公开(公告)号：EP0676084A1

公开(公告)日：1995-10-11

申请号：EP94905334.0

申请日：1993-12-06

Applicant: Microelectronics and Computer Technology Corporation

Inventor： KUMAR, Nalin ,  XIE, Chenggang

IPC: H01J1 ,  H01J9 ,  H01J29 ,  H01J31 ,  H01J63

CPC classification number: H01J63/06 ,  H01J1/304 ,  H01J1/3042 ,  H01J9/027 ,  H01J31/127 ,  H01J2201/30457 ,  H01J2201/319 ,  H01J2329/8625

Abstract: A flat panel display for displaying visual information includes a plurality of corresponding light-emitting anodes (130), and field-emission cathodes (170), each of the anodes emitting light in response to emission from each of the corresponding cathodes, each of the cathodes (170) including a layer of low work function material having a relatively flat emission surface of a plurality of distributed localized electron emission sites and a grid assembly (102) interposed between the corresponding anodes (130) and cathodes (170) to thereby control emission levels to the anodes from the corresponding cathodes.

公开(公告)号：EP0493411B1

公开(公告)日：1994-07-27

申请号：EP90913152.6

申请日：1990-08-30

Applicant: Microelectronics and Computer Technology Corporation

Inventor： WEHRLY, James, Douglass, Jr. ,  BERTRAM, Michael, John

IPC: B21D37/12

CPC classification number: H01L21/67144 ,  B26F1/14 ,  B26F2210/08 ,  Y10T83/8855

Abstract: An object of the invention is to provide simple and convenient alignment between two mating form tools. The technical problem is the time consuming trial and error procedures frequently used to align mating tools with fine tolerances, for instance 0.025 mils. The invention solves the alignment problem by using a plurality of alignment members (22) extending upward from a surface (26) of one mating tool (14) so that the alignment members (22) engage in slidable contact with alignment tracks (32) formed in the edges of the other mating tool (14). In certain embodiments the alignment members (22) and tracks (32) can be formed in the four corners of rectangular mating tools, and the alignment members (22) can be cylindrical rods with dome shaped tops (30). The alignment is useful for tooling set-up as well as tooling usage. The principle use of the invention is for alignment between a punch (12) and lead form anvil (14) as they are brought together to form TAB tape outer leads (56) connected to an integrated circuit (54).

公开(公告)号：EP0328869B1

公开(公告)日：1994-03-30

申请号：EP89100490.5

申请日：1989-01-12

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Woodard, Ollie Clifton, Sr. ,  Ross, Andrew William

IPC: G01R31/28 ,  G01R31/305

CPC classification number: H01J37/045 ,  G01R31/305 ,  H01J2237/24507

公开(公告)号：EP0285854B1

公开(公告)日：1992-09-23

申请号：EP88103915.0

申请日：1988-03-11

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Smith, Lawrence Norman

IPC: H01L29/92

CPC classification number: H01L28/40 ,  Y10T29/435

公开(公告)号：EP0349634A4

公开(公告)日：1991-11-13

申请号：EP89901657

申请日：1988-12-27

Applicant: MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION

Inventor： HESSELINK, LAMBERTUS ,  REDFIELD, STEVE, R.

IPC: G02F1/055 ,  G02F1/05 ,  G03H1/02 ,  G03H1/04 ,  G03H1/26 ,  G06E3/00 ,  G11C13/04

CPC classification number: G03H1/0248 ,  G02F1/0541 ,  G03H1/26 ,  G03H2001/0066 ,  G03H2001/026 ,  G03H2260/30 ,  G03H2260/54 ,  G06E3/005 ,  G11C13/044 ,  G11C13/046

Abstract: A photorefractive crystallyte array (10) for image recording and signal processing is disclosed. The photorefractive crystallytes (11) are configured as a two-dimensional array (10) of selected position and spacing designed, for example, to coincide with the spatial frequency components of an associated optical image, such as a Fourier transform image, and to permit optical signal processing.

公开(公告)号：EP0326020A3

公开(公告)日：1991-10-16

申请号：EP89100877.3

申请日：1989-01-19

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Andrews, Daniel Marshall ,  Spletter, Phillip James ,  Simmons, Richard Linn

IPC: H01L21/60 ,  H01L21/68 ,  B23K1/005

CPC classification number: H01L21/68 ,  B23K1/0056 ,  H01L21/67138 ,  H01L24/86 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

公开(公告)号：EP0328869A3

公开(公告)日：1991-06-12

申请号：EP89100490.5

申请日：1989-01-12

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Woodard, Ollie Clifton, Sr. ,  Ross, Andrew William

IPC: G01R31/28 ,  G01R31/305

CPC classification number: H01J37/045 ,  G01R31/305 ,  H01J2237/24507

Abstract: An electron beam testing apparatus for applying an electron beam to parts of an electronic component and measuring the secondary electrons released from the part including a secondary electron collector having a plurality of vertically extending screens with a detector positioned adjacent one of the screens. A different voltage is applied to each of the screens of the collector for collecting the secondary electrons over a large area. The apparatus may include a combination blanking and Faraday cup for metering the electron beam current when it is blanked. The apparatus may also be used to measure net work capacitance by measuring the time required to charge a network to a predetermined voltage.

公开(公告)号：EP0407396A1

公开(公告)日：1991-01-16

申请号：EP89902214.0

申请日：1988-12-29

Applicant: Microelectronics and Computer Technology Corporation

Inventor： REDFIELD, Stephen, R. ,  HESSELINK, Lambertus

IPC: B41M5 ,  G03H1

CPC classification number: G03H1/0248 ,  Y10S359/90

Abstract: Un procédé pour mettre en oeuvre une reconstitution non destructive améliorée d'hologrammes enregistrés sur des supports photoréfringents (10) consiste à régler les états de polarisation du faisceau de reconstitution (24) et des faisceaux d'enregistrement (24, 26), l'énergie d'enregistrement cumulative, et à appliquer au niveau des supports (10) pendant l'enregistrement un champ externe relativement élevé qui est ensuite réduit pendant la reconstitution. Les caractéristiques résultantes de l'historique de reconstitution sont sélectivement modulées par le réglage de la polarisation et de l'intensité du faisceau de reconstitution (24), de la géométrie d'enregistrement, et de la tension appliquée (40) pendant la reconstitution et l'enregistrement et de divers autres paramètres. En général, le rendement de reconstitution (48) commence à un niveau relativement élevé, se réduit initialement pour croître ensuite au-dessus des valeurs de départ, et peut être rendu sensiblement non destructif sur un cycle-type de reconstitution, avec des temps d'effacement excédant quarante cinq minutes.

公开(公告)号：EP0374479A1

公开(公告)日：1990-06-27

申请号：EP89121220.1

申请日：1989-11-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Nelson, Richard Douglas ,  Gupta, Omkarnath Ramnath ,  Herrell, Dennis J.

IPC: H01L23/473 ,  H01L23/40

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A fluid heat exchanger (12) for mating with an electronic component (14) is supported from a fixed support (16). A connection (32) between the fixed support (16) and the heat exchanger (12) is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component (14) for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural support for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

Abstract translation: 在电子部件（14）与配合的流体热交换器（12）由固定支撑件（16）支撑。 固定支撑（16）和所述热交换器（12）之间的连接（32）是用于调节热交换器的位置，以适应在所述电子部件（14）的高度或姿态的变化，用于提供良好的热INITIALLY灵活 接口。 那里之后，该连接改变为刚性连接，以提供允许支撑承受振动或冲击从而避免过载对电子元件进行热交换器良好的结构支撑。 的连接的灵活性可以是可逆的供以后重新调整相对于所述电子部件的换热器的位置。

公开(公告)号：EP0329018A3

公开(公告)日：1990-02-28

申请号：EP89102243.6

申请日：1989-02-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Smith, Lawrence Norman

IPC: H05K7/06

CPC classification number: H05K7/06 ,  H01L2924/0002 ,  H05K1/0289 ,  H01L2924/00

Abstract: A customizable circuit using a programmable interconnect and a compatible tape design for tape automated bonding of chips to the circuitry. The programmable interconnect comprises layers of wires, with one layer of wires forming overlap regions with the adjacent layer of wires. The wires can be selectively linked later to form the desired interconnect. The selective linkage represents the customization of an otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed is a method for forming the interconnect.