22.
    发明专利
    未知

    公开(公告)号:DE69024452T2

    公开(公告)日:1996-07-11

    申请号:DE69024452

    申请日:1990-10-08

    Applicant: IBM

    Abstract: An ultraviolet light sensitive photoinitiator composition that includes at least one anthracene derivative represented by the formula: wherein X is CH=CH2 or -(-CH2-)-n0-(-R) with R being H or wherein each R , R and R individually is selected from the group of alkyl, alkenyl, aryl, wherein each R , R and R individually is selected from the group of alkyl, alkenyl and aryl; wherein m is an integer of 0 to 4, p is an integer of 0 to 4; and is n being 1 to 2; and onium salt; and an organic solvent. The composition is used for cationic polymerization of cationic polymerizable materials including in the formation of a pattern of a photoresist. Also certain novel epoxy-functionalized organosilicons are provided that are sensitive to radiation including E-beam radiation and exhibit resistance to oxygen reactive ion etching.

    23.
    发明专利
    未知

    公开(公告)号:DE69024452D1

    公开(公告)日:1996-02-08

    申请号:DE69024452

    申请日:1990-10-08

    Applicant: IBM

    Abstract: An ultraviolet light sensitive photoinitiator composition that includes at least one anthracene derivative represented by the formula: wherein X is CH=CH2 or -(-CH2-)-n0-(-R) with R being H or wherein each R , R and R individually is selected from the group of alkyl, alkenyl, aryl, wherein each R , R and R individually is selected from the group of alkyl, alkenyl and aryl; wherein m is an integer of 0 to 4, p is an integer of 0 to 4; and is n being 1 to 2; and onium salt; and an organic solvent. The composition is used for cationic polymerization of cationic polymerizable materials including in the formation of a pattern of a photoresist. Also certain novel epoxy-functionalized organosilicons are provided that are sensitive to radiation including E-beam radiation and exhibit resistance to oxygen reactive ion etching.

    25.
    发明专利
    未知

    公开(公告)号:DE3585437D1

    公开(公告)日:1992-04-02

    申请号:DE3585437

    申请日:1985-12-13

    Applicant: IBM

    Abstract: The surface of a substrate is roughened by providing a substrate which comprises a resinous material and an inorganic particulate material; and etching a surface of the substrate to selectively etch the resinous material and thereby produce the roughened surface. The preferred etching process is a dry etching process.

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