公开(公告)号：EP2843667B1

公开(公告)日：2017-09-06

申请号：EP13782608.7

申请日：2013-04-26

Applicant: Osaka University ,  Showa Denko K.K.

Inventor： SUGANUMA Katsuaki ,  OHTSUKA Kuniaki ,  MURAHASHI Koichiro ,  TAKEMURA Yasutaka ,  UCHIDA Hiroshi

IPC: H01B1/22 ,  C09D11/00 ,  H01B1/00 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/22 ,  C09D11/03 ,  C09D11/52 ,  H01B13/0016 ,  H01B13/003 ,  H01B13/0036 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/107

公开(公告)号：EP3083248A4

公开(公告)日：2017-08-30

申请号：EP14871982

申请日：2014-12-19

Applicant: UNIV CALIFORNIA

Inventor： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

IPC: B32B37/00 ,  H01K1/18 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L33/62 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/118 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/145 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/82005 ,  H01L2224/82051 ,  H01L2224/82106 ,  H01L2224/82951 ,  H01L2224/97 ,  H01L2933/0066 ,  H05K1/025 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/303 ,  H05K3/4644 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0173 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/467 ,  H01L2224/82

公开(公告)号：EP3180792A1

公开(公告)日：2017-06-21

申请号：EP15827431.6

申请日：2015-07-27

Applicant: C3Nano Inc.

Inventor： LI, Ying-Syi ,  YANG, Xiqiang ,  KAMBE, Yu ,  CHEN, Xiaofeng ,  GU, Hua ,  LAM, Steven Michael ,  INOUYE, Melanie Mariko ,  CHENG, Arthur Yung-Chi ,  TAN, Alex Da Zhang ,  SCULLY, Christopher S. ,  VIRKAR, Ajay

IPC: H01B1/22

CPC classification number: C09D11/52 ,  B05D1/005 ,  B05D1/02 ,  B05D1/18 ,  B05D1/265 ,  B05D1/28 ,  B05D3/0254 ,  B05D5/06 ,  C09D11/08 ,  C09D11/10 ,  C09D11/102 ,  C09D11/106 ,  C09D11/14 ,  C09D101/02 ,  C09D139/06 ,  C23C30/00 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  H01B1/02 ,  H01B1/22 ,  H01B13/30 ,  H05K1/0274 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Abstract translation: 描述了熔融纳米线油墨，其还可以包含亲水性聚合物粘合剂，例如基于纤维素的粘合剂。 熔融纳米线油墨可以沉积在基材表面上并干燥以驱动熔合过程。 可以形成具有所需特性的透明导电膜。

公开(公告)号：EP2824676B1

公开(公告)日：2017-05-10

申请号：EP13757358.0

申请日：2013-03-08

Applicant: Showa Denko K.K. ,  Osaka University

Inventor： SUGANUMA, Katsuaki ,  NOGI, Masaya ,  JIU, Jinting ,  SUGAHARA, Tohru ,  UCHIDA, Hiroshi ,  SHINOZAKI, Kenji

IPC: H01B13/00 ,  H05K3/10

CPC classification number: H01B13/003 ,  H01B13/0026 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/10 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/026

公开(公告)号：EP3039949A4

公开(公告)日：2017-04-19

申请号：EP14839958

申请日：2014-08-11

Applicant: 3M INNOVATIVE PROPERTIES CO

Inventor： THEIS DANIEL J ,  GILMAN ANN M ,  SAULSBURY KIM B ,  STAY MATTHEW S ,  DODDS SHAWN C ,  PEKUROVSKY MIKHAIL L

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/04 ,  H05K3/12 ,  H05K3/46

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0393 ,  H05K1/097 ,  H05K3/048 ,  H05K3/1275 ,  H05K3/4679 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/09918 ,  H05K2201/10128 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

Abstract translation: 一种电子组件包括具有在第一区中的低对比度第一导电图案的基板; 高对比度基准标记在从第一区，worin基准标记和所述第一导电图案是在不同登记在基板的第二区; 和第二导电图案与所述第一导电图案对准。

公开(公告)号：EP3142124A1

公开(公告)日：2017-03-15

申请号：EP16167463.5

申请日：2016-04-28

Applicant: Samsung Electronics Co., Ltd ,  Industry-Academic Cooperation Foundation, Yonsei University

Inventor： CHU, Kunmo ,  CHANG, Wonsuk ,  CHUNG, Chanmoon

IPC: H01B1/22 ,  H01R4/04 ,  H01L23/00

CPC classification number: H01L24/33 ,  H01B1/22 ,  H01L23/53276 ,  H01L23/5328 ,  H01L24/09 ,  H01L24/29 ,  H01L2224/29028 ,  H01L2224/29105 ,  H01L2224/29198 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/2949 ,  H01L2224/2957 ,  H01L2224/29691 ,  H01L2224/32227 ,  H01L2924/01006 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/1426 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10674 ,  H05K2203/0425

Abstract: Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15 °C and less than or equal to about 110°C or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.

Abstract translation: 本发明提供各向异性导电材料，包括各向异性导电材料的电子设备，和/或制造该电子器件的方法。 的各向异性导电材料可以包括颗粒在基体材料层中的多个。 至少一些颗粒可以包括芯部和覆盖该芯部的壳部。 芯部可以包括导电材料做是处于液体状态的温度大于15℃且小于或等于约110℃或更低。 对于实施例中，芯部可以包括液体金属中的至少一种，低熔点焊料，和纳米填料。 壳部分可以包括在绝缘材料。 通过使用各向异性导电材料形成的接合部分可包括从所述粒子外流的芯部分，并且可以进一步包括到金属间化合物。

公开(公告)号：EP3028126A4

公开(公告)日：2017-01-25

申请号：EP14832317

申请日：2014-07-18

Applicant: 3M INNOVATIVE PROPERTIES CO

Inventor： STAY MATTHEW S ,  PEKUROVSKY MIKHAIL L ,  DODDS SHAWN C ,  GILMAN ANN M ,  THEIS DANIEL J

IPC: G06F3/041 ,  H01B13/00

CPC classification number: H05K3/284 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/097 ,  H05K3/048 ,  H05K3/103 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/0143 ,  H05K2203/1469 ,  H05K2203/1545

Abstract: A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.

Abstract translation: 一种用于制造电子组件的方法包括将导电粘合剂施加到覆盖衬底上的图案化导电纳米线层的抗蚀剂层上，并将电子部件的电接触与导电粘合剂接合以提供电子部件与导电性之间的电连接 纳米线层。

公开(公告)号：EP2965325A4

公开(公告)日：2016-11-30

申请号：EP14760434

申请日：2014-03-05

Applicant: LG ELECTRONICS INC

Inventor： HUR YANG WOOK ,  MOON JE YONG

IPC: H01B5/14 ,  H01B13/00

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K1/095 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2203/0773

Abstract: A conductive film includes a base film, a primer layer formed on the base film, the primer layer having voids, and a conductive layer formed on the primer layer. The conductive layer includes a conductor that contains a nano-material forming a network structure.

Abstract translation: 导电膜包括基膜，形成在基膜上的底漆层，具有空隙的底漆层和形成在底漆层上的导电层。 导电层包括含有形成网络结构的纳米材料的导体。

公开(公告)号：EP3039949A1

公开(公告)日：2016-07-06

申请号：EP14839958.7

申请日：2014-08-11

Applicant: 3M Innovative Properties Company

Inventor： THEIS, Daniel J. ,  GILMAN, Ann M. ,  SAULSBURY, Kim B. ,  STAY, Matthew S. ,  DODDS, Shawn C. ,  PEKUROVSKY, Mikhail L.

IPC: H05K3/00 ,  H05K13/00

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0393 ,  H05K1/097 ,  H05K3/048 ,  H05K3/1275 ,  H05K3/4679 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/09918 ,  H05K2201/10128 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

公开(公告)号：EP2864116A2

公开(公告)日：2015-04-29

申请号：EP13737009.4

申请日：2013-06-19

Applicant: Carestream Health, Inc.

Inventor： STEBBINS, Matthew, T.

IPC: B32B15/08 ,  B32B23/04 ,  B32B23/08 ,  C08L1/14 ,  H01B1/22 ,  H01L31/0224

CPC classification number: H05K1/0274 ,  B82Y30/00 ,  C08K3/08 ,  C08K5/101 ,  C08K7/06 ,  C09D101/08 ,  C09D101/14 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/095 ,  H05K3/1208 ,  H05K3/1275 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/50 ,  C08L1/14

Abstract: Transparent conductive films are disclosed and claimed that exhibit high light transmittance, low surface resistance, and superior peel-off adhesion. Such films are useful in electronics applications.

Abstract translation: 公开并要求保护的透明导电膜具有高透光率，低表面电阻和优异的剥离附着力。 这种薄膜在电子应用中是有用的。