公开(公告)号：US20090015345A1

公开(公告)日：2009-01-15

申请号：US12281460

申请日：2007-03-02

Applicant: Taras Kushta ,  Kaoru Narita ,  Tomoyuki Kaneko ,  Shin-ichi Ogou

Inventor： Taras Kushta ,  Kaoru Narita ,  Tomoyuki Kaneko ,  Shin-ichi Ogou

IPC: H03H7/38

CPC classification number: H05K1/116 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09727

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract translation: 根据一个实施例，形成在多层基板中连接通孔结构和平面传输线的宽带转变，作为信号通孔焊盘和布置在相同导体层处的平面传输线之间的中间连接。 过渡的横向尺寸等于一端的通孔焊盘直径和另一端的带宽度; 转换的长度可以等于平面传输线方向上的间隙孔的特征尺寸，或者定义为根据通过三维全波模拟获得的数值图在时域中提供最小的额外的电抗 。

公开(公告)号：US20070279878A1

公开(公告)日：2007-12-06

申请号：US11443763

申请日：2006-05-31

Applicant: Xingjian Cai ,  Ke Wang ,  Qing-lun Chen

Inventor： Xingjian Cai ,  Ke Wang ,  Qing-lun Chen

IPC: H05K7/00

CPC classification number: H05K1/115 ,  H05K1/0237 ,  H05K1/0245 ,  H05K1/112 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09636 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10659 ,  Y02P70/613

Abstract: A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 电路板可以包括被配置为连接到安装在电路板上的诸如连接器和电子部件的组件的混合通孔结构。 混合通孔结构可以包括一个或多个微通孔，其被配置为提供与电路板中的信号迹线的电连接以及被配置为提供到电路板中的至少一个参考平面的接地连接的一个或多个通孔。 在一个实施例中，可以连接包括混合通路结构和信号迹线的多个电路板，以建立支持至少约5Gb / s的差分信令和数据传输速率的信道。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20070258173A1

公开(公告)日：2007-11-08

申请号：US11430540

申请日：2006-05-08

Applicant: Houfei Chen ,  Shiyou Zhao

Inventor： Houfei Chen ,  Shiyou Zhao

IPC: H02H9/08

CPC classification number: H05K1/0216 ,  G11C5/04 ,  G11C5/063 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/09636 ,  H05K2201/09981 ,  H05K2203/0733 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The noise suppression structure may include a power plane extension that extends from the power plane generally towards the ground plane, and a ground plane extension that extends from the ground plane generally towards the power plane. The ground plane extension may be separated from the power plane extension by a distance that is less than the distance separating the power and ground planes. Electronic device assemblies and systems include such substrates. Methods for suppressing noise in at least one of a power plane and a ground plane include providing such noise suppression structures between power and ground planes.

Abstract translation: 具有电源和接地层的衬底，例如印刷电路板，包括至少一个噪声抑制结构，其被配置为抑制通过电力平面和接地平面中的至少一个传播的电波。 噪声抑制结构可以包括从功率平面大致朝向接地平面延伸的电源平面延伸部，以及从接地平面大致朝向电力平面延伸的接地平面延伸部。 接地平面延伸部可以与动力平面延伸部分离距离小于分离动力和接地平面的距离。 电子器件组件和系统包括这样的衬底。 用于抑制电力平面和接地平面中的至少一个中的噪声的方法包括在电源和接地层之间提供这种噪声抑制结构。

公开(公告)号：US20070257355A1

公开(公告)日：2007-11-08

申请号：US11797458

申请日：2007-05-03

Applicant: Norihito Suzuki ,  Akihiro Minoura

Inventor： Norihito Suzuki ,  Akihiro Minoura

IPC: H01L23/04

CPC classification number: H05K3/3447 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/3468 ,  H05K2201/09572 ,  H05K2201/09636 ,  H05K2201/09781 ,  H05K2203/045

Abstract: In the vicinity of soldering through holes of lands for soldering a lead terminal in a multilayer printed board, electrically isolated lands are provided to form a thermal through hole. In the soldering, by the radiation and supply of heat of a lead-free solder filled in the thermal through hole, it is possible to suppress the radiation of heat of the soldering through hole. Thus, it is possible to achieve a sufficient solder rise and to obtain an excellent soldering property.

