公开(公告)号：JP2012134224A

公开(公告)日：2012-07-12

申请号：JP2010283149

申请日：2010-12-20

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KINUGASA NORIAKI ,  KONISHI ATSUSHI ,  OGAWA MASAISA

IPC: H05K1/18

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078

Abstract: PROBLEM TO BE SOLVED: To provide a structure of attaching an electronic component to a board which allows for attachment of the electronic component having a round contour to the board at a predetermined position while keeping a predetermined margin of a lead.SOLUTION: An electronic component 11 is attached to a board 30 by inserting a lead 12 of the electronic component 11 into a lead hole 31 of the board 30. The lead 12 has a proximal part 16 extending from an electronic component body 13, a support 17 which is bent from the proximal part 16 and abuts against an electronic component attachment surface 30A of the board 30 over a predetermined length thus supporting the electronic component body 13, and an insertion part 18 which is bent from the support 17 and inserted into the lead hole 31 of the board 30.

Abstract translation: 要解决的问题：提供一种将电子部件附接到板的结构，其允许在保持预定的引线边缘的同时将具有圆形轮廓的电子部件连接到板上的预定位置。 解决方案：电子部件11通过将电子部件11的引线12插入到板30的引线孔31中而附接到板30。引线12具有从电子部件主体13延伸的近端部16 ，从基部部分16弯曲并与基板30的电子部件安装面30A邻接预定长度，从而支撑电子部件主体13的支撑体17以及从支撑体17弯曲的插入部18， 插入板30的导孔31中。版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012156371A

公开(公告)日：2012-08-16

申请号：JP2011015350

申请日：2011-01-27

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： MATSUOKA TORU ,  SAITO YASUHISA ,  HAMADA KENJI

IPC: H05K1/14 ,  G11B21/02 ,  G11B21/21 ,  H05K3/36

CPC classification number: G11B5/4846 ,  G11B5/5569 ,  H05K3/323 ,  H05K2201/1078 ,  H05K2201/10818

Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board capable of enhancing electrical and mechanical connection reliability, a head stack assembly equipped with the connection structure of a printed wiring board, a magnetic disc device equipped with the head stack assembly, and a method of manufacturing the connection structure of a printed wiring board.SOLUTION: A connection structure 1000 of a printed wiring board comprises a first printed wiring board 321 equipped with a flying lead F, a second printed wiring board 333 equipped with an exposed lead E receiving the flying lead F, and an anisotropic conductive material 500 which connects the flying lead F and the exposed lead E. The flying lead F is configured to be bent to the second printed wiring board 333 side so that both sides of a connection region S, being connected with the exposed lead E via the anisotropic conductive material 500, are lower than the connection region S.

Abstract translation: 要解决的问题：为了提供能够提高电气和机械连接可靠性的印刷线路板的连接结构，配备有印刷线路板的连接结构的磁头堆叠组件，配备有磁头的磁盘装置 堆叠组件，以及制造印刷电路板的连接结构的方法。 解决方案：印刷电路板的连接结构1000包括配备有飞行引线F的第一印刷线路板321，配备有接收飞行引线F的露出引线E的第二印刷线路板333以及各向异性导电 连接飞铅F和暴露的引线E的材料500.飞铅F被配置为弯曲到第二印刷线路板333侧，使得连接区域S的两侧经由暴露的引线E经由 各向异性导电材料500低于连接区域S.版权所有：（C）2012，JPO＆INPIT

公开(公告)号：EP1363362A1

公开(公告)日：2003-11-19

申请号：EP03006513.0

申请日：2003-03-22

Applicant: Hirschmann Austria GmbH

Inventor： Feder, Roland ,  Reiss, Thomas ,  Kreuter, Markus ,  Peter, Gerhard

IPC: H01R13/02

CPC classification number: H05K3/308 ,  H01R13/025 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/10356 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10833

Abstract: Flachbandkabel (1) mit mehreren parallel zueinander verlaufenden elektrischen Leitern (2), deren Leiterenden (4) zwecks Kontaktierung mit einem Kontaktpartner freilegbar sind, wobei erfindungsgemäß vorgesehen ist, daß das Leiterende (4) vor der Kontaktierung in eine der Form des Kontaktierungsbereiches des Kontaktpartners entsprechende Form umgeformt ist.

