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公开(公告)号:WO0045441A3
公开(公告)日:2001-03-29
申请号:PCT/DE0000203
申请日:2000-01-25
Applicant: INFINEON TECHNOLOGIES AG , BACHHOFER HARALD , REISINGER HANS , HANEDER THOMAS PETER
Inventor: BACHHOFER HARALD , REISINGER HANS , HANEDER THOMAS PETER
CPC classification number: H01L29/511
Abstract: The invention relates to a semiconductor device with a multiple dielectric, especially an ONO-triple dielectric, comprising a semiconductor substrate (10) of a first conduction type, a first doping area (20) of a second conduction type which is provided in said semiconductor substrate (10), a second doping area (30) of the second conduction type which is provided in the semiconductor substrate (10), a channel area (25) which is situated between the first and the second doping area (20, 30), a gate dielectric (40, 50, 60) which lies on top of the channel area (25) and which has at least three layers; and a gate terminal (70) which is provided on top of the gate dielectric (40, 50, 60). The bottom layer (40) of the gate dielectric (40, 50, 60) has an essentially smaller dielectric constant than the top layer (60) of the gate dielectric (40, 50, 60).
Abstract translation: 本发明提供了一种具有Mehrfachdielektrikum的半导体器件,特别是ONO Dreifachdielektrikum,包括:第一导电类型的半导体衬底(10); 一个在设置于第二导电型的第一杂质区(20)的半导体衬底(10); 一个在设置于第二导电型的第二杂质区(30)的半导体衬底(10); 一个所述第一和第二杂质区之间躺在(20,30)沟道区(25); 一个在所述沟道区(25)下面的栅极电介质(40,50,60),其具有至少三个层; 及以上的栅极端子(70)设置在栅极电介质(40,50,60)。 栅极电介质(40,50,60)的底部层(40)的介电常数比所述栅极电介质(40,50,60)的最上层(60)显着更小。
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公开(公告)号:WO0036636A3
公开(公告)日:2000-08-10
申请号:PCT/DE9903926
申请日:1999-12-08
Applicant: INFINEON TECHNOLOGIES AG , WENDT HERMANN , BEITEL GERHARD , REISINGER HANS
Inventor: WENDT HERMANN , BEITEL GERHARD , REISINGER HANS
IPC: H01L21/02 , H01L21/285 , H01L21/8242
Abstract: The aim of the invention is to create a microelectronic structure which prevents oxidation of oxygen-sensitive structures (25). To this end, the microelectronic structure is provided with a conductive layer (10) consisting of a platinum iridium alloy. The iridium should hamper the oxygen diffusion through the conductive layer (10) by binding the oxygen when the microelectronic structure is treated in a oxygen-containing atmosphere. Oxidation-sensitive structures (25) are thus protected underneath the conductive layer (10).
Abstract translation: 它是要创建的微电子结构,其防止对氧敏感的结构(25)的氧化。 为了这个目的,在微电子结构的导电层(10)由铂铱合金制成。 铱应通过结合氧气阻碍通过导电层(10)中的氧扩散,从而保护用一种处理微电子结构的导电层(10)下方的氧化敏感的结构(25)在含氧气氛。
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公开(公告)号:DE19947117B4
公开(公告)日:2007-03-08
申请号:DE19947117
申请日:1999-09-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STENGL REINHARD , REISINGER HANS , HANEDER THOMAS , BACHHOFER HARALD
IPC: H01L21/8247 , H01L29/78 , G11C11/22 , H01L21/8246 , H01L27/105 , H01L29/51 , H01L29/788 , H01L29/792
Abstract: A first source-drain region, a channel region, and a second source-drain region are arranged one after another in a semiconductor substrate. At least the surface of the channel region and parts of the first source-drain region are covered by a dielectric layer. A ferroelectric layer is disposed on the surface of the dielectric layer between two polarization electrodes. A gate electrode is arranged on the surface of the dielectric layer. The thickness of the dielectric layer is dimensioned such that a remanent polarization of the ferroelectric layer, which is aligned between the two polarization electrodes, produces compensation charges in part of the channel region. The ferroelectric transistor is suitable as a memory cell for a memory cell configuration.
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公开(公告)号:DE59913465D1
公开(公告)日:2006-06-29
申请号:DE59913465
申请日:1999-07-05
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HANEDER PETER , REISINGER HANS , STENGL REINHARD , BACHHOFER HARALD , WENDT HERMANN , HOENLEIN WOLFGANG
IPC: H01L21/8247 , H01L29/786 , G11C11/22 , H01L21/8246 , H01L27/105 , H01L29/49 , H01L29/78 , H01L29/788 , H01L29/792
Abstract: A ferroelectric transistor suitable as a memory element has a first gate intermediate layer and a first gate electrode disposed on the surface of a semiconductor substrate and disposed between source/drain regions. The first gate intermediate layer contains at least one ferroelectric layer. In addition to the first gate intermediate layer, a second gate intermediate layer and a second gate electrode are configured between the source/drain regions. The second gate intermediate layer contains a dielectric layer. The first gate electrode and the second gate electrode are connected to each other via a diode structure.
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公开(公告)号:DE19652547C2
公开(公告)日:2002-04-25
申请号:DE19652547
申请日:1996-12-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HOFMANN FRANZ , WILLEER JOSEF , REISINGER HANS , BASSE PAUL WERNER V , KRAUTSCHNEIDER WOLFGANG
IPC: H01L21/28 , H01L21/8246 , H01L21/8247 , H01L27/115 , H01L27/11517 , H01L27/11568 , H01L29/788 , H01L29/792
Abstract: A number of memory cell lines insulated from one another and that respectively comprise a first doped region and a second doped region between which a gate dielectric, which contains a material with charge carrier traps and a number of gate electrodes. The spacing of neighboring gate electrodes is smaller than the dimensions of the gate electrodes. The information is stored by introduction of charge carriers into the gate dielectric. The gate electrodes are preferably manufactured with the assistance of a spacer technique.
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公开(公告)号:DE59704768D1
公开(公告)日:2001-11-08
申请号:DE59704768
申请日:1997-06-24
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SCHAEFER HERBERT , FRANOSCH MARTIN , STENGL REINHARD , LEHMANN VOLKER , REISINGER HANS , WENDT HERMANN
IPC: C23C16/04 , H01L21/033 , H01L21/20 , H01L21/205 , H01L21/266 , H01L21/28 , H01L21/302 , H01L21/3065 , H01L21/308 , H01L21/311 , H01L21/3205 , H01L21/336 , H01L21/8247 , H01L27/115 , H01L27/11517 , H01L29/788 , H01L29/792
Abstract: The mfg. method provides a fine structure at the surface of a substrate (1,2,3) using a cathodic vapour deposition process, effected with a process gas containing SiH4 and GeH4 in a carrier gas, for providing raised areas (4) determining the size of the fine structures. The raised areas act as a mask for an etching or implantation process and have a mean dia. and mean spacing of the order of between 1 and 100nm.
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公开(公告)号:DE59914245D1
公开(公告)日:2007-04-19
申请号:DE59914245
申请日:1999-05-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor: REISINGER HANS , LEHMANN VOLKER , STENGL REINHARD , WENDT HERMANN , LANGE GERRIT , BACHHOFER HARALD , FRANOSCH MARTIN , SCHAEFER HERBERT
IPC: H01L21/8242 , H01L27/108
Abstract: A storage capacitor for a DRAM has a dielectric composed of silicon nitride and has at least two electrodes disposed opposite one another across the dielectric. A material having a high tunneling barrier between the Fermi level of the material and the conduction band of the dielectric is used for the electrodes. Suitable materials for the electrodes are metals such as platinum, tungsten and iridium or silicides.
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公开(公告)号:DE102004020264A1
公开(公告)日:2005-11-17
申请号:DE102004020264
申请日:2004-04-26
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BLANK OLIVER , REISINGER HANS , STENGL REINHARD
Abstract: An analog-to-digital converter comprises a signal input (61), a unit (31,71) to produce a time-related changing analog signal (101) and a device to produce an overlap signal from these two. A converter generates many count values based on this and a processing unit gives and outputs (81) an average number value from these. An independent claim is also included for a conversion process for the above.
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公开(公告)号:DE59900511D1
公开(公告)日:2002-01-17
申请号:DE59900511
申请日:1999-05-05
Applicant: INFINEON TECHNOLOGIES AG
Inventor: LEHMANN VOLKER , OTTOW STEFAN , STENGL REINHARD , REISINGER HANS , WENDT HERMANN
Abstract: The invention relates to a reactor system comprising a housing (11) that is connected to a first silicon sheet (12). The silicon sheet (12) has pores (13) extending from a first main surface (14) of the silicon sheet (12) to the interior of the silicon sheet (12), preferably to a second main surface (15) of the silicon sheet (12). A catalyst layer (16) covers the surface of the pores at least in part.
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公开(公告)号:DE59705303D1
公开(公告)日:2001-12-13
申请号:DE59705303
申请日:1997-07-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SCHAEFER HERBERT , FRANOSCH MARTIN , STENGL REINHARD , LEHMANN VOLKER , REISINGER HANS , WENDT HERMANN
IPC: H01L21/02 , H01L21/033 , H01L21/308 , H01L21/311 , H01L21/3205
Abstract: PCT No. PCT/DE97/01408 Sec. 371 Date Feb. 9, 1999 Sec. 102(e) Date Feb. 9, 1999 PCT Filed Jul. 3, 1997 PCT Pub. No. WO98/07184 PCT Pub. Date Feb. 19, 1998For manufacturing a capacitor that is essentially suited for DRAM arrangements, column structures that form an electrode of the capacitor are etched upon employment of a statistical mask that is produced without lithographic steps by nucleus formation of Si/Ge and subsequent selective epitaxy. Structure sizes below 100 nm can be realized in the statistical mask. Surface enlargement factors up to 60 are thus achieved.
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