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公开(公告)号：WO2007150032A3
公开(公告)日：2008-04-24
申请号：PCT/US2007071905
申请日：2007-06-22
Applicant: TEXAS INSTRUMENTS INC , MATSUNAMI AKIRA
Inventor： MATSUNAMI AKIRA
IPC: H01L21/00
CPC classification number: H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48611 , H01L2224/48613 , H01L2224/48644 , H01L2224/48664 , H01L2224/48699 , H01L2224/48711 , H01L2224/48713 , H01L2224/48744 , H01L2224/48764 , H01L2224/48811 , H01L2224/48813 , H01L2224/48844 , H01L2224/48864 , H01L2224/85411 , H01L2224/85413 , H01L2224/85444 , H01L2224/85464 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/1301 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K3/3426 , H05K2201/10689 , H05K2201/10795 , H05K2201/10909 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A microelectronic device package (100) that includes a microelectronic device (106) encapsulated within a packaging material (102). The microelectronic device package also includes a lead (104) attached to a portion of the microelectronic device extending through the packaging material. The lead has a break portion and a non-break portion on a tip of the lead.
Abstract translation: 一种微电子器件封装（100），包括封装在封装材料（102）内的微电子器件（106）。 微电子器件封装还包括附接到延伸穿过包装材料的微电子器件的一部分的引线（104）。 引线在引线的尖端上具有断裂部分和非断裂部分。
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22.发明公开METHODS FOR CONNECTING A WIRE TO A FEEDTHROUGH PIN AND APPARATUS INCLUDING THE SAME 审中-公开用于将导线连接到馈送引脚和包括该引脚的设备的方法
公开(公告)号：EP3195707A1
公开(公告)日：2017-07-26
申请号：EP14758210.0
申请日：2014-08-12
Applicant: Advanced Bionics AG
Inventor： LI, Lin , XIE, Jian , WALTER, Jeryle
CPC classification number: H05K3/328 , A61N1/36036 , A61N1/3754 , H05K1/09 , H05K1/115 , H05K2201/09409 , H05K2201/09709 , H05K2201/1028 , H05K2201/10287 , H05K2201/10303 , H05K2201/10424 , H05K2201/10795 , H05K2201/10909 , H05K2201/10916 , H05K2203/0169 , H05K2203/0195 , Y10T29/49183
Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.
Abstract translation: 将导线（126）连接到馈通引脚（104）和包括连接到馈通引脚的导线的装置的方法。
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公开(公告)号：EP0209974A3
公开(公告)日：1988-08-31
申请号：EP86304130
申请日：1986-05-30
Applicant: AMP INCORPORATED (a New Jersey corporation)
Inventor： Johnescu, Douglas Michael , Johnson, Erlon Fitch
CPC classification number: H01R24/50 , H01R2103/00 , H05K3/308 , H05K2201/09809 , H05K2201/10424 , H05K2201/10568 , H05K2201/10795 , H05K2201/10863 , H05K2203/167
Abstract: An electrical connector 1 has a housing (2) with a base (3) for mounting on a printed circuit board (5), projecting mounting posts (6) extend from the base, a conductive outer shell (22) and a dielectric body (23) surrounded by the housing (2), a first conductive contact (25) has a first contact portion (48) projecting from the housing (2) for insertion into a corresponding aperture (55) of a printed circuit board (5), a second contact portion (33) projecting from the housing (2) for insertion into a corresponding aperture (7) of a printed circuit board (5), and each contact portion (33,48) has a taper (50) toward the free end and with an apex (51) of the taper (50) that intersects a longitudinal edge (52) of the corresponding contact portion (33,48) and is aligned with a center line (54) of a corresponding aperture (55) of a printed circuit board (5).
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公开(公告)号：EP0209974A2
公开(公告)日：1987-01-28
申请号：EP86304130.7
申请日：1986-05-30
Applicant: AMP INCORPORATED
Inventor： Johnescu, Douglas Michael , Johnson, Erlon Fitch
CPC classification number: H01R24/50 , H01R2103/00 , H05K3/308 , H05K2201/09809 , H05K2201/10424 , H05K2201/10568 , H05K2201/10795 , H05K2201/10863 , H05K2203/167
Abstract: An electrical connector 1 has a housing (2) with a base (3) for mounting on a printed circuit board (5), projecting mounting posts (6) extend from the base, a conductive outer shell (22) and a dielectric body (23) surrounded by the housing (2), a first conductive contact (25) has a first contact portion (48) projecting from the housing (2) for insertion into a corresponding aperture (55) of a printed circuit board (5), a second contact portion (33) projecting from the housing (2) for insertion into a corresponding aperture (7) of a printed circuit board (5), and each contact portion (33,48) has a taper (50) toward the free end and with an apex (51) of the taper (50) that intersects a longitudinal edge (52) of the corresponding contact portion (33,48) and is aligned with a center line (54) of a corresponding aperture (55) of a printed circuit board (5).
