Abstract:
A suspension arm (125) for a head (120) of a disk storage device comprises at least one wall (225, 230) substantially perpendicular to the disk (105) and having a portion (238, 239) which is deformable parallel to a plane extending through a longitudinal axis (235) of the suspension arm (125) and perpendicular to the at least one wall (225, 230), and piezoelectric means (240, 255) which can deform the portion (238, 239) in order correspondingly to move the head (120), the piezoelectric means (240-255) being fixed to the deformable portion (238, 239) of the at least one wall (225, 230).
Abstract:
A sensor (100) with a movable microstructure comprises a sensitive element (105), formed in a first chip (110) of semiconductor material, for producing an electrical signal dependent on a movement of at least one movable microstructure relative to a surface of the first chip (110), the sensitive element (105) being enclosed in a hollow hermetic structure (115), and a circuitry (130) for processing said electrical signal, formed in a second chip (125) of semiconductor material, the hollow hermetic structure (115) including a metal wall (120) disposed on the surface of the first chip (110) around the sensitive element (105), and the second chip (125) being fixed to said wall (120).
Abstract:
The bi-dimensional position sensor (1) can be advantageously used in the turn system controlled from the steering wheel of a vehicle and comprises a permanent magnet (3) fixed to a control lever (4) so as to move in a plane along a first (X) and a second (Y) direction and rotate about a third direction (W) orthogonal to the preceding ones. The permanent magnet is movable with respect to an integrated device comprising a first group of sensor elements (10 1 -10 3 ) arranged spaced along the first direction, a second group of sensor elements (10 4 -10 7 ) arranged spaced along the second direction and a third group of sensor elements (10 8 -10 9 ) detecting the angular position of the permanent magnet. Electronics integrated with the sensor elements generate a code associated with each position which the permanent magnet (3) may assume and a control signal (S) corresponding to the desired function.
Abstract:
The method of testing a DMOS power transistor (2) comprises the phases of: arranging a switch (4) between the low-voltage circuitry (3) and the gate terminal (G) of the DMOS power transistor (2); maintaining the switch (4) in an open condition; applying a stress voltage to the gate terminal (G); testing the functionality of the DMOS power transistor (2); and, if the test has a positive outcome, short-circuiting the switch (3) through zapping.
Abstract:
In a micro-electromechanical structure, in particular an accelerometer (1;30;60), a movable mass or rotor (4;34;61) has a centroidal axis (G;G') and includes a suspended structure (8;38;62) which carries mobile electrodes (10;40). A stator (5;35;77) carries fixed electrodes (12;42) facing the mobile electrodes. The suspended structure (4;34;61) is connected to a rotor-anchoring region (16;44) via elastic elements (15;45;65). The stator includes at least one stator element (20;55;67),which carries a plurality of fixed electrodes (12;42) and is fixed to a stator-anchoring region (21;54). One of the rotor-anchoring regions and stator-anchoring regions extends along the centroidal axis (G;G') which is an axis perpendicular to the plane of the structure, through its centre of gravity, and at least another of the rotor-anchoring regions and stator-anchoring regions extends in the proximity of the centroidal axis (G;G'). Due to the small distance of all anchoring regions to each other, and to the centre of gravity, stresses due to thermal mismatches can be reduced.
Abstract:
An assembly structure (10) for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die (1) having a plurality of contact pads (2) associated with said integrated circuit and connected electrically to respective rheophores (5) of said structure, wherein a shield element (4) is coupled thermally to said die (1) by a layer (3) of an adhesive material.