Abstract translation: 在用于焊接多层印刷电路板中的引线端子的焊盘通孔附近，设置电隔离焊盘以形成热通孔。 在焊接中，通过填充在热通孔中的无铅焊料的放射和供热，可以抑制焊接通孔的热辐射。 因此，可以实现足够的焊料上升并获得优异的焊接性能。

公开(公告)号：US20070194432A1

公开(公告)日：2007-08-23

申请号：US11443785

申请日：2006-05-30

Applicant: Hsing-Chou Hsu ,  Ying-Ni Lee

Inventor： Hsing-Chou Hsu ,  Ying-Ni Lee

IPC: H01L23/48 ,  H05K1/11

CPC classification number: H05K3/4602 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K1/0263 ,  H05K1/112 ,  H05K1/115 ,  H05K2201/09536 ,  H05K2201/09636 ,  H05K2201/09781

Abstract: An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between the second non-signal through via and one of the contact pads electrically connected to the corresponding first non-signal through vias.

Abstract translation: 提供了适用于布线板的非信号通孔的布置。 布线板具有接触表面，芯层和焊盘。 接触焊盘设置在接触表面上，而非信号通孔的布置包括第一非信号通孔和第二非信号通孔。 第一非信号通孔穿过芯层并电连接到一些接触垫。 穿过芯层的第二非信号通孔设置在第一非信号通孔之间，并且不电连接到接触焊盘。 第二非信号通孔之间的间隔与周围的第一非信号通孔中的任何一个之间的间隔小于或等于第二非信号通孔与电连接到第二非信号通孔之间的最小间隔的0.72倍 相应的第一个非信号通孔。

公开(公告)号：US20070039171A1

公开(公告)日：2007-02-22

申请号：US11537754

申请日：2006-10-02

Applicant: Joel Goergen

Inventor： Joel Goergen

IPC: H01R43/00

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: Method and apparatus are disclosed for flow control over Point-to-Point Protocol (PPP) data links. A method of negotiating such flow control between two PPP peers is disclosed, along with methods for operating flow control across a PPP link. In one embodiment, flow control frames carry an IEEE802.3x MAC control frame payload—the PPP implementation repackages such frames as MAC control frames and passes them to a MAC, which performs flow control. In another embodiment, flow control frames allow flow control commands to be applied differently to different service classes such that PPP flow can be controlled on a per-class basis.

Abstract translation: 公开了用于在点对点协议（PPP）数据链路上的流控制的方法和装置。 公开了一种在两个PPP对等体之间协商这种流量控制的方法，以及用于在PPP链路上操作流量控制的方法。 在一个实施例中，流控制帧携带IEEE802.3x MAC控制帧有效载荷 - PPP实现将诸如MAC控制帧的帧重新封装，并将其传递给执行流控制的MAC。 在另一个实施例中，流控制帧允许流控制命令被不同地应用于不同的服务类，使得PPP流可以基于每个级别进行控制。

公开(公告)号：US20060284697A1

公开(公告)日：2006-12-21

申请号：US11446950

申请日：2006-06-05

Applicant: Yu-Hsu Lin ,  Shang-Tsang Yeh ,  Chuan-Bing Li

Inventor： Yu-Hsu Lin ,  Shang-Tsang Yeh ,  Chuan-Bing Li

IPC: H01P5/00

CPC classification number: H01P3/081 ,  H01P3/088 ,  H05K1/0245 ,  H05K1/115 ,  H05K2201/09236 ,  H05K2201/09636

Abstract: A layout configuration of a differential pair for a printed circuit board (PCB) having a signal plane is provided. In a preferred embodiment, the layout configuration comprises: a differential pair on the signal plane; a pair of vias abutting the differential pair, and the pair of vias being mutually dissymmetrical about the differential pair; and a distance between the pair of vias along the differential pair being equal to ½ TV, wherein T is a signal rise time, V is a speed of the signal. Therefore, the layout configuration can meet with the requirements of impedance matching, reduce reflection, and improve signal integrity.

Abstract translation: 提供了具有信号面的印刷电路板（PCB）的差动对的配置结构。 在优选实施例中，布局配置包括：信号平面上的差分对; 邻接差分对的一对通孔，并且该对通孔围绕差动对相互不对称; 并且沿着差分对的一对通孔之间的距离等于1/2电视，其中T是信号上升时间，V是信号的速度。 因此，布局配置可以满足阻抗匹配的要求，减少反射，提高信号完整性。

公开(公告)号：US20060219431A1

公开(公告)日：2006-10-05

申请号：US11341590

申请日：2006-01-30

Applicant: Manabu Yamazaki

Inventor： Manabu Yamazaki

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09636

Abstract: An electronic circuit in which a return current path can be acquired effectively, in order to realize high speed signal transmission. The electronic circuit has a first signal layer and a second signal layer, connected with a first via, and at least first and second power supply layers and a grounding layer. A second via, which is electrically connected with only one of the power supply layers or the grounding layer, is located adjacent the first via.

Abstract translation: 为了实现高速信号传输，可以有效地获取返回电流路径的电子电路。 电子电路具有与第一通孔连接的第一信号层和第二信号层以及至少第一和第二电源层和接地层。 与仅电源层或接地层中的一个电连接的第二通孔位于第一通孔附近。

公开(公告)号：US06988162B2

公开(公告)日：2006-01-17

申请号：US10068418

申请日：2002-02-05

Applicant: Joel R. Goergen

Inventor： Joel R. Goergen

IPC: G06F13/00

CPC classification number: H05K1/0245 ,  H04Q1/03 ,  H04Q1/10 ,  H04Q1/155 ,  H04Q2201/12 ,  H05K3/4641 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09636

Abstract: A high-speed, high-power modular router is disclosed. As opposed to conventional designs using optical backplane signaling and/or bus bars for power distribution, the disclosed embodiments combine high-power, low-noise power distribution with high-speed signal routing in a common backplane. Disclosed backplane features allow backplane signaling at 2.5 Gbps or greater on electrical differential pairs distributed on multiple high-speed signaling layers. Relatively thick power distribution layers are embedded within the backplane, shielded from the high-speed signaling layers by digital ground layers and other shielding features. A router using such a backplane provides a level of performance and economy that is believed to be unattainable by the prior art.

公开(公告)号：US06787710B2

公开(公告)日：2004-09-07

申请号：US09986282

申请日：2001-11-08

Applicant: Yoshiaki Uematsu ,  Shinji Manabe

Inventor： Yoshiaki Uematsu ,  Shinji Manabe

IPC: H05K111

CPC classification number: H05K1/115 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09809 ,  Y10T29/49165

Abstract: In holes formed in a multi-layer wiring board for transmitting differential signals, a first hole is formed, an insulating portion is formed by filling the first hole with an insulating resin, a pair of second holes is formed for transmitting the differential signals to the formed insulating portion, and the pair of second holes is arranged symmetrically each other with respect to a center axis of the first hole for forming a coaxial structure.

Abstract translation: 在形成在用于传输差分信号的多层布线板中的孔中，形成第一孔，通过用绝缘树脂填充第一孔形成绝缘部分，形成一对第二孔，用于将差分信号传输到 形成绝缘部分，并且一对第二孔相对于用于形成同轴结构的第一孔的中心轴线彼此对称地布置。