Abstract:
An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.
Abstract:
Wässrige, Ceroxid und Siliciumdioxid enthaltende Dispersion, erhältlich, indem man eine Ceroxid-Ausgangsdispersion und eine Siliciumdioxid-Ausgangsdispersion zunächst unter Rühren vermischt und nachfolgend bei einer Scherrate von 10000 bis 30000 sdispergiert, wobei a) die Ceroxid-Ausgangsdispersion - als feste Phase 0,5 bis 30 Gew.-% Ceroxidpartikel enthält, - einen d-Wert der Teilchengrößenverteilung von 10 bis 100 nm - und einen pH-Wert von 1 bis 7 aufweist und - b) die Siliciumdioxid-Ausgangsdispersion - als feste Phase 0,1 bis 30 Gew.-% kolloidale Siliciumdioxidpartikel enthält, - einen d-Wert der Teilchengrößenverteilung von 3 bis 50 nm und - einen pH-Wert von 6 bis 11,5 aufweist, d) unter der Maßgabe, dass - der d-Wert der Teilchengrößenverteilung der Ceroxidpartikel größer ist als der der Siliciumdioxidpartikel, - das Gewichtsverhältnis Ceroxid/Siliciumdioxid > 1 ist und - die Menge an Ceroxid-Ausgangsdispersion so bemessen ist, dass das Zetapotential der Dispersion negativ ist.
Abstract:
Chemical mechanical polishing composition is provided. The composition comprises (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a protein, and (C) an aqueous medium.
Abstract:
A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION, COMPRISING (A) AT LEAST ONE TYPE OF INORGANIC PARTICLES WHICH ARE DISPERSED IN THE LIQUID MEDIUM (C), (B) AT LEAST ONE TYPE OF POLYMER PARTICLES WHICH ARE DISPERSED IN THE LIQUID MEDIUM (C), (C) A LIQUID MEDIUM, WHEREIN THE ZETA-POTENTIAL OF THE INORGANIC PARTICLES (A) IN THE LIQUID MEDIUM (C) AND THE ZETA-POTENTIAL OF THE POLYMER PARTICLES IN THE LIQUID MEDIUM (C) ARE OF SAME SIGNS. (FIG. 4)
Abstract:
An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.
Abstract:
An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.