METHOD AND APPARATUS FOR ALIGNING MATING FORM TOOLS
    22.
    发明授权
    METHOD AND APPARATUS FOR ALIGNING MATING FORM TOOLS 失效
    方法和装置对准合作的适当工具。

    公开(公告)号:EP0493411B1

    公开(公告)日:1994-07-27

    申请号:EP90913152.6

    申请日:1990-08-30

    CPC classification number: H01L21/67144 B26F1/14 B26F2210/08 Y10T83/8855

    Abstract: An object of the invention is to provide simple and convenient alignment between two mating form tools. The technical problem is the time consuming trial and error procedures frequently used to align mating tools with fine tolerances, for instance 0.025 mils. The invention solves the alignment problem by using a plurality of alignment members (22) extending upward from a surface (26) of one mating tool (14) so that the alignment members (22) engage in slidable contact with alignment tracks (32) formed in the edges of the other mating tool (14). In certain embodiments the alignment members (22) and tracks (32) can be formed in the four corners of rectangular mating tools, and the alignment members (22) can be cylindrical rods with dome shaped tops (30). The alignment is useful for tooling set-up as well as tooling usage. The principle use of the invention is for alignment between a punch (12) and lead form anvil (14) as they are brought together to form TAB tape outer leads (56) connected to an integrated circuit (54).

    Electron beam testing of electronic components
    27.
    发明公开
    Electron beam testing of electronic components 失效
    电子元件的电子束测试

    公开(公告)号:EP0328869A3

    公开(公告)日:1991-06-12

    申请号:EP89100490.5

    申请日:1989-01-12

    CPC classification number: H01J37/045 G01R31/305 H01J2237/24507

    Abstract: An electron beam testing apparatus for applying an electron beam to parts of an electronic component and measuring the secondary electrons released from the part including a secondary electron collector having a plurality of vertically extending screens with a detector positioned adjacent one of the screens. A different voltage is applied to each of the screens of the collector for collecting the secondary electrons over a large area. The apparatus may include a combination blanking and Faraday cup for metering the electron beam current when it is blanked. The apparatus may also be used to measure net work capacitance by measuring the time required to charge a network to a predetermined voltage.

    ENHANCED NONDESTRUCTIVE HOLOGRAPHIC RECONSTRUCTION
    28.
    发明公开
    ENHANCED NONDESTRUCTIVE HOLOGRAPHIC RECONSTRUCTION 失效
    破坏性全息重建。

    公开(公告)号:EP0407396A1

    公开(公告)日:1991-01-16

    申请号:EP89902214.0

    申请日:1988-12-29

    CPC classification number: G03H1/0248 Y10S359/90

    Abstract: Un procédé pour mettre en oeuvre une reconstitution non destructive améliorée d'hologrammes enregistrés sur des supports photoréfringents (10) consiste à régler les états de polarisation du faisceau de reconstitution (24) et des faisceaux d'enregistrement (24, 26), l'énergie d'enregistrement cumulative, et à appliquer au niveau des supports (10) pendant l'enregistrement un champ externe relativement élevé qui est ensuite réduit pendant la reconstitution. Les caractéristiques résultantes de l'historique de reconstitution sont sélectivement modulées par le réglage de la polarisation et de l'intensité du faisceau de reconstitution (24), de la géométrie d'enregistrement, et de la tension appliquée (40) pendant la reconstitution et l'enregistrement et de divers autres paramètres. En général, le rendement de reconstitution (48) commence à un niveau relativement élevé, se réduit initialement pour croître ensuite au-dessus des valeurs de départ, et peut être rendu sensiblement non destructif sur un cycle-type de reconstitution, avec des temps d'effacement excédant quarante cinq minutes.

    Method and assembly for adjustably mounting a heat exchanger for an electronic component
    29.
    发明公开
    Method and assembly for adjustably mounting a heat exchanger for an electronic component 失效
    为用于电子元件的可调节悬浮液的热交换器的方法和装置。

    公开(公告)号:EP0374479A1

    公开(公告)日:1990-06-27

    申请号:EP89121220.1

    申请日:1989-11-16

    CPC classification number: H01L23/433 H01L2924/0002 H01L2924/00

    Abstract: A fluid heat exchanger (12) for mating with an electronic component (14) is supported from a fixed support (16). A connection (32) between the fixed support (16) and the heat exchanger (12) is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component (14) for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural support for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

    Abstract translation: 在电子部件(14)与配合的流体热交换器(12)由固定支撑件(16)支撑。 固定支撑(16)和所述热交换器(12)之间的连接(32)是用于调节热交换器的位置,以适应在所述电子部件(14)的高度或姿态的变化,用于提供良好的热INITIALLY灵活 接口。 那里之后,该连接改变为刚性连接,以提供允许支撑承受振动或冲击从而避免过载对电子元件进行热交换器良好的结构支撑。 的连接的灵活性可以是可逆的供以后重新调整相对于所述电子部件的换热器的位置。

    Customizable circuitry
    30.
    发明公开
    Customizable circuitry 失效
    可定制电路

    公开(公告)号:EP0329018A3

    公开(公告)日:1990-02-28

    申请号:EP89102243.6

    申请日:1989-02-09

    CPC classification number: H05K7/06 H01L2924/0002 H05K1/0289 H01L2924/00

    Abstract: A customizable circuit using a programmable interconnect and a compatible tape design for tape automated bonding of chips to the circuitry. The programmable interconnect comprises layers of wires, with one layer of wires forming overlap regions with the adjacent layer of wires. The wires can be selectively linked later to form the desired interconnect. The selective linkage represents the customization of an otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed is a method for forming the interconnect.

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