公开(公告)号：DE102016113347A1

公开(公告)日：2018-01-25

申请号：DE102016113347

申请日：2016-07-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WÄCHTER CLAUS VON ,  MAIER DOMINIC ,  GOLLER BERND ,  LEDUTKE MICHAEL ,  FÜRGUT EDWARD

IPC: B81C1/00 ,  B81B7/02 ,  H01L25/00

Abstract: Das Verfahren umfasst Herstellen einer Halbleiterplatte, die eine Vielzahl von Halbleitervorrichtungen umfasst, Herstellen einer Kappenplatte, die eine Vielzahl von Kappen umfasst, Binden der Kappenplatte auf die Halbleiterplatte, so dass jede der Kappen eine oder mehrere der Halbleitervorrichtungen abdeckt, und Vereinzeln der verbundenen Platten zu einer Vielzahl von Halbleitermodulen.

公开(公告)号：DE50214717D1

公开(公告)日：2010-11-25

申请号：DE50214717

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER ,  THUMBS JOSEF

IPC: H01L23/12 ,  H01L23/31 ,  H01L21/56 ,  H01L21/68

公开(公告)号：DE10250538B4

公开(公告)日：2008-02-21

申请号：DE10250538

申请日：2002-10-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L21/58 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/16

Abstract: The component (1) has two ore more semiconductor chips (2,3) integrated into a circuit carrier (7) such that a mounting side (8) of the carrier is flush with an active surface (5,6) of the semiconductor chips, forming a fine wiring plane (9) with contact terminals (11) at the edges. A package (10) encloses components on a rewiring substrate (12). External contacts (18) of the electronic component are distributed on the underside of the rewiring substrate. An Independent claim is included for a panel with multiple circuit carrier positions; and for method of manufacturing an electronic component.

公开(公告)号：DE10142119B4

公开(公告)日：2007-07-26

申请号：DE10142119

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50

公开(公告)号：DE10229493B4

公开(公告)日：2007-03-29

申请号：DE10229493

申请日：2002-07-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  ERTLE WERNER ,  GREIDERER REINHARD ,  BAUER ROBERT ,  FROHNMUELLER TILL ,  NAGLER OLIVER ,  SCHMECKEBIER OLAF ,  STADLER WOLFGANG

IPC: H01L23/50 ,  H01L23/485

Abstract: An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least-part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.

公开(公告)号：DE10340129B4

公开(公告)日：2006-07-13

申请号：DE10340129

申请日：2003-08-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L23/50 ,  H01L21/50 ,  H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: Semiconductor chip (3) has rear (4), sides (5,7) and contact faces (9) on active top side (10). Module body is card-shaped, containing chip and plastics mass (12), in which chip rear and sides are embbeded, with card forming combined surface (13) of plastics and chip top side.On combined surface are fitted plug contacts (2) linked to chip contact faces by wiring lines (14) of single wiring layer (16) on combined surface. Insulating cover film (17) is deposited on contact faces, leaving plug contacts exposed. Independent claims are included for wafer manufacturing utensil and its production and for manufacture of electronic module.

公开(公告)号：DE10340129A1

公开(公告)日：2005-04-14

申请号：DE10340129

申请日：2003-08-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/50 ,  H01L23/28 ,  H01L25/065 ,  H01L21/50

Abstract: Semiconductor chip (3) has rear (4), sides (5,7) and contact faces (9) on active top side (10). Module body is card-shaped, containing chip and plastics mass (12), in which chip rear and sides are embbeded, with card forming combined surface (13) of plastics and chip top side.On combined surface are fitted plug contacts (2) linked to chip contact faces by wiring lines (14) of single wiring layer (16) on combined surface. Insulating cover film (17) is deposited on contact faces, leaving plug contacts exposed. Independent claims are included for wafer manufacturing utensil and its production and for manufacture of electronic module.

公开(公告)号：DE10334575A1

公开(公告)日：2005-03-17

申请号：DE10334575

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  GOLLER BERND ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L21/50

Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

公开(公告)号：DE10240461A9

公开(公告)日：2004-09-09

申请号：DE10240461

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L25/065

Abstract: Electronic component comprises a semiconductor chip (3) having chip contacts (4) on its contact surfaces. The chip contacts are mechanically fixed on contact connecting surfaces (5) of a rewiring structure (6) and electrically connected to the rewiring structure. The rewiring structure is formed as a region of a structured metal plate or structured metal layer of a metal-laminated base plate. Independent claims are also included for the following: (1) Process for the production of an electronic component; and (2) Panel for the electronic component having a shape-stable plastic plate.

公开(公告)号：DE10320579A1

公开(公告)日：2004-08-26

申请号：DE10320579

申请日：2003-05-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND

IPC: H01L21/56 ,  H01L21/98 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/32 ,  H01L27/04 ,  H01L21/58

Abstract: Semiconductor wafer having an upper side, semiconductor chip positions with integrated circuits for first chips (4), central region (5) and an edge region (7) with their contact surfaces (6) and (8) respectively, connected via conduction paths (9)(sic), second chips (10), with their contact surfaces (11), located on the central regions (5) of chips (4), and an equalizing layer (12) on the upper side with second chips (10) embedded in it. Independent claims are included for: (1) Nutzen (sic), (2) an electronic component with first and second chips, (3) a device with a polyimide equalizing layer, (4) a process for preparation of the wafer, (5) a process for preparation of the Nutzen (sic), (6) a process for preparation of the electronic component.