Abstract translation: 电连接器1具有壳体（2），其具有用于安装在印刷电路板（5）上的底座（3），突出的安装柱（6）从底座延伸，导电外壳（22）和电介质体 第一导电接触件（25）具有从壳体（2）伸出的第一接触部分（48），用于插入到印刷电路板（5）的相应的孔（55）中， 从所述壳体（2）突出以插入到印刷电路板（5）的对应的孔（7）中的第二接触部分（33），并且每个接触部分（33,48）具有朝向所述自由 并且具有与对应的接触部分（33,48）的纵向边缘（52）相交并且与对应的孔（55）的中心线（54）对准的锥体（50）的顶点（51） 印刷电路板（5）。
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25.发明授权公开(公告)号：US12074392B2
公开(公告)日：2024-08-27
申请号：US16768996
申请日：2019-10-18
Applicant: LG Chem, Ltd.
Inventor： Sang-Eun Jung
CPC classification number: H01R12/78 , H01M10/48 , H01R12/777 , H01R12/778 , H01R13/6683 , H01R43/205 , H05K1/0277 , H05K1/14 , H05K2201/10037 , H05K2201/10795
Abstract: A flexible printed circuit board (FPCB) assembly for a battery module includes a insulated flexible film and conductor patterns arranged inside the film in a predetermined form, and the conductor patterns transmit an electric signal. The FPCB assembly includes a main FPCB configured to extend in one direction; and a sub FPCB assembled to at least one side of the main FPCB and configured to extend in a direction different from the main FPCB.
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Patent Agency Ranking
公开(公告)号：US09949376B2
公开(公告)日：2018-04-17
申请号：US14563778
申请日：2014-12-08
Applicant: Second Sight Medical Products, Inc.
Inventor： Robert J Greenberg , Neil H Talbot , James S Little
IPC: A61N1/375 , A61N1/05 , A61N1/36 , A61N1/372 , H05K3/28 , H05K1/11 , H05K1/14 , A61B5/00 , A61B5/0478 , H05K1/18 , H01L23/055 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40
CPC classification number: H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
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公开(公告)号：US20170202092A1
公开(公告)日：2017-07-13
申请号：US15326635
申请日：2014-08-12
Applicant: Advanced Bionics AG
Inventor： Lin Li , Jian Xie , Jeryle Walter
CPC classification number: H05K3/328 , A61N1/36036 , A61N1/3754 , H05K1/09 , H05K1/115 , H05K2201/09409 , H05K2201/09709 , H05K2201/1028 , H05K2201/10287 , H05K2201/10303 , H05K2201/10424 , H05K2201/10795 , H05K2201/10909 , H05K2201/10916 , H05K2203/0169 , H05K2203/0195 , Y10T29/49183
Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.
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28.发明授权公开(公告)号：US09125313B2
公开(公告)日：2015-09-01
申请号：US14548805
申请日：2014-11-20
Applicant: Carmen Rapisarda
Inventor： Carmen Rapisarda
CPC classification number: H05K1/11 , H01R12/7076 , H05K1/0203 , H05K1/0271 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K3/325 , H05K2201/035 , H05K2201/10106 , H05K2201/10166 , H05K2201/10393 , H05K2201/10454 , H05K2201/10598 , H05K2201/10757 , H05K2201/1078 , H05K2201/10787 , H05K2201/10795 , Y02P70/611
Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。
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公开(公告)号：US20100236815A1
公开(公告)日：2010-09-23
申请号：US12727146
申请日：2010-03-18
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。
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30.发明授权Surface mounting discharge tube has soldering tapers formed at peripheral edges of electrode side surfaces that seal and project outwardly from opposite ends of cylindrical ceramic envelope 有权表面安装放电管具有形成在电极侧表面的周边边缘处的焊接锥形，其从圆柱形陶瓷封套的相对端向外密封并向外突出公开(公告)号：US07719174B2
公开(公告)日：2010-05-18
申请号：US11114190
申请日：2005-04-26
Applicant: Kazuhiko Machida , Kesayuki Takeuchi , Chisato Emori
Inventor： Kazuhiko Machida , Kesayuki Takeuchi , Chisato Emori
IPC: H01J17/26
CPC classification number: H01T4/12 , H01T1/00 , H05K3/3426 , H05K2201/10795 , Y02P70/613
Abstract: A surface mounting discharge tube, comprise of a cylindrical ceramic envelope sealed at its two ends by side surfaces of electrodes, designed to be directly soldered on to a mounting board, where the electrodes at the two ends are rectangular, project outward radially at the ends of the ceramic envelope and are provided at peripheral edges at the side surfaces of the electrodes with soldering use tapers or step differences, whereby positional deviation at the time of soldering is suppressed and sufficient PCT properties are secured.
Abstract translation: 表面安装放电管包括圆柱形陶瓷外壳，其两端由电极的侧表面密封，设计成直接焊接到安装板上，其中两端的电极为矩形，在端部径向向外突出 并且在电极的侧面的周边处设置有焊接使用锥度或阶差，由此抑制了焊接时的位置偏差并确保了足够的PCT性能。
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