中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

59 records (took 0.027 seconds)

    전자기 밴드갭 구조물 및 회로 기판
    21.
    发明公开
    전자기 밴드갭 구조물 및 회로 기판 有权
    电磁带结构与电路板

    公开(公告)号：KR1020100062346A

    公开(公告)日：2010-06-10

    申请号：KR1020080120949

    申请日：2008-12-02

    Applicant: 삼성전기주식회사

    Inventor： 김한 ,  구자부 ,  박대현

    IPC: H05K1/02

    CPC classification number: H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

    Abstract: PURPOSE: An electromagnetic band-gap structure and a circuit board are provided to apply for an electrical appliance including a system in package or a network board by overcoming a conductive noise problem. CONSTITUTION: A plurality of first conductive plates(430-1) is located on the surface a first plane and is arranged to a first direction. A plurality of second conductive plates(430-2) is located on a second plane and is arranged to the first direction. A first stitching via(441) electrically connects neighboring conductive regions on the first plane to the opposite direction from the first direction. A second stitching via(442) electrically connects neighboring conductive regions on the second to the opposite direction.

    Abstract translation: 目的：提供一种电磁带隙结构和电路板，用于通过克服导电噪声问题来应用包括系统在内的电气设备或网络板。 构成：多个第一导电板（430-1）在表面上位于第一平面上并且被布置成朝向第一方向。 多个第二导电板（430-2）位于第二平面上并且被布置成朝向第一方向。 第一缝合通孔（441）将第一平面上的相邻导电区域与第一方向相反的方向电连接。 第二缝合通孔（442）将第二到相反方向上的相邻导电区域电连接。

    전자기 밴드갭 구조물 및 회로 기판
    22.
    发明公开
    전자기 밴드갭 구조물 및 회로 기판 失效
    电磁带结构与电路板

    公开(公告)号：KR1020100059217A

    公开(公告)日：2010-06-04

    申请号：KR1020080117907

    申请日：2008-11-26

    Applicant: 삼성전기주식회사

    Inventor： 봉강욱 ,  김한 ,  박대현

    IPC: H05K1/02

    CPC classification number: H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

    Abstract: PURPOSE: An electromagnetic band gap structure and a circuit substrate are provided to shield a conduction noise in a specific frequency band by forming an electromagnetic bandgap structure which includes a specific structure in a circuit substrate. CONSTITUTION: At least four conductive plates are provided. A first stitching via(650-1) electrically interlinks two conductive plates among the conductive plates. A second stitching via(650-2) electrically interlinks two conductive plates except for the two conductive plates. A stitching via chain electrically interlinks the first stitching via and the second stitching via. The stitching via chain comprises a first via, a second via, and a conductive connection pattern. The conductive connection pattern interlinks different end of the first via and different end of the second via on coplanar.

    Abstract translation: 目的：提供电磁带隙结构和电路基板，以通过在电路基板中形成包括特定结构的电磁带隙结构来屏蔽特定频带中的导电噪声。 构成：至少提供四个导电板。 第一缝合通孔（650-1）电连接导电板中的两个导电板。 第二针迹通孔（650-2）将除了两个导电板之外的两个导电板电连接。 缝合通孔链将第一缝合通孔和第二缝合通孔电连接。 通过链条的缝合包括第一通孔，第二通孔和导电连接图案。 导电连接图案将第一通孔的不同端和第二通孔的不同端部共面连接。

    전자기 밴드갭 구조물 및 인쇄회로기판
    23.
    发明授权
    전자기 밴드갭 구조물 및 인쇄회로기판 失效
    电磁带结构和印刷电路板

    公开(公告)号：KR100871346B1

    公开(公告)日：2008-12-01

    申请号：KR1020070061829

    申请日：2007-06-22

    Applicant: 삼성전기주식회사

    Inventor： 김한 ,  윤일성 ,  한미자 ,  박대현

    IPC: H05K1/02 ,  H05K9/00

    CPC classification number: H01P1/2005 ,  H05K1/0236 ,  H05K1/116 ,  H05K2201/09627

    Abstract: An electromagnetic bandgap structure and a printed circuit board are provided to obtain a low bandgap frequency while having a small size. A first dielectric layer is laminated on a first metal layer(320a). A mush type structure(330) includes a metal plate(332) laminated on the first dielectric layer and a via(334) of which one end is connected to the metal plate. A second dielectric layer(320b) is laminated on the metal plate and the first dielectric layer. The other end(334b) of the via is positioned in a hole(350) formed in the first metal layer and is connected to the first metal layer through the metal line. The other end of via is connected to a via land(360) positioned in the hole. The metal line(340) connects the via land and the first metal layer.