Abstract translation: 电缆（1）导体（4）的端部在接触之前重新成形。 它形成为与将进行连接的导体相同的形状。

公开(公告)号：EP0515090B1

公开(公告)日：1996-01-03

申请号：EP92304340.0

申请日：1992-05-14

Applicant: THE WHITAKER CORPORATION

Inventor： Adams, Barbara Ann ,  Allman, William Harrison ,  Conner, Troy Everette ,  Forker, Donald LeVan ,  Knittle, Edward John, Jr. ,  Sarver, Douglas Richard

IPC: H01R13/41 ,  H01R43/16 ,  H01R9/09

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49204

公开(公告)号：EP0515090A1

公开(公告)日：1992-11-25

申请号：EP92304340.0

申请日：1992-05-14

Applicant: THE WHITAKER CORPORATION

Inventor： Adams, Barbara Ann ,  Allman, William Harrison ,  Conner, Troy Everette ,  Forker, Donald LeVan ,  Knittle, Edward John, Jr. ,  Sarver, Douglas Richard

IPC: H01R13/41 ,  H01R43/16 ,  H01R9/09

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49204

Abstract: An electrical connector (20) includes a housing (22) and an array of terminal members (28) having posts (46) extending from the housing (22) and adapted for insertion into through-holes (72) of a circuit board (70). At least one board retention means (48) is formed on at least one of the posts (46) and is axially located a selected distance from the lower surface of the housing (22) to be within a corresponding through-hole (72) after insertion. The retention means is a swage defining wall engaging surfaces for engaging sidewalls of a respective through-hole (70) during mounting of the connector (20) to board (70). The swage (48) is formed such that the far side of the post (46) remains coplanar with the axially adjacent surfaces and a swage embossment extends laterally outwardly from at least the second side, the embossment being formed by the work end (84) of a tool (82) striking the third side at an angle.

Abstract translation: 电连接器（20）包括壳体（22）和端子构件阵列（28），其具有从壳体（22）延伸并且适于插入电路板（70）的通孔（72）中的柱 ）。 至少一个板保持装置（48）形成在至少一个柱（46）上，并且在从外壳（22）的下表面选定的距离上轴向定位在相应的通孔（72）之后，位于相应的通孔（72）内 插入。 保持装置是在将连接器（20）安装到板（70）期间，用于接合相应的通孔（70）的侧壁的一个挤压限定壁接合表面。 模具48形成为使得柱（46）的远侧与轴向相邻的表面保持共面，并且模具压花从至少第二侧横向向外延伸，压花由工作端（84）形成， 工具（82）以一定角度撞击第三侧。

公开(公告)号：EP3381245A1

公开(公告)日：2018-10-03

申请号：EP16810543.5

申请日：2016-11-22

Applicant: Mercury Systems, Inc.

Inventor： MCKENNEY, Darryl J. ,  METHRATTA, Absu ,  OUELLETTE, Erica

IPC: H05K1/11 ,  H01R12/00 ,  H05K3/30

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

公开(公告)号：EP0998723B1

公开(公告)日：2003-04-09

申请号：EP98947338.4

申请日：1998-07-25

Applicant: Wendisch, Karl-Heinz

Inventor： Wendisch, Karl-Heinz

IPC: G06K19/00

CPC classification number: G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2203/1446

Abstract: The invention concerns a module, in particular designed to be used in chip cards, consisting of a chip module including an integrated switching circuit and a transmission module comprising at least a transmitting element for data and/or energy transmission between the integrated switching circuit and an external appliance or vice-versa. The chip module and the transmission module each have contact elements used for their mutual electrical connection, the chip module (3) contact elements (11) and the transmission module (2) contact elements (7) being assembled by blocking the mutually corresponding contact elements (7, 11).

