Abstract:
A method for fabricating an electron emitter is provided. The method is comprised of implanting ions into a diamond lattice (10) to form cones (11a) or other continuous regions of damaged diamond (11). These regions (11) are more electrically conducting than the surrounding diamond lattice, and have locally sharp tips (13) at or near the point of enntry of the ion into the diamond. The tips (13) may then also be additionally coated with a layer of a wide band-gap semiconductor. An electrically conducting material (16) may also be placed in proximity to the tips (13) to generate an electric field sufficient to extract electrons from the conducting tips (13) into either the region above the surface, or into the wide band-gap semiconductor layer (18) in contact with the tips (13). The surface of the wideband gap semiconductor (18) or diamond may be chemically modified to enhance the emission of electrons from the surface.
Abstract:
In an electron-emitting component with a cold cathode comprising a substrate and a cover layer with a diamond-containing material consisting of nano-crystalline diamond having a Raman spectrum with three lines, i.e. at K = 1334 +/- 4 cm with a half-width value of 12 +/- 6 cm , at K = 1140 +/- 20 cm and at K = 1470 +/- 20 cm , the cold cathode exhibits a low extraction field strength, a stable emission at pressures below 10 mbar, a steep current-voltage characteristic and stable emission currents in excess of 1 microampere/mm . The electron emission of the component demonstrates a long-time stability, and a constant intensity of the electron beam across its cross section.
Abstract:
A cathode assembly includes a substrate (100), a plurality of electrically conducting strips (101), deposited on the substrate, and a continuous layer of diamond material (200) deposited over the plurality of electrically conducting strips and portions of the substrate exposed between the plurality of electrically conducting strips.
Abstract:
An imaging apparatus (100) for providing an image from a display (106) to an observer (101), comprising: a display (106) generating an optical output, an imaging surface member (109) constructed and arranged for viewing by said observer, and a scanning mirror/lens assembly (102) optically interposed between the display and the imaging surface member, and constructed and arranged to motively repetitively scan the display, generate a scanned image, and transmit the scanned image to the imaging surface member, for viewing of the scanned image. Various field emitter display designs and subassemblies are described, which may be usefully employed in such imaging apparatus.
Abstract:
A field emitter array magnetic sensor (FEAMS) device, comprising: an anode; a base plate member having on a first side thereof a plurality of gated field emitter elements thereon, in spaced proximal relationship to the anode. The plurality of gated field emitter elements and the anode structure are arranged so that each of the gated field emitter elements is in electron emitting relationship to varying electron impingement sites depending on intensity of the magnetic field on the gated field emitter element. The device includes structure for sensing the locations of the anode structure electron impingement sites receiving electrons from the plurality of gated field emitter elements, and determining the strength and orientation of the magnetic field. Also disclosed are various anode configurations which may be usefully employed in the FEAMS device of the invention.
Abstract:
A matrix field-emission cathode (5) comprises a monocrystalline silicon substrate (7) on which are arranged epitaxially grown pointed silicon emitters (1) which also act as a ballast resistor connected in series. In an advantageous embodiment of the proposed cathode, for a radius of curvature (r) at the emitter tip not exceeding 10 nm, the ratio of the height (h) of the emitter to the radius (r) is not less than 1000, while the ratio of (h) to the diameter (D) at the emitter base is not less than 1. The angle alpha at the emitter tip does not exceed 30 DEG . The specific resistance of the emitter material is chosen so as to ensure that the resistance of each emitter will be comparable with the resistance between the cathode and the opposing electrode. The proposed cathode is used in an electronic device for displaying information which also has an anode (3) in the form of a strip (11) of phosphorescent material (10) and a conducting layer (9) whose projection onto the cathode (5) is perpendicular to the conducting paths (6) on the cathode; the anode itself acts as the control electrode.
Abstract:
A field emission electron emitter comprising an electrode formed of at least one diamond, diamond-like carbon or glassy carbon composite fiber, said composite fiber having a non-diamond core and a diamond, diamond-like carbon or glassy carbon coating on said non-diamond core, and electronic devices employing such a field emission electron emitter.
Abstract:
A vertical field emitter structure (116) and field emission device such as a flat panel display (123) utilizing such structure. Self-aligned gate and emitter fabrication is described, together with virtual column field emitter structures (321), comprising an emitter or gated emitter (328) with conductive columns connecting the emitter to an underlying resistor or conductor structure (325) formed by chemical or other modification of portions of an underlying layer. The display of the invention utilizes field emission structures with low turn-on voltages and high accelerating voltages, thereby permitting high brightness, small pixel size, low manufacturing costs, uniform brightness, and high energy efficiency to be achieved.
Abstract:
The field of the invention is making bonding bumps (22) on the pad areas (12) of a substrate (10). The technical problem is the time-consuming conventional processes for making thick (1-20 micron) bumps (22). The invention's solution is depositing the bumps (22) by localized metal cluster ion deposition. One embodiment includes depositing a layer (18a) of metallic adhesion material over a surface on substrate (10a), depositing metallic bumps (40) on the metallic adhesion material over each of the pad areas (12a) using a focused liquid metal ion source (20), and chemically etching the layer (18a) of metallic adhesion material off the surface outside of the deposited bumps (40). The principal use of the invention is making bonding bumps on integrated circuit chips.
Abstract:
The present invention relates generally to a new integrated Vacuum Microelectronic Device (VMD) and a method for making the same. Vacuum Microelectronic Devices require several unique three dimensional structures: a sharp field emission tip, accurate alignment of the tip inside a control grid structure in a vacuum environment, and an anode to collect electrons emitted by the tip. Also disclosed is a new structure and a process for forming diodes, triodes, tetrodes, pentodes and other similar structures. The final structure made can also be connected to other similar VMD devices or to other electronic devices.