Abstract:
A lens arrangement (6) for an LED display device (2) comprises a lens (8). The lens (8) has a first lens surface, and an optical axis. The optical axis penetrates the first lens surface of the lens (8). The lens arrangement (6) further comprises a transparent transitional body (10), which is firmly coupled to the lens (8) on the first lens surface, which is more temperature-resistant than the lens (8), and which has an optical axis that is parallel to the optical axis of the lens (8).
Abstract:
The invention relates to a radiation-emitting component (8), which comprises a semiconductor layer stack (10) having an active region (12), which is configured for emitting electromagnetic radiation (R), and at least one surface (14, 15, 16, 17) of the semiconductor layer stack (10) or an optical element (18, 20), which is configured for transmitting the electromagnetic radiation (R), wherein the surface (14, 15, 16, 17) has a normal vector (N), wherein on the at least one surface (14, 15, 16, 17) of the semiconductor layer stack (10) or of the optical element (18, 20), the electromagnetic radiation (R) penetrating said surface, an anti-reflection layer (30) is disposed and configured such that it has minimum reflection for a predetermined wavelength at an observation angle (alpha) relative to the normal vector (N) of the surface (14, 15, 16, 17), at which angle the increase in a zonal light flux of the electromagnetic radiation (R) approximately has a maximum.
Abstract:
The invention relates to a chip assembly for an optoelectronic component, comprising at least one semiconductor chip (1) emitting electromagnetic radiation and a connecting assembly, said connecting assembly (2) having a plurality of planes (3, 4) that are electrically insulated from each other.
Abstract:
The luminescent diode module has a luminescent diode chip (1), which produces light during operation. A light sensor (2) detects light incident on it during operation. A light conductor (3) guides the light produced by the luminescent diode chip to the light sensor. The luminescent diode chip and light sensor are arranged on a module support (8).
Abstract:
The device has a device holder (1) and an opto-electronic component (2) i.e. LED, with a housing body. A semiconductor chip is provided for generating radiation, and a set of electrical connections (5) is used for operating the semiconductor chip. The chip is arranged within the housing body with a housing base (3). The housing base has a set of connecting components (4) for providing detachable mechanical connections. The base includes a heat deriving element, and the detachable connections are in screw connection with a stopper, where the screw connection is a bayonet joint. An independent claim is also included for a method for utilizing an opto-electronic component.
Abstract:
The lens arrangement (6) has a lens (8) with a lens surface and an optical axis, which penetrates the lens surface of the lens. The lens arrangement has a transparent transitional body (10), which is firmly coupled to the lens on the lens surface, which is more temperature-resistant than the lens, and which has an optical axis that is parallel to the optical axis of the lens. An independent claim is also included for a light emitting diode display device with a housing and an opening.
Abstract:
According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.
Abstract:
A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.
Abstract:
An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways.