Abstract:
A method of processing one or more surfaces is provided, comprising: providing a switchable ion gun (1) which is switchable between a cluster mode setting for producing an ion beam substantially comprising ionised gas clusters for irradiating a surface and an atomic mode setting for producing an ion beam substantially comprising ionised gas atoms for irradiating a surface; and selectively operating the ion gun in the cluster mode by mass selecting ionised gas clusters using a variable mass selector thereby irradiating a surface substantially with ionised gas clusters or the atomic mode by mass selecting ionised gas atoms using a variable mass selector thereby irradiating a surface substantially with ionised gas atoms. Also provided is a switchable ion gun comprising: a gas expansion nozzle (4) for producing gas clusters; an ionisation chamber for ionising the gas clusters and gas atoms; and a variable (preferably a magnetic sector) mass selector (50) for mass selecting the ionised gas clusters and ionised gas atoms to produce an ion beam variable between substantially comprising ionised gas clusters and substantially comprising ionised gas atoms. Preferably, the gun comprises an electrically floating flight tube (52) for adjusting the energy of the ions whilst within the mass selector.
Abstract:
An ion beam is generated and the energy of this ion beam is changed from a first energy to a second energy through, for example, acceleration or deceleration. A portion of the ion beam is blocked after the energy is changed and the ion beam is implanted into a workpiece. A plurality of blockers may be used to block the beam. Each blocker may be attached to a drive unit configured to translate one of the blockers in a first direction. t
Abstract:
Bei einem Verfahren zum Beschichten einer Oberfläche (1) eines Trägermaterials (2) mit Molekülen (5, 6), wobei die Moleküle (5, 6) aus einem Molekülvorrat (3, 4) in einen gasförmigen Zustand überführt und ionisiert werden, werden die elektrisch geladenen Moleküle (5, 6) auf dem Weg zu der Oberfläche (1) mindestens einem elektrischen und/oder magnetischen Feld ausgesetzt werden, das mindestens eine Feldkomponente senkrecht zu der gerichteten Bewegung der elektrisch geladenen Moleküle (5, 6) aufweist, um eine senkrecht zu der gerichteten Bewegung der elektrisch geladenen Moleküle (5, 6) gerichtete Kraftwirkung auf die elektrisch geladenen Moleküle (5, 6) auszuüben. Zwischen dem Molekülvorrat (3, 4) und der Oberfläche (1) wirkt eine elektrische und/oder magnetische Fokussiereinrichtung (8), beispielsweise ein Quadrupolfeld, auf die gerichtete Bewegung der elektrisch geladenen Moleküle (5, 6) ein. Zwischen dem Molekülvorrat (3, 4) und der Oberfläche (1) ist eine Blendenvorrichtung (12) so angeordnet, dass nur Moleküle (5, 6) mit einem vorgebbaren Massen-Ladungs-Verhältnis durch die Blendenvorrichtung (12) hindurch zur Oberfläche (1) gelangen. Mittels geeigneter elektrischer und/oder magnetischer Felder oder mittels zeitlich veränderbarer Blendeneinrichtungen (14) wird für vorgebbare Zeitdauern ein Auftreffen der elektrisch geladenen Moleküle (5, 6) auf der Oberfläche (1) verhindert. Dadurch wird die strukturierte Beschichtung der Oberfläche ermöglicht.
Abstract:
A charged particle analyser analyses charged particles having a range of energies. A charged particle source directs charged particles into a magnetic focusing field. A detector detects charged particles focussed by the magnetic focusing field. Charged particles are brought to a focus by the magnetic focusing field at different respective discrete positions on the detector.
Abstract:
A system (200) and method for magnetically filtering an ion beam (210) during an ion implantation into a workpiece (228) is provided, wherein ions are emitted from an ion source (212) and accelerated the ions away from the ion source to form an ion beam. The ion beam is mass analyzed by a mass analyzer (214), wherein ions are selected. The ion beam is then decelerated via a decelerator (242) once the ion beam is mass-analyzed, and the ion beam is further magnetically filtered downstream of the deceleration. The magnetic filtering is provided by a quadrapole (quadrupole) magnetic energy filter (250), wherein a magnetic field is formed for intercepting the ions in the ion beam exiting the decelerator to selectively filter undesirable ions and fast neutrals (264).
Abstract:
A scanning charged particle beam device is described. The scanning charged particle beam device includes a beam emitter for emitting a primary electron beam, a first scan stage for scanning the beam over a specimen, an achromatic beam separator adapted for separating a signal electron beam from the primary electron beam, and a detection unit for detecting signal electrons.
Abstract:
A charged particle analyser system comprises at least one particle filter to which an electrostatic potential is applied when in use so as to filter charged particles received from a specimen to be analysed in accordance with their respective energies. A charged particle detector is provided for receiving the charged particles from the filter. A deflection system prevents any charged particles returning to the specimen from the particle filter.
Abstract:
A multipurpose ion implanter beam line configuration comprising a mass analyzer magnet followed by a magnetic scanner and magnetic collimator combination that introduce bends to the beam path, the beam line constructed for enabling implantation of common monatomic dopant ion species cluster ions, the beam line configuration having a mass analyzer magnet defining a pole gap of substantial width between ferromagnetic poles of the magnet and a mass selection aperture, the analyzer magnet sized to accept an ion beam from a slot-form ion source extraction aperture of at least about 80 mm height and at least about 7 mm width, and to produce dispersion at the mass selection aperture in a plane corresponding to the width of the beam, the mass selection aperture capable of being set to a mass-selection width sized to select a beam of the cluster ions of the same dopant species but incrementally differing molecular weights, the mass selection aperture also capable of being set to a substantially narrower mass-selection width and the analyzer magnet having a resolution at the mass selection aperture sufficient to enable selection of a beam of monatomic dopant ions of substantially a single atomic or molecular weight, the magnetic scanner and magnetic collimator being constructed to successively bend the ion beam in the same sense, which is in the opposite sense to that of the bend introduced by the analyzer magnet of the beam line.
Abstract:
An ion implantation system (600) having a dose cup (634) located near a final energy bend of a scanned or ribbon-like ion beam of a serial ion implanter for providing an accurate ion current measurement associated with the dose of a workpiece or wafer. The system comprises an ion implanter having an ion beam source for producing a ribbon-like ion beam (602). The system further comprises an AEF system configured to filter an energy of the ribbon-like ion beam by bending the beam at a final energy bend. The AEF system further comprises an AEF dose cup associated with the AEF system and configured to measure ion beam current, the cup located substantially immediately following the final energy bend. An end station (610) downstream of the AEF system is defined by a chamber wherein a workpiece is secured in place for movement relative to the ribbon-like ion beam for implantation of ions therein. The AEF dose cup is beneficially located up stream of the end station near the final energy bend mitigating pressure variations due to outgassing from implantation operations at the workpiece. Thus, the system provides accurate ion current measurement before such gases can produce substantial quantities of neutral particles in the ion beam, generally without the need for pressure compensation. Such dosimetry measurements may also be used to affect scan velocity to ensure uniform closed loop dose control in the presence of beam current changes from the ion source and outgassing from the workpiece.