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124 records (took 0.025 seconds)

    22.
    发明专利
    未知

    公开(公告)号：DE102008005344A1

    公开(公告)日：2009-04-02

    申请号：DE102008005344

    申请日：2008-01-21

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： GROETSCH STEFAN ,  MARFELD JAN ,  SORG JOERG ERICH ,  ENGL MORITZ ,  KOEHLER STEFFEN

    IPC: H01L33/00

    Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

    23.
    发明专利
    未知

    公开(公告)号：DE102007041136A1

    公开(公告)日：2009-03-05

    申请号：DE102007041136

    申请日：2007-08-30

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： KOEHLER STEFFEN ,  GROETSCH STEFAN ,  BRUNNER HERBERT ,  HUBER RAINER

    IPC: H01L33/00

    Abstract: An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways.

    25.
    发明专利
    未知

    公开(公告)号：DE10040450B4

    公开(公告)日：2008-07-10

    申请号：DE10040450

    申请日：2000-08-18

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： GROETSCH STEFAN ,  ACKLIN BRUNO

    IPC: H01S5/024 ,  H01L21/301 ,  H01L21/48 ,  H01L23/36 ,  H01S5/022

    Abstract: A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.

    26.
    发明专利
    未知

    公开(公告)号：DE102005031336B4

    公开(公告)日：2008-01-31

    申请号：DE102005031336

    申请日：2005-07-05

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： KROMOTIS PATRICK ,  ENGL MORITZ ,  KUHN GERHARD ,  WANNINGER MARIO ,  GROETSCH STEFAN ,  BOGNER GEORG ,  HUETTNER JOSEF

    IPC: G03B21/14 ,  F21K2/00 ,  G02B27/18 ,  H01L33/58 ,  H01L33/60

    Abstract: A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size AM and a maximum acceptance angle α for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle &bgr;. At least one of the LED chips has a radiation decoupling area of the size AD. The relation 0.7·(AM·sin2(α))/(AD·sin2(&bgr;)·n2)≦̸N≦̸1.3·(AM·sin2(α))/(AD·sin2(&bgr;)·n2) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.

    29.
    发明专利
    未知

    公开(公告)号：DE10319274A1

    公开(公告)日：2004-12-02

    申请号：DE10319274

    申请日：2003-04-29

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  GROETSCH STEFAN

    IPC: H01L33/58 ,  H01L33/00

    Abstract: A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.

    LENS ARRANGEMENT UND LED DISPLAY DEVICE
    30.
    发明申请
    LENS ARRANGEMENT UND LED DISPLAY DEVICE 审中-公开
    透镜系统和LED显示设备

    公开(公告)号：WO2008080390A3

    公开(公告)日：2008-09-25

    申请号：PCT/DE2007002321

    申请日：2007-12-21

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  GROETSCH STEFAN ,  ENGL MORITZ ,  KOEHLER STEFFEN ,  BLUEMEL SIMON ,  HIEGLER MICHAEL ,  ZEILER THOMAS

    Inventor： GROETSCH STEFAN ,  ENGL MORITZ ,  KOEHLER STEFFEN ,  BLUEMEL SIMON ,  HIEGLER MICHAEL ,  ZEILER THOMAS

    IPC: G02B7/02 ,  H01L33/58

    CPC classification number: G02B7/028 ,  H01L33/58

    Abstract: A lens arrangement (6) for an LED display device (2) comprises a lens (8). The lens (8) has a first lens surface, and an optical axis. The optical axis penetrates the first lens surface of the lens (8). The lens arrangement (6) further comprises a transparent transitional body (10), which is firmly coupled to the lens (8) on the first lens surface, which is more temperature-resistant than the lens (8), and which has an optical axis that is parallel to the optical axis of the lens (8).

    Abstract translation: 用于LED显示装置（2）的透镜装置（6）包括透镜（8）。 所述透镜（8）具有第一透镜表面和光轴。 光轴穿过透镜（8）的第一透镜表面。 此外，透镜装置（6）包括被固定到第一透镜表面和（8）被耦合在所述透镜的透明的过渡体（10），它是温度比透镜（8），并具有光轴，所述光学平行于耐 是透镜（8）的轴线。

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