as well as articles manufactured using such processes. The invention pertains to a process for joining a first substrate to a second substrate. The process includes irradiating a portion of a first substrate with a laser beam having a first wavelength and intensity sufficient to increase the absorbance of the first substrate to light having a second, different wavelength. The laser beam may carbonize at least a portion of the irradiated portion of the first substrate imparting a higher absorbance to light than non-irradiated portions of the first substrate. A second substrate is then placed in contact with the irradiated portion of the first substrate. The first substrate is then irradiated with a second laser having a second wavelength, different to the first wavelength; with a sufficient intensity to heat and, preferably melt, the irradiated portion of the first substrate.

Abstract translation: 本发明涉及用于连接材料的方法以及使用这些方法制造的制品。 本发明涉及将第一衬底接合到第二衬底的方法。 该方法包括用具有第一波长和强度的激光束照射第一衬底的一部分，该第一波长和强度足以将第一衬底的吸光度增加到具有第二不同波长的光。 所述激光束可以将所述第一基板的照射部分的至少一部分碳化，使得比所述第一基板的未照射部分赋予更高的吸光度。 然后将第二衬底放置成与第一衬底的照射部分接触。 然后用具有与第一波长不同的第二波长的第二激光器照射第一衬底; 具有足够的强度以加热并且优选地熔化第一基底的照射部分。