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    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
    282.
    发明申请
    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE 有权
    基于聚合物的微波热处理平面

    公开(公告)号：US20160161193A1

    公开(公告)日：2016-06-09

    申请号：US14925787

    申请日：2015-10-28

    Applicant: KELVIN THERMAL TECHNOLOGIES, INC.

    Inventor： Ryan John Lewis ,  Yung-Cheng Lee ,  Li-Anne Liew ,  Yunda Wang

    IPC: F28D15/04 ,  C23F4/00 ,  B23P15/26

    CPC classification number: F28D15/046 ,  B23P15/26 ,  B81C1/00388 ,  B81C2201/0108 ,  C23F4/00 ,  F28D15/0233 ,  F28F13/187

    Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.

    Abstract translation: 本文描述的实施例涉及基于聚合物的热接地平面的概念和设计。 根据一个实施例，使用聚合物作为制造热接地平面的材料。 其他实施方案包括使用两个微柱阵列的优化芯吸结构设计，使用铜/聚合物处理的TGP的基于光刻的微加工，微柱，嵌入微柱中的节流释放孔，原子层沉积（ALD）亲水 涂层，节流流体充填结构和密封方法，无缺陷ALD气密涂层，符合结构设计。

    PHOTOSENSITIVE SACRIFICIAL POLYMER WITH LOW RESIDUE
    284.
    发明申请
    PHOTOSENSITIVE SACRIFICIAL POLYMER WITH LOW RESIDUE 审中-公开
    具有低残留性的光敏聚合物

    公开(公告)号：US20140272708A1

    公开(公告)日：2014-09-18

    申请号：US14250455

    申请日：2014-04-11

    Applicant: GEORGIA TECH RESEARCH CORPORATION

    Inventor： PAUL KOHL ,  YU-CHUN CHEN

    IPC: G03F7/095

    CPC classification number: G03F7/095 ,  B81B2203/0315 ,  B81C1/00476 ,  B81C2201/0108 ,  G03F7/0045 ,  G03F7/039 ,  G03F7/168 ,  G03F7/36 ,  G03F7/38 ,  G03F7/40 ,  H01L21/7682

    Abstract: Embodiments according to the present invention relate generally to PAG bilayer and PAG-doped unilayer structures using sacrificial polymer layers that incorporate a photoacid generator having a concentration gradient therein. Said PAG concentration being higher in a upper portion of such structures than in a lower portion thereof. Embodiments according to the present invention also relate to a method of using such bilayers and unilayers to form microelectronic structures having a three-dimensional space, and methods of decomposition of the sacrificial polymer within the aforementioned layers.

    Abstract translation: 根据本发明的实施方案一般涉及使用掺入其中具有浓度梯度的光致酸发生器的牺牲聚合物层的PAG双层和PAG掺杂的单层结构。 所述PAG浓度在这种结构的上部比在其下部更高。 根据本发明的实施方案还涉及使用这种双层和单层以形成具有三维空间的微电子结构的方法，以及在上述层内分解牺牲聚合物的方法。

    Display Apparatus Incorporating an Elevated Aperture Layer and Methods of Manufacturing the Same
    285.
    发明申请
    Display Apparatus Incorporating an Elevated Aperture Layer and Methods of Manufacturing the Same 审中-公开
    结合高孔径的显示装置及其制造方法

    公开(公告)号：US20140268274A1

    公开(公告)日：2014-09-18

    申请号：US13842882

    申请日：2013-03-15

    Applicant: PIXTRONIX, INC.

    Inventor： Timothy Brosnihan ,  Javier Villarreal ,  Michael Andrew Gingras

    IPC: G02B5/00 ,  B29D11/00 ,  G02B26/02

    CPC classification number: G02B5/005 ,  B29D11/0074 ,  B81C1/00317 ,  B81C2201/0108 ,  G02B26/023

    Abstract: This disclosure provides systems, methods and apparatus for displaying images. Some such apparatus include an array of display elements coupled to a substrate and an elevated aperture layer (EAL) suspended over the array of display elements. The EAL is coupled to the substrate, and includes, for each of the display elements, at least one aperture for allowing passage of light therethrough. Methods for manufacturing such apparatus include at least one of forming etch holes through the EAL, employing an at least partially sublimatable sacrificial mold, employing a two phase release process, and releasing the apparatus such that a portion of a sacrificial mold remains surrounding portions of the apparatus.

    Abstract translation: 本公开提供了用于显示图像的系统，方法和装置。 一些这样的设备包括耦合到基板的显示元件阵列和悬挂在显示元件阵列上的升高的孔径层（EAL）。 所述EAL耦合到所述基板，并且对于每个所述显示元件包括用于允许光通过的至少一个孔。 用于制造这种设备的方法包括至少一个通过EAL形成蚀刻孔，使用至少部分可升华的牺牲模具，采用两相释放过程，并且释放该设备使得牺牲模具的一部分保持围绕 仪器。

    Packaging compatible wafer level capping of MEMS devices
    286.
    发明授权
    Packaging compatible wafer level capping of MEMS devices 有权
    封装MEMS器件的兼容晶圆级封装

    公开(公告)号：US08765512B2

    公开(公告)日：2014-07-01

    申请号：US13706488

    申请日：2012-12-06

    Applicant: Georgia Tech Research Corporation

    Inventor： Paul A Kohl ,  Rajarshi Saha ,  Nathan Fritz

    IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00

    CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

    Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

    Abstract translation: 本发明公开并要求用于微机电装置（MEMS）的成本有效的晶片级封装工艺。 具体来说，MEMS器件的可移动部件以晶片形式被封装和保护，从而可以使用商品的引线框架封装。 已经使用外涂聚合物，例如环氧环己基多面体低聚倍半硅氧烷（EPOSS）作为掩模材料来模制牺牲聚合物以及覆盖空气腔。 所产生的空气腔是干净，无碎片和坚固的。 空腔具有相当大的强度以承受MEMS器件的引线框架封装期间的成型压力。 已经制造了从20μm×400μm到300μm×400μm的宽范围的空腔，并且被证明是机械稳定的。 这些可能会在各种尺寸范围内容纳MEMS器件。 已经使用纳米压痕研究了腔的强度，并使用分析和有限元技术进行了建模。 使用该协议封装的电容谐振器已经显示出清洁的感测电极和良好的功能。

    Packaging Compatible Wafer Level Capping of MEMS Devices
    287.
    发明申请
    Packaging Compatible Wafer Level Capping of MEMS Devices 有权
    MEMS器件的封装兼容晶圆级封装

    公开(公告)号：US20130341736A1

    公开(公告)日：2013-12-26

    申请号：US13706488

    申请日：2012-12-06

    Applicant: Georgia Tech Research Corporation

    Inventor： Paul A. Kohl ,  Rajarshi Saha ,  Nathan Fritz

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

    Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

    Abstract translation: 本发明公开并要求用于微机电装置（MEMS）的成本有效的晶片级封装工艺。 具体来说，MEMS器件的可移动部件以晶片形式被封装和保护，从而可以使用商品的引线框架封装。 已经使用外涂聚合物，例如环氧环己基多面体低聚倍半硅氧烷（EPOSS）作为掩模材料来模制牺牲聚合物以及覆盖空气腔。 所产生的空气腔是干净，无碎片和坚固的。 空腔具有相当大的强度以承受MEMS器件的引线框架封装期间的成型压力。 已经制造了从20mum×400mum到300mum×400mum的宽范围的空腔，显示出机械稳定。 这些可能会在各种尺寸范围内容纳MEMS器件。 已经使用纳米压痕研究了腔的强度，并使用分析和有限元技术进行了建模。 使用该协议封装的电容谐振器已经显示出清洁的感测电极和良好的功能。

    Packaging for micro electro-mechanical systems and methods of fabricating thereof
    289.
    发明授权
    Packaging for micro electro-mechanical systems and methods of fabricating thereof 有权
    微机电系统的包装及其制造方法

    公开(公告)号：US08476096B2

    公开(公告)日：2013-07-02

    申请号：US10534956

    申请日：2005-03-15

    Applicant: Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

    Inventor： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

    IPC: H01L21/00

    CPC classification number: B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

    Abstract translation: 本公开的实施例提供了用于生产微机电装置包装的系统和方法。 简要描述，在架构中，系统的一个实施例包括形成在基底层上的微电子机械装置; 以及可热分解的牺牲结构，其保护所述微机电装置的至少一部分，其中所述牺牲结构形成在所述基底层上并且围绕包围所述微机电装置的有效表面的气体腔。 还提供了其他系统和方法。

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