25.
    发明专利
    未知

    公开(公告)号:DE10161312A1

    公开(公告)日:2003-07-10

    申请号:DE10161312

    申请日:2001-12-13

    Abstract: An arrangement and process for producing a circuit arrangement is disclosed. The process includes having a layer arrangement, in which two electrically conductive interconnects running substantially parallel to one another are formed on a substrate. At least one auxiliary structure is formed on the substrate and between the two interconnects, running in a first direction, which first direction includes an angle of between 45 degrees and 90 degrees with a connecting axis of the interconnects, running orthogonally with respect to the two interconnects, the at least one auxiliary structure being produced from a material which allows the at least one auxiliary structure to be selectively removed from a dielectric layer. The dielectric layer is formed between the two interconnects, in such a manner that the at least one auxiliary structure is at least partially covered by the dielectric layer.

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