公开(公告)号：EP0924764A3

公开(公告)日：2000-03-08

申请号：EP98121912.4

申请日：1998-11-18

Applicant: Hitachi, Ltd. ,  Hitachi ULSI Systems Co.,Ltd.

Inventor： Azuma, Shuichiro ,  Okinaga, Takayuki ,  Emata, Takashi ,  Kudaishi, Tomoaki ,  Wada, Tamaki ,  Nishi, Kunihiko ,  Masuda, Masachika ,  Sugano, Toshio

IPC: H01L25/065 ,  H01L23/495

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

公开(公告)号：WO2012102091A1

公开(公告)日：2012-08-02

申请号：PCT/JP2012/050488

申请日：2012-01-12

Applicant: 住友電工プリントサーキット株式会社 ,  松岡 徹 ,  斉藤 康久 ,  濱田 健史

Inventor： 松岡　徹 ,  斉藤　康久 ,  濱田　健史

IPC: H05K1/14 ,  G11B5/60 ,  G11B21/21 ,  H05K3/36

CPC classification number: G11B5/4846 ,  G11B5/5569 ,  H05K3/323 ,  H05K2201/1078 ,  H05K2201/10818

Abstract: 電気的及び機械的な接続信頼性を向上させることができるプリント配線板の接続構造、該プリント配線板の接続構造を備えるヘッド・スタック・アセンブリ、該ヘッド・スタック・アセンブリを備える磁気ディスク装置及びプリント配線板の接続構造の製造方法の提供を課題とする。フライングリードＦを備える第１のプリント配線板３２１と、フライングリードＦを受ける露出リードＥを備える第２のプリント配線板３３３と、フライングリードＦと露出リードＥとを接続する異方性導電材料５００を備えるプリント配線板の接続構造１０００であって、フライングリードＦは、露出リードＥと異方性導電材料５００を介して接続される接続領域Ｓの両側が接続領域Ｓよりも低くなるように第２のプリント配線板３３３の側へ屈曲させた屈曲形状として構成してあるプリント配線板の接続構造である。

Abstract translation: 本发明的目的是提供一种能够改善电气和机械连接可靠性的印刷电路板连接结构，设置有印刷电路板连接结构的磁头堆叠组件，设置有磁头堆叠的磁盘 组装和制造印刷电路板连接结构的方法。 印刷电路板连接结构（1000）具有配备有飞行引线（F）的第一印刷电路板（321），配备有用于接收飞行引线的露出引线（E）的第二印刷电路板（333） （F）和用于连接飞行引线（F）和曝光引线（E）的各向异性导电材料（500）。 印刷电路板连接结构（1000）被构造为使得飞行引线（F）被制成朝向第二印刷电路板（333）侧弯曲的弯曲形状，使得连接部分 S），其中飞散引线（F）与各向异性导电材料（500）插入其间的曝光引线（E）连接将低于连接部分（S）。

公开(公告)号：WO2012069928A1

公开(公告)日：2012-05-31

申请号：PCT/IB2011/003125

申请日：2011-11-23

Applicant: FCI ,  DROESBEKE, Gert ,  YAHYA, Ould

Inventor： DROESBEKE, Gert ,  YAHYA, Ould

IPC: H05K3/30 ,  H05K3/32

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10878

Abstract: The present invention relates to a connector assembly comprising : a printed circuit board (PCB) having a through- hole; a connector mounted on a first surface of the PCB and having a mounting peg received in the through- hole. The connector assembly further comprises a locking member cooperating with the mounting peg thereby increasing the retention force of the peg in the through-hole.

Abstract translation: 本发明涉及一种连接器组件，包括：具有通孔的印刷电路板（PCB）; 连接器，其安装在PCB的第一表面上，并且具有容纳在通孔中的安装钉。 连接器组件还包括与安装钉配合的锁定构件，从而增加了钉在通孔中的保持力。