    Abstract translation: 提供电磁带隙结构和印刷电路板以获得低带隙频率，同时具有小尺寸。 在第一金属层（320a）上层叠第一电介质层。 糊状结构（330）包括层叠在第一介电层上的金属板（332）和一端连接到金属板的通孔（334）。 第二电介质层（320b）层叠在金属板和第一电介质层上。 通孔的另一端（334b）位于形成在第一金属层中的孔（350）中，并且通过金属线连接到第一金属层。 通孔的另一端连接到定位在孔中的通孔焊盘（360）。 金属线（340）连接通孔焊盘和第一金属层。

    전자기 밴드갭 구조물 및 인쇄회로기판
    24.
    发明授权
    전자기 밴드갭 구조물 및 인쇄회로기판 失效
    电磁带结构和印刷电路板

    公开(公告)号：KR100851076B1

    公开(公告)日：2008-08-12

    申请号：KR1020070041989

    申请日：2007-04-30

    Applicant: 삼성전기주식회사

    Inventor： 한미자 ,  김한 ,  박대현 ,  이재준

    IPC: H05K1/02

    CPC classification number: H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

    Abstract: An electromagnetic band gap structure and a printed circuit board are provided to reduce a noise level by blocking the noise with a specific frequency. An electromagnetic band gap structure includes first and second metal layers(210-1,210-2), first and second dielectric layers(220a,220b), a metal plate(330), and a via(340). The first dielectric layer is formed on the first metal layer. The metal plate is formed on the first dielectric layer and has a hole(350). The via connects the first metal layer and the metal plate. The second dielectric layer is formed on the metal plate and the first dielectric layer. The second metal layer is formed on the second dielectric layer.

    Abstract translation: 提供电磁带隙结构和印刷电路板以通过以特定频率阻挡噪声来降低噪声水平。 电磁带隙结构包括第一和第二金属层（210-1,210-2），第一和第二电介质层（220a，220b），金属板（330）和通孔（340）。 第一介电层形成在第一金属层上。 金属板形成在第一电介质层上并具有孔（350）。 通孔连接第一金属层和金属板。 第二电介质层形成在金属板和第一电介质层上。 第二金属层形成在第二介质层上。

    전자기 밴드갭 구조물, 이를 포함하는 인쇄회로기판과 그제조방법
    25.
    发明授权
    전자기 밴드갭 구조물, 이를 포함하는 인쇄회로기판과 그제조방법 失效
    电磁带结构，包含此印刷电路板及其方法

    公开(公告)号：KR100848848B1

    公开(公告)日：2008-07-28

    申请号：KR1020070070001

    申请日：2007-07-12

    Applicant: 삼성전기주식회사

    Inventor： 김한 ,  박대현

    IPC: H05K3/40 ,  H05K1/02

    CPC classification number: H01Q15/008 ,  H01P1/2005 ,  H01Q15/006 ,  H05K1/0236 ,  H05K1/0237 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09663 ,  H05K2201/09718 ,  Y10T29/49165

    Abstract: An electromagnetic bandgap structure, a PCB(Printed Circuit Board) having the same, and a method for manufacturing the same are provided to prevent the extension of the entire process by not adding an inner layer drilling process, a plating process, and a filling process. An electromagnetic bandgap structure(700) includes a first metal layer(710), a first dielectric layer(731), a metal plate(740), a second dielectric layer(732), a second metal layer(720), and a via(750). The first electric layer is stacked on the first metal layer. The metal plate is stacked on the first dielectric layer. The second dielectric layer is stacked on the metal plate and the first dielectric layer. The second metal layer is stacked on the second dielectric layer. The via faces the first and second metal layers with respect to the metal plate. The via is connected to the first metal layer and is not connected to the second metal layer.

    Abstract translation: 提供电磁带隙结构，具有该电磁带隙结构的PCB（印刷电路板）及其制造方法，以通过不添加内层钻孔工艺，电镀工艺和填充工艺来防止整个工艺的延伸 。 电磁带隙结构（700）包括第一金属层（710），第一介电层（731），金属板（740），第二电介质层（732），第二金属层（720） （750）。 第一电层层叠在第一金属层上。 金属板堆叠在第一电介质层上。 第二电介质层层叠在金属板和第一电介质层上。 第二金属层堆叠在第二介电层上。 通孔相对于金属板面对第一和第二金属层。 通孔连接到第一金属层，并且不连接到第二金属层。

Patent Agency